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1. 发明授权

US06358124B1 Pad conditioner cleaning apparatus 有权
标题翻译：垫调节剂清洗装置
公开(公告)号：US06358124B1
公开(公告)日：2002-03-19
申请号：US09222180
申请日：1998-12-29
申请人： Raijiro Koga , Hiromi Tsuruta , Takashi Kumagai , Gee Hoey , Brian J. Brown , Boris Fishkin , Fred C. Redeker , Bruce Lu , Rex Lu , K. Y. Wang , Roland Shu
发明人： Raijiro Koga , Hiromi Tsuruta , Takashi Kumagai , Gee Hoey , Brian J. Brown , Boris Fishkin , Fred C. Redeker , Bruce Lu , Rex Lu , K. Y. Wang , Roland Shu
IPC分类号： B24B100
CPC分类号： B08B1/007 , B24B53/005 , B24B53/017 , H01L21/67051
摘要： A chemical mechanical polishing apparatus includes a pad conditioner having a conditioner head, a cleaning cup for receiving and cleaning the conditioner head of the pad conditioner, and a fluid dispenser for dispensing a cleaning fluid onto the conditioner head.
摘要翻译：化学机械抛光装置包括具有调节头的垫调节器，用于接收和清洁垫调节器的调节头的清洁杯，以及用于将清洁流体分配到调节头上的流体分配器。

2. 发明授权

US06217430B1 Pad conditioner cleaning apparatus 有权
标题翻译：垫调节剂清洗装置
公开(公告)号：US06217430B1
公开(公告)日：2001-04-17
申请号：US09184786
申请日：1998-11-02
申请人： Raijiro Koga , Hiromi Tsuruta , Takashi Kumagai , Gee Hoey , Brian J. Brown , Boris Fishkin , Fred C. Redeker
发明人： Raijiro Koga , Hiromi Tsuruta , Takashi Kumagai , Gee Hoey , Brian J. Brown , Boris Fishkin , Fred C. Redeker
IPC分类号： B24B2118
CPC分类号： H01L21/67051 , B08B1/007 , B24B53/005 , B24B53/017
摘要： A cleaning cup for holding and cleaning a pad conditioner having a conditioner head, the cleaning cup includes a spray nozzle for spraying a cleaning solution on a top side of the conditioner head. The cleaning cup further includes a plurality of support pins extending upwards from a base of the cleaning cup to receive the conditioner head thereon.
摘要翻译：一种用于保持和清洁具有调节头的垫调节器的清洁杯，所述清洁杯包括用于在所述调理头的顶侧上喷射清洁溶液的喷嘴。清洁杯还包括从清洁杯的底部向上延伸的多个支撑销，以在其上接收调节头。

3. 发明授权

US06855043B1 Carrier head with a modified flexible membrane 有权
标题翻译：带有改性柔性膜的载体头
公开(公告)号：US06855043B1
公开(公告)日：2005-02-15
申请号：US09611247
申请日：2000-07-07
申请人： Jianshe Tang , Brian J. Brown , Charles C. Garretson , Benjamin A. Bonner , Thomas H. Osterheld , Fred C. Redeker
发明人： Jianshe Tang , Brian J. Brown , Charles C. Garretson , Benjamin A. Bonner , Thomas H. Osterheld , Fred C. Redeker
IPC分类号： B24B37/30 , B24B37/32 , H01L21/304 , B24B47/02
CPC分类号： B24B37/30 , B24B37/32
摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate and a retaining ring. The friction coefficient of the lower surface of the flexible membrane is increased to prevent contact between the substrate and the retaining ring, thereby preventing slurry compaction and buildup and substrate deformation caused by such contact.
摘要翻译：用于化学机械抛光装置的载体头包括向基材和保持环施加载荷的柔性膜。增加柔性膜的下表面的摩擦系数，以防止基板与保持环之间的接触，从而防止由此引起的浆料压实和堆积以及基板变形。

4. 发明授权

US06523553B1 Wafer edge cleaning method and apparatus 有权
公开(公告)号：US06523553B1
公开(公告)日：2003-02-25
申请号：US09281618
申请日：1999-03-30
申请人： Fred C. Redeker , Brian J. Brown , Michael Sugarman
发明人： Fred C. Redeker , Brian J. Brown , Michael Sugarman
IPC分类号： B08B304
CPC分类号： H01L21/02052 , B08B3/02 , B08B3/12 , H01L21/67051 , H01L21/67086 , Y10S134/902
摘要： A method and apparatus is provided for removing material from the edge of a disk. In one embodiment, the edge of the disk is contacted with etchant via an etchant containing swab or trough (which may contain one or more transducers) and is rotated such that successive portions of the disk edge are scanned through the trough or past the swab. To prevent etchant from contacting the major surface of the substrate, and/or to prevent excessive etching, the edge of the disk is contacted with a rinsing fluid (e.g., a rinsing fluid nozzle or a trough filled with rinsing fluid). In a further embodiment material such as residue or particles may be removed via a trough containing sonically energized rinsing fluid.

5. 发明授权

US06797074B2 Wafer edge cleaning method and apparatus 失效
标题翻译：晶圆边缘清洗方法及装置
公开(公告)号：US06797074B2
公开(公告)日：2004-09-28
申请号：US10278115
申请日：2002-10-22
申请人： Fred C. Redeker , Brian J. Brown , Michael Sugarman
发明人： Fred C. Redeker , Brian J. Brown , Michael Sugarman
IPC分类号： B08B704
CPC分类号： H01L21/02052 , B08B3/02 , B08B3/12 , H01L21/67051 , H01L21/67086 , Y10S134/902
摘要： A method and apparatus is provided for removing material from the edge of a disk. In one embodiment, the edge of the disk is contacted with etchant via an etchant containing swab or trough (which may contain one or more transducers) and is rotated such that successive portions of the disk edge are scanned through the trough or past the swab. To prevent etchant from contacting the major surface of the substrate, and/or to prevent excessive etching, the edge of the disk is contacted with a rinsing fluid (e.g., a rinsing fluid nozzle or a trough filled with rinsing fluid). In a further embodiment material such as residue or particles may be removed via a trough containing sonically energized rinsing fluid.
摘要翻译：提供了一种从盘的边缘去除材料的方法和装置。在一个实施例中，盘的边缘通过含有拭子或槽（其可以包含一个或多个换能器）的蚀刻剂与蚀刻剂接触，并且被旋转使得盘边缘的连续部分通过槽扫过或通过拭子。为了防止蚀刻剂接触基板的主表面和/或防止过度蚀刻，盘的边缘与冲洗流体（例如，冲洗流体喷嘴或填充有冲洗流体的槽）接触。在另一个实施方案中，可以通过含有声波激发的冲洗流体的槽来去除诸如残余物或颗粒的材料。

6. 发明授权

US06921494B2 Backside etching in a scrubber 失效
标题翻译：洗涤器中的背面蚀刻
公开(公告)号：US06921494B2
公开(公告)日：2005-07-26
申请号：US10456723
申请日：2003-06-06
申请人： Brian J. Brown , Madhavi Chandrachood , Radha Nayak , Fred C. Redeker , Michael Sugarman , John M. White
发明人： Brian J. Brown , Madhavi Chandrachood , Radha Nayak , Fred C. Redeker , Michael Sugarman , John M. White
IPC分类号： B08B1/04 , B08B3/02 , B08B3/08 , B08B7/04 , H01L21/00 , H01L21/304 , H01L21/306 , B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00
CPC分类号： H01L21/6708 , H01L21/67075 , Y10S134/902
摘要： A scrubber device is provided. The scrubber device may etch a backside of a wafer and may clean a frontside of the wafer simultaneously. The scrubber device may comprise a programmed controller adapted to supply a non-etching fluid to a frontside of the wafer whenever an etching fluid is supplied to the backside of the wafer.
摘要翻译：提供洗涤器装置。洗涤器装置可以蚀刻晶片的背面并且可以同时清洁晶片的前侧。洗涤器装置可以包括编程控制器，其适用于每当将蚀刻流体供应到晶片的背面时，将非蚀刻流体提供给晶片的前侧。

7. 发明授权

US06572453B1 Multi-fluid polishing process 失效
标题翻译：多流体抛光工艺
公开(公告)号：US06572453B1
公开(公告)日：2003-06-03
申请号：US09575218
申请日：2000-05-18
申请人： Kapila Wijekoon , Stan D. Tsai , Yuchun Wang , Doyle E. Bennett , Fred C. Redeker , Madhavi Chandrachood , Brian J. Brown
发明人： Kapila Wijekoon , Stan D. Tsai , Yuchun Wang , Doyle E. Bennett , Fred C. Redeker , Madhavi Chandrachood , Brian J. Brown
IPC分类号： B24B100
CPC分类号： B24B37/04 , B08B1/04 , B24B57/02 , C11D7/06 , C11D7/08 , C11D7/265 , C11D7/3209 , C11D11/0047 , H01L21/3212
摘要： A polishing method is provided which simultaneously supplies both a polishing fluid and a conditioning fluid to a polishing pad, while a substrate is in moving contact with the polishing pad.
摘要翻译：提供了一种抛光方法，其同时将抛光液和调理流体同时供应到抛光垫，同时衬底与抛光垫移动接触。

8. 发明授权

US06464799B1 Method for managing a fluid level associated with a substrate processing tank 失效
标题翻译：用于管理与衬底处理槽相关联的液面的方法
公开(公告)号：US06464799B1
公开(公告)日：2002-10-15
申请号：US09580881
申请日：2000-05-30
申请人： Alexander Lerner , Brian J. Brown , Boris Fishkin , Jonathan S. Frankel
发明人： Alexander Lerner , Brian J. Brown , Boris Fishkin , Jonathan S. Frankel
IPC分类号： B08B310
CPC分类号： B08B3/00 , B08B3/12 , G05D9/12 , G05D21/02 , G05D23/19 , G05D27/02 , H01L21/67253
摘要： An improved method and apparatus for adjusting chemistry concentrations and temperatures within a substrate processing tank is provided. A first aspect may include checking the fluid level within the tank, and, if the level is higher than a predetermined upper level, bleeding an amount of fluid from the tank; if the level is lower than a predetermined lower level, flowing an amount of fluid to the tank, and if the level is between the predetermined upper and lower levels, bleeding an amount of fluid from the tank and flowing an amount of fluid to the tank. A second aspect may include flowing water into the tank at a flow rate at least equivalent to the flow rate of water required to achieve a chemistry spike of a predetermined concentration and volume prior to beginning the flow of chemicals. A third aspect may include a method and apparatus for heating or cooling chemistry to a predetermined temperature as the chemistry is recirculated.
摘要翻译：提供了用于调整基板处理槽内的化学浓度和温度的改进方法和装置。第一方面可以包括检查罐内的液位，并且如果液位高于预定的上限，则从罐中排出一定量的流体; 如果水平低于预定的较低水平，则将一定量的流体流向罐，并且如果水平在预定的上下水平之间，则从罐中排出一定量的流体并将一定量的流体流向罐。第二方面可以包括以至少等于在开始化学品流动之前实现预定浓度和体积的化学峰值所需的水的流速至少等于流量的水流入罐中。第三方面可以包括当化学物质再循环时将化学物质加热或冷却至预定温度的方法和装置。

9. 发明授权

US06345630B2 Method and apparatus for cleaning the edge of a thin disc 失效
标题翻译：用于清洁薄盘边缘的方法和装置
公开(公告)号：US06345630B2
公开(公告)日：2002-02-12
申请号：US09738797
申请日：2000-12-15
申请人： Boris Fishkin , Jianshe Tang , Brian J. Brown
发明人： Boris Fishkin , Jianshe Tang , Brian J. Brown
IPC分类号： B08B310
CPC分类号： H01L21/67051 , H01L21/67046 , Y10S134/902
摘要： An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include deionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.
摘要翻译：提供了一种创新的边缘清洁装置，用于清洁边缘诸如半导体晶片的薄盘。本发明的边缘清洁装置具有定位成在薄盘的边缘表面处引导液体射流的声波喷嘴。优选地，声波喷嘴与薄盘的边缘径向间隔开，使得当由声波喷嘴清洁薄盘边缘时，可以在薄盘的主表面上同时进行洗涤，旋转漂洗或旋转清洁。液体射流可以包括去离子水，NH 4 OH，KOH，TMAH，HF，柠檬酸，表面活性剂或其他类似的清洁溶液，并且当薄盘旋转时喷嘴可以保持静止，或者喷嘴可以扫描薄盘的圆周以清洁薄片的整个边缘。

10. 发明授权

US06276371B1 Method and apparatus for cleaning the edge of a thin disc 有权
标题翻译：用于清洁薄盘边缘的方法和装置
公开(公告)号：US06276371B1
公开(公告)日：2001-08-21
申请号：US09589463
申请日：2000-06-07
申请人： Boris Fishkin , Brian J. Brown , Jianshe Tang
发明人： Boris Fishkin , Brian J. Brown , Jianshe Tang
IPC分类号： B08B312
CPC分类号： H01L21/67057 , Y10S134/902
摘要： A method and apparatus for cleaning wafer edges is provided. The inventive wafer cleaner employs a transducer equal in length to the diameter of a wafer to be cleaned, and positioned to direct sonic energy in line with the wafer's edge. Supporting and rotating mechanisms are positioned along the wafer's edge, outside of the transducer's high energy field, and preferably such that approximately 50 percent of the wafer is positioned between the wafer supports and the transducer. Therefore, minimal sonic energy is blocked from reaching the wafer's surface. The transducer dimensions relative to the wafer, and the positioning of the wafer supports relative to the transducer enable the system to achieve an approximately 50 percent edge cleaning duty cycle as the wafer is rotated.
摘要翻译：提供了一种用于清洁晶片边缘的方法和装置。本发明的晶片清洁器采用与要清洁的晶片的直径相等的换能器，并定位成引导与晶片边缘一致的声能。支撑和旋转机构沿着晶片的边缘定位在换能器的高能场外部，并且优选地使得大约50％的晶片位于晶片支架和换能器之间。因此，最小的声能被阻止到达晶片的表面。相对于晶片的换能器尺寸以及晶片支撑件相对于换能器的定位使得系统能够在晶片旋转时实现大约50％的边缘清洁占空比。

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