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    • 2. 发明申请
    • High-luminescence silicon electroluminescence device
    • 高发光硅电致发光器件
    • US20060189014A1
    • 2006-08-24
    • US11066713
    • 2005-02-24
    • Tingkai LiPooran JoshiWei GaoYoshi OnoSheng Hsu
    • Tingkai LiPooran JoshiWei GaoYoshi OnoSheng Hsu
    • H01L21/00
    • H01L31/03046Y02E10/544Y02P70/521
    • A method for forming a high-luminescence Si electroluminescence (EL) phosphor is provided, with an EL device made from the Si phosphor. The method comprises: depositing a silicon-rich oxide (SRO) film, with Si nanocrystals, having a refractive index in the range of 1.5 to 2.1, and a porosity in the range of 5 to 20%; and, post-annealing the SRO film in an oxygen atmosphere. DC-sputtering or PECVD processes can be used to deposit the SRO film. In one aspect the method further comprises: HF buffered oxide etching (BOE) the SRO film; and, re-oxidizing the SRO film, to form a SiO2 layer around the Si nanocrystals in the SRO film. In one aspect, the SRO film is re-oxidized by annealing in an oxygen atmosphere. In this manner, a layer of SiO2 is formed around the Si nanocrystals having a thickness in the range of 1 to 5 nanometers (nm).
    • 提供一种用于形成高发光Si电致发光(EL)荧光体的方法,其具有由Si荧光体制成的EL器件。 该方法包括:用Si纳米晶体沉积富含氧的氧化物(SRO)膜,折射率在1.5至2.1范围内,孔隙率在5至20%的范围内; 并且在氧气氛中对SRO膜进行后退火。 DC溅射或PECVD工艺可用于沉积SRO膜。 在一个方面,该方法还包括:HF缓冲氧化物蚀刻(BOE)SRO膜; 并且再次氧化SRO膜,以在SRO膜中的Si纳米晶体周围形成SiO 2层。 在一个方面,SRO膜通过在氧气气氛中退火再次氧化。 以这种方式,在具有1至5纳米(nm)范围内的厚度的Si纳米晶体周围形成SiO 2层。
    • 5. 发明授权
    • Electrode materials with improved hydrogen degradation resistance
    • 具有改善耐氢降解性的电极材料
    • US06833572B2
    • 2004-12-21
    • US10229603
    • 2002-08-27
    • Fengyan ZhangTingkai LiHong YingYoshi OnoSheng Teng Hsu
    • Fengyan ZhangTingkai LiHong YingYoshi OnoSheng Teng Hsu
    • H01L2976
    • H01L28/75H01L21/31604H01L21/31683H01L28/55
    • An electrode for use in a ferroelectric device includes a bottom electrode; a ferroelectric layer; and a top electrode formed on the ferroelectric layer and formed of a combination of metals, including a first metal take from the group of metals consisting of platinum and iridium, and a second metal taken from the group of metals consisting of aluminum and titanium; wherein the top electrode acts as a passivation layer and wherein the top electrode remains conductive following high temperature annealing in a hydrogen atmosphere. A method of forming a hydrogen-resistant electrode in a ferroelectric device includes forming a bottom electrode; forming a ferroelectric layer on the bottom electrode; depositing a top electrode on the ferroelectric layer; including depositing, simultaneously, a first metal taken from the group of metals consisting of platinum and iridium; and a second metal taken from the group of metals consisting of aluminum and titanium; and forming a passivation layer by annealing the structure in an oxygen atmosphere to form an oxide passivation layer on the top electrode.
    • 用于铁电体器件的电极包括底部电极; 铁电层 以及形成在强电介质层上并由金属组合形成的顶部电极,其包括从由铂和铱组成的金属组中的第一金属取得的金属和从由铝和钛组成的金属组中的第二金属; 其中所述顶部电极用作钝化层,并且其中所述顶部电极在氢气氛中的高温退火之后保持导电。 在铁电体器件中形成耐氢电极的方法包括形成底电极; 在底部电极上形成铁电层; 在铁电层上沉积顶部电极; 包括同时从由铂和铱组成的金属组中取出的第一金属; 和从由铝和钛组成的金属组中获取的第二金属; 以及通过在氧气氛中对所述结构退火以在所述顶部电极上形成氧化物钝化层来形成钝化层。
    • 7. 发明授权
    • Rare earth element-doped oxide precursor with silicon nanocrystals
    • 具有硅纳米晶体的稀土元素掺杂氧化物前体
    • US07585788B2
    • 2009-09-08
    • US11224549
    • 2005-09-12
    • Wei-Wei ZhuangYoshi OnoSheng Teng HsuTingkai Li
    • Wei-Wei ZhuangYoshi OnoSheng Teng HsuTingkai Li
    • H01L21/31
    • H01L21/02156H01L21/02282H01L21/316
    • A method is provided for forming a rare earth element-doped silicon oxide (SiO2) precursor with nanocrystalline (nc) Si particles. In one aspect the method comprises: mixing Si particles into a first organic solvent, forming a first solution with a first boiling point; filtering the first solution to remove large Si particles; mixing a second organic solvent having a second boiling point, higher than the first boiling point, to the filtered first solution; and, fractionally distilling, forming a second solution of nc Si particles. The Si particles are formed by immersing a Si wafer into a third solution including hydrofluoric (HF) acid and alcohol, applying an electric bias, and forming a porous Si layer overlying the Si wafer. Then, the Si particles are mixed into the organic solvent by depositing the Si wafer into the first organic solvent, and ultrasonically removing the porous Si layer from the Si wafer.
    • 提供了一种用于形成具有纳米晶体(nc)Si颗粒的稀土元素掺杂的氧化硅(SiO 2)前体的方法。 一方面,该方法包括:将Si颗粒混合到第一有机溶剂中,形成具有第一沸点的第一溶液; 过滤第一溶液以除去大的Si颗粒; 将具有高于第一沸​​点的第二沸点的第二有机溶剂与过滤的第一溶液混合; 并分馏,形成nc Si颗粒的第二溶液。 通过将Si晶片浸入包括氢氟酸(HF)酸和醇的第三溶液中,施加电偏压并形成覆盖Si晶片的多孔Si层,形成Si颗粒。 然后,通过将Si晶片沉积到第一有机溶剂中,将Si颗粒混入有机溶剂中,并从Si晶片超声波除去多孔Si层。
    • 9. 发明申请
    • Wide wavelength range silicon electroluminescence device
    • 宽波长范围的硅电致发光器件
    • US20060180816A1
    • 2006-08-17
    • US11058505
    • 2005-02-14
    • Tingkai LiWei GaoYoshi OnoSheng Hsu
    • Tingkai LiWei GaoYoshi OnoSheng Hsu
    • H01L29/26
    • H05B33/145
    • A method is provided for forming a Si electroluminescence (EL) device for emitting light at short wavelengths. The method comprises: providing a substrate; forming a first insulator layer overlying the substrate; forming a silicon-rich silicon oxide (SRSO) layer overlying the first insulator layer, embedded with nanocrystalline Si having a size in the range of 0.5 to 5 nm; forming a second insulator layer overlying the SRSO layer; and, forming a top electrode. Typically, the SRSO has a Si richness in the range of 5 to 40%. In one aspect, the SRSO layer is formed using a DC sputtering process. In another aspect, the SRSO formation step includes a rapid thermal annealing (RTA) process subsequent to depositing the SRSO. Likewise, thermal oxidation or plasma oxidation can be performed subsequent to the SRSO layer deposition. The size of Si nanocrystals is decreased in response to above-mentioned deposition, annealing, and oxidation processes.
    • 提供一种用于形成用于发射短波长的光的Si电致发光(EL)装置的方法。 该方法包括:提供衬底; 形成覆盖所述衬底的第一绝缘体层; 形成覆盖在第一绝缘体层上的富硅氧化物(SRSO)层,其中嵌入尺寸在0.5至5nm范围内的纳米晶体Si; 形成覆盖所述SRSO层的第二绝缘体层; 并形成顶部电极。 通常,SRSO的Si浓度范围为5〜40%。 在一个方面,使用DC溅射工艺形成SRSO层。 另一方面,SRSO形成步骤包括在沉积SRSO之后的快速热退火(RTA)工艺。 同样地,可以在SRSO层沉积之后进行热氧化或等离子体氧化。 响应于上述沉积,退火和氧化过程,Si纳米晶体的尺寸减小。