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1. 发明授权

US06358124B1 Pad conditioner cleaning apparatus 有权
标题翻译：垫调节剂清洗装置
公开(公告)号：US06358124B1
公开(公告)日：2002-03-19
申请号：US09222180
申请日：1998-12-29
申请人： Raijiro Koga , Hiromi Tsuruta , Takashi Kumagai , Gee Hoey , Brian J. Brown , Boris Fishkin , Fred C. Redeker , Bruce Lu , Rex Lu , K. Y. Wang , Roland Shu
发明人： Raijiro Koga , Hiromi Tsuruta , Takashi Kumagai , Gee Hoey , Brian J. Brown , Boris Fishkin , Fred C. Redeker , Bruce Lu , Rex Lu , K. Y. Wang , Roland Shu
IPC分类号： B24B100
CPC分类号： B08B1/007 , B24B53/005 , B24B53/017 , H01L21/67051
摘要： A chemical mechanical polishing apparatus includes a pad conditioner having a conditioner head, a cleaning cup for receiving and cleaning the conditioner head of the pad conditioner, and a fluid dispenser for dispensing a cleaning fluid onto the conditioner head.
摘要翻译：化学机械抛光装置包括具有调节头的垫调节器，用于接收和清洁垫调节器的调节头的清洁杯，以及用于将清洁流体分配到调节头上的流体分配器。

2. 发明授权

US06217430B1 Pad conditioner cleaning apparatus 有权
标题翻译：垫调节剂清洗装置
公开(公告)号：US06217430B1
公开(公告)日：2001-04-17
申请号：US09184786
申请日：1998-11-02
申请人： Raijiro Koga , Hiromi Tsuruta , Takashi Kumagai , Gee Hoey , Brian J. Brown , Boris Fishkin , Fred C. Redeker
发明人： Raijiro Koga , Hiromi Tsuruta , Takashi Kumagai , Gee Hoey , Brian J. Brown , Boris Fishkin , Fred C. Redeker
IPC分类号： B24B2118
CPC分类号： H01L21/67051 , B08B1/007 , B24B53/005 , B24B53/017
摘要： A cleaning cup for holding and cleaning a pad conditioner having a conditioner head, the cleaning cup includes a spray nozzle for spraying a cleaning solution on a top side of the conditioner head. The cleaning cup further includes a plurality of support pins extending upwards from a base of the cleaning cup to receive the conditioner head thereon.
摘要翻译：一种用于保持和清洁具有调节头的垫调节器的清洁杯，所述清洁杯包括用于在所述调理头的顶侧上喷射清洁溶液的喷嘴。清洁杯还包括从清洁杯的底部向上延伸的多个支撑销，以在其上接收调节头。

3. 发明授权

US06797074B2 Wafer edge cleaning method and apparatus 失效
标题翻译：晶圆边缘清洗方法及装置
公开(公告)号：US06797074B2
公开(公告)日：2004-09-28
申请号：US10278115
申请日：2002-10-22
申请人： Fred C. Redeker , Brian J. Brown , Michael Sugarman
发明人： Fred C. Redeker , Brian J. Brown , Michael Sugarman
IPC分类号： B08B704
CPC分类号： H01L21/02052 , B08B3/02 , B08B3/12 , H01L21/67051 , H01L21/67086 , Y10S134/902
摘要： A method and apparatus is provided for removing material from the edge of a disk. In one embodiment, the edge of the disk is contacted with etchant via an etchant containing swab or trough (which may contain one or more transducers) and is rotated such that successive portions of the disk edge are scanned through the trough or past the swab. To prevent etchant from contacting the major surface of the substrate, and/or to prevent excessive etching, the edge of the disk is contacted with a rinsing fluid (e.g., a rinsing fluid nozzle or a trough filled with rinsing fluid). In a further embodiment material such as residue or particles may be removed via a trough containing sonically energized rinsing fluid.
摘要翻译：提供了一种从盘的边缘去除材料的方法和装置。在一个实施例中，盘的边缘通过含有拭子或槽（其可以包含一个或多个换能器）的蚀刻剂与蚀刻剂接触，并且被旋转使得盘边缘的连续部分通过槽扫过或通过拭子。为了防止蚀刻剂接触基板的主表面和/或防止过度蚀刻，盘的边缘与冲洗流体（例如，冲洗流体喷嘴或填充有冲洗流体的槽）接触。在另一个实施方案中，可以通过含有声波激发的冲洗流体的槽来去除诸如残余物或颗粒的材料。

4. 发明授权

US06855043B1 Carrier head with a modified flexible membrane 有权
标题翻译：带有改性柔性膜的载体头
公开(公告)号：US06855043B1
公开(公告)日：2005-02-15
申请号：US09611247
申请日：2000-07-07
申请人： Jianshe Tang , Brian J. Brown , Charles C. Garretson , Benjamin A. Bonner , Thomas H. Osterheld , Fred C. Redeker
发明人： Jianshe Tang , Brian J. Brown , Charles C. Garretson , Benjamin A. Bonner , Thomas H. Osterheld , Fred C. Redeker
IPC分类号： B24B37/30 , B24B37/32 , H01L21/304 , B24B47/02
CPC分类号： B24B37/30 , B24B37/32
摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate and a retaining ring. The friction coefficient of the lower surface of the flexible membrane is increased to prevent contact between the substrate and the retaining ring, thereby preventing slurry compaction and buildup and substrate deformation caused by such contact.
摘要翻译：用于化学机械抛光装置的载体头包括向基材和保持环施加载荷的柔性膜。增加柔性膜的下表面的摩擦系数，以防止基板与保持环之间的接触，从而防止由此引起的浆料压实和堆积以及基板变形。

5. 发明授权

US06523553B1 Wafer edge cleaning method and apparatus 有权
公开(公告)号：US06523553B1
公开(公告)日：2003-02-25
申请号：US09281618
申请日：1999-03-30
申请人： Fred C. Redeker , Brian J. Brown , Michael Sugarman
发明人： Fred C. Redeker , Brian J. Brown , Michael Sugarman
IPC分类号： B08B304
CPC分类号： H01L21/02052 , B08B3/02 , B08B3/12 , H01L21/67051 , H01L21/67086 , Y10S134/902
摘要： A method and apparatus is provided for removing material from the edge of a disk. In one embodiment, the edge of the disk is contacted with etchant via an etchant containing swab or trough (which may contain one or more transducers) and is rotated such that successive portions of the disk edge are scanned through the trough or past the swab. To prevent etchant from contacting the major surface of the substrate, and/or to prevent excessive etching, the edge of the disk is contacted with a rinsing fluid (e.g., a rinsing fluid nozzle or a trough filled with rinsing fluid). In a further embodiment material such as residue or particles may be removed via a trough containing sonically energized rinsing fluid.

6. 发明授权

US06921494B2 Backside etching in a scrubber 失效
标题翻译：洗涤器中的背面蚀刻
公开(公告)号：US06921494B2
公开(公告)日：2005-07-26
申请号：US10456723
申请日：2003-06-06
申请人： Brian J. Brown , Madhavi Chandrachood , Radha Nayak , Fred C. Redeker , Michael Sugarman , John M. White
发明人： Brian J. Brown , Madhavi Chandrachood , Radha Nayak , Fred C. Redeker , Michael Sugarman , John M. White
IPC分类号： B08B1/04 , B08B3/02 , B08B3/08 , B08B7/04 , H01L21/00 , H01L21/304 , H01L21/306 , B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00
CPC分类号： H01L21/6708 , H01L21/67075 , Y10S134/902
摘要： A scrubber device is provided. The scrubber device may etch a backside of a wafer and may clean a frontside of the wafer simultaneously. The scrubber device may comprise a programmed controller adapted to supply a non-etching fluid to a frontside of the wafer whenever an etching fluid is supplied to the backside of the wafer.
摘要翻译：提供洗涤器装置。洗涤器装置可以蚀刻晶片的背面并且可以同时清洁晶片的前侧。洗涤器装置可以包括编程控制器，其适用于每当将蚀刻流体供应到晶片的背面时，将非蚀刻流体提供给晶片的前侧。

7. 发明授权

US06572453B1 Multi-fluid polishing process 失效
标题翻译：多流体抛光工艺
公开(公告)号：US06572453B1
公开(公告)日：2003-06-03
申请号：US09575218
申请日：2000-05-18
申请人： Kapila Wijekoon , Stan D. Tsai , Yuchun Wang , Doyle E. Bennett , Fred C. Redeker , Madhavi Chandrachood , Brian J. Brown
发明人： Kapila Wijekoon , Stan D. Tsai , Yuchun Wang , Doyle E. Bennett , Fred C. Redeker , Madhavi Chandrachood , Brian J. Brown
IPC分类号： B24B100
CPC分类号： B24B37/04 , B08B1/04 , B24B57/02 , C11D7/06 , C11D7/08 , C11D7/265 , C11D7/3209 , C11D11/0047 , H01L21/3212
摘要： A polishing method is provided which simultaneously supplies both a polishing fluid and a conditioning fluid to a polishing pad, while a substrate is in moving contact with the polishing pad.
摘要翻译：提供了一种抛光方法，其同时将抛光液和调理流体同时供应到抛光垫，同时衬底与抛光垫移动接触。

8. 发明授权

US08671959B2 Method and apparatus for cleaning a substrate using non-newtonian fluids 有权
标题翻译：使用非牛顿流体清洗基材的方法和设备
公开(公告)号：US08671959B2
公开(公告)日：2014-03-18
申请号：US13252859
申请日：2011-10-04
申请人： John M. de Larios , Mike Ravkin , Jeffrey Farber , Mikhail Korolik , Fred C. Redeker
发明人： John M. de Larios , Mike Ravkin , Jeffrey Farber , Mikhail Korolik , Fred C. Redeker
IPC分类号： B08B3/00
CPC分类号： H01L21/67057 , B08B3/003 , B08B7/0014 , C11D7/5004 , C11D11/0047 , H01L21/02057 , H01L21/67051 , Y10S134/902
摘要： An apparatus for cleaning a substrate includes an application unit having a top inlet conduit and a bottom plate section. The top inlet conduit has an opening for receiving a non-Newtonian fluid and the bottom plate section has an opening through which the non-Newtonian fluid can flow. The bottom plate section is perpendicular to the top inlet conduit, and a surface of the bottom plate section is disposed above and parallel to a surface of a substrate so as to define a gap between the surface of the bottom plate section and the surface of the substrate. The defined gap has a height configured to create a flow of the non-Newtonian fluid in which a portion of the flow exhibits plug flow, and the plug flow moves over the surface of the substrate to remove particles from the surface of the substrate.
摘要翻译：用于清洁基板的装置包括具有顶部入口导管和底板部分的施加单元。顶部入口导管具有用于接收非牛顿流体的开口，底板部分具有非牛顿流体可以流过的开口。底板部分垂直于顶部入口导管，并且底板部分的表面设置在基板的表面上方并平行于基板的表面，以便限定底板部分的表面与底板部分的表面之间的间隙基质。限定的间隙具有构造成产生非牛顿流体的流动的高度，其中流体的一部分显示出塞子流动，并且塞子流动在衬底的表面上移动以从衬底的表面移除颗粒。

9. 发明授权

US08555903B2 Method and apparatus for removing contamination from substrate 失效
标题翻译：去除基材污染的方法和装置
公开(公告)号：US08555903B2
公开(公告)日：2013-10-15
申请号：US12620288
申请日：2009-11-17
申请人： Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker , Clint Thomas , John Parks
发明人： Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker , Clint Thomas , John Parks
IPC分类号： B08B3/00
CPC分类号： H01L21/02057 , B05D3/10 , B08B7/02 , C11D1/04 , C11D3/042 , C11D3/044 , C11D3/18 , C11D3/2079 , C11D3/222 , C11D3/225 , C11D3/3765 , C11D9/00 , C11D9/02 , C11D9/267 , C11D11/0047 , C11D17/0004 , C11D17/0013 , C11D17/0017 , C11D17/003 , C11D17/041 , C23G1/00 , C23G1/18 , G03F7/42 , G03F7/423 , H01L21/02052 , H01L21/02096 , H01L21/31133 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086
摘要： A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.
摘要翻译：清洁材料设置在基板上。清洁材料包括分散在液体介质中的固体组分。将力施加到液体介质中的固体组分以使固体组分接近存在于基底上的污染物。施加到固体组分的力可以通过液体介质中的不混溶组分施加。当固体组分被充分接近污染物时，在固体组分和污染物之间建立了相互作用。然后，将固体组分从衬底移开，使得与固体组分相互作用的污染物从衬底上除去。

10. 发明授权

US08522801B2 Method and apparatus for cleaning a semiconductor substrate 有权
标题翻译：用于清洁半导体衬底的方法和设备
公开(公告)号：US08522801B2
公开(公告)日：2013-09-03
申请号：US11612371
申请日：2006-12-18
申请人： Erik M. Freer , John M. deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
发明人： Erik M. Freer , John M. deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
IPC分类号： B08B3/00
CPC分类号： B08B7/00 , B08B3/00 , B08B7/02 , C11D9/02 , C11D11/0047 , C11D17/0017 , C23G1/18 , G03F7/423 , H01L21/02052 , H01L21/31133 , H01L21/67028 , H01L21/6708 , H01L21/67086
摘要： A method for cleaning a substrate is provided. The method initiates with disposing a fluid layer having solid components therein to a surface of the substrate. A shear force directed substantially parallel to the surface of the substrate and toward an outer edge of the substrate is then created. The shear force may result from a normal or tangential component of a force applied to a solid body in contact with the fluid layer in one embodiment. The surface of the substrate is rinsed to remove the fluid layer. A cleaning system and apparatus are also provided.
摘要翻译：提供一种清洗基板的方法。该方法通过将其中具有固体组分的流体层设置在基底的表面来启动。然后产生基本上平行于衬底的表面并朝向衬底的外边缘的剪切力。在一个实施例中，剪切力可以由施加到与流体层接触的固体的力的正常或切向分量产生。漂洗基材的表面以除去流体层。还提供清洁系统和装置。

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