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    • 3. 发明授权
    • Electron beam exposure apparatus and electron beam processing apparatus
    • 电子束曝光装置和电子束处理装置
    • US07041988B2
    • 2006-05-09
    • US10431782
    • 2003-05-08
    • Shinichi HamaguchiSusumu GotoOsamu KamimuraYasunari Sohda
    • Shinichi HamaguchiSusumu GotoOsamu KamimuraYasunari Sohda
    • G21G5/00G21K5/10
    • B82Y10/00B82Y40/00G21K1/093H01J37/153H01J37/3177H01J2237/1536
    • An electron beam exposure apparatus for exposing wafer with an electron beam, includes: a first electromagnetic lens system for making the electron beam incident substantially perpendicularly on a first plane be incident on a second plane substantially perpendicularly; a second electromagnetic lens system for making the electron beam that was substantially perpendicularly incident on the second plane be incident on the wafer substantially perpendicularly; a rotation correction lens provided within the first electromagnetic lens system for correcting rotation of the electron beam caused by at least the first electromagnetic lens system; a deflection system for deflecting the electron beam to a position on the wafer; and a deflection-correction optical system provided within the second electromagnetic lens system for correcting deflection aberration caused by the deflection system.
    • 一种用电子束曝光晶片的电子束曝光装置,包括:用于使基本上垂直于第一平面的电子束入射到第二平面上的第一电磁透镜系统基本垂直入射; 用于使基本上垂直入射在第二平面上的电子束的第二电磁透镜系统基本上垂直入射在晶片上; 旋转校正透镜,设置在第一电磁透镜系统内,用于校正由至少第一电磁透镜系统引起的电子束的旋转; 用于将电子束偏转到晶片上的位置的偏转系统; 以及设置在第二电磁透镜系统内用于校正由偏转系统引起的偏转像差的偏转校正光学系统。
    • 6. 发明申请
    • CHARGED PARTICLE BEAM APPARATUS
    • 充电颗粒光束装置
    • US20080067376A1
    • 2008-03-20
    • US11751094
    • 2007-05-21
    • Sayaka TanimotoOsamu KamimuraYasunari SohdaHiroya Ohta
    • Sayaka TanimotoOsamu KamimuraYasunari SohdaHiroya Ohta
    • G21K7/00
    • H01J37/153H01J37/265H01J37/28H01J2237/1205H01J2237/1534H01J2237/1536H01J2237/2446H01J2237/2448H01J2237/24592H02N13/00
    • This invention provides a charged particle beam apparatus that can makes reduction in off axis aberration and separate detection of secondary beams to be compatible. The charged particle beam apparatus has: an electron optics that forms a plurality of primary charged particle beams, projects them on a specimen, and makes them scan the specimen with a first deflector; a plurality of detectors that individually detect a plurality of secondary charged particle beams produced from the plurality of locations of the specimen by irradiation of the plurality of primary charged particle beams; and a voltage source for applying a voltage to the specimen. The charged particle beam apparatus further has: a Wien filter for separating paths of the primary charged particle beams and paths of the secondary charged particle beams; a second deflector for deflecting the secondary charged particle beams separated by the Wien filter; and control means for controlling the first deflector and the second deflector in synchronization, wherein the plurality of detectors detect the plurality of secondary charged particle beams separated by the Wien filter individually.
    • 本发明提供了一种带电粒子束装置,其可以减少离轴像差和将次级束的分离检测兼容。 带电粒子束装置具有:形成多个初级带电粒子束的电子光学器件,将它们投射在样本上,并使它们用第一偏转器扫描样本; 多个检测器,通过多个初级带电粒子束的照射,分别检测从样本的多个位置产生的多个次级带电粒子束; 以及用于向样本施加电压的电压源。 带电粒子束装置还具有:维纳滤波器,用于分离初级带电粒子束的路径和二次带电粒子束的路径; 用于偏转由维恩滤波器分离的二次带电粒子束的第二偏转器; 以及用于同步地控制第一偏转器和第二偏转器的控制装置,其中多个检测器分别检测由维恩过滤器分离的多个次级带电粒子束。
    • 7. 发明授权
    • Method of charged particle beam lithography and equipment for charged particle beam lithography
    • 带电粒子束光刻方法及带电粒子束光刻设备
    • US07105842B2
    • 2006-09-12
    • US10958141
    • 2004-10-05
    • Sayaka TanimotoYasunari SohdaYoshinori NakayamaOsamu KamimuraHaruo YodaMasaki Hosoda
    • Sayaka TanimotoYasunari SohdaYoshinori NakayamaOsamu KamimuraHaruo YodaMasaki Hosoda
    • H01J37/302G03F7/20
    • H01J37/3177B82Y10/00B82Y40/00H01J37/04H01J37/317
    • Disclosed is equipment for charged-particle beam lithography capable of executing exposure even when an electron beam with a bad property is produced due to a failure in some multibeam forming element, without replacing the failing multibeam forming element and without reducing the exposure accuracy. The equipment includes means for forming a plurality of charged-particle beams arranged at predetermined intervals; a plurality of blankers which act on the plurality of charged-particle beams individually; a common blanker which acts on all of the plurality of charged-particle beams; and a blanking restriction for causing those charged-particle beams which are given predetermined deflection by the plurality of blankers to reach onto a sample, with a signal applied to the common blanker, and blocking those charged-particle beams which are not given the predetermined deflection by the plurality of blankers to the sample. The equipment blocks beams with bad properties to the sample and executes exposure using only those beams which have bad properties.
    • 本发明公开了即使由于某些多波束形成元件的故障而产生具有不良特性的电子束也能够进行曝光的带电粒子束光刻设备,而不更换故障多波束形成元件而不降低曝光精度。 该设备包括用于形成以预定间隔布置的多个带电粒子束的装置; 分别作用在多个带电粒子束上的多个阻挡器; 作用于所有多个带电粒子束的常见消隐器; 以及消隐限制,用于使得由多个消隐器给予预定偏转的那些带电粒子束到达样本,信号施加到公共消隐器,并且阻挡未被给予预定偏转的那些带电粒子束 通过多个消隐器到样品。 设备阻挡样品性能不良的光束,并仅使用具有不良特性的光束执行曝光。
    • 8. 发明授权
    • Electron beam writing equipment and electron beam writing method
    • 电子束写入设备和电子束写入方法
    • US07098464B2
    • 2006-08-29
    • US10957695
    • 2004-10-05
    • Yasunari SohdaOsamu KamimuraYoshinori NakayamaSayaka TanimotoMasato Muraki
    • Yasunari SohdaOsamu KamimuraYoshinori NakayamaSayaka TanimotoMasato Muraki
    • H01J37/304
    • H01J37/3174B82Y10/00B82Y40/00H01J37/3045H01J2237/2482
    • The present invention provides a writing technique which can perform high-accuracy overlay writing in electron beam writing equipment performing mark detection by light.Electron beam writing equipment has an electron source; an electron optical system illuminating an electron beam emitted from the electron source onto a sample for scanning to form a desired pattern on the sample; a stage mounting the sample; a mark substrate provided on the stage; means beaming a light beam for position detection which is on the same side as the illumination direction of the electron beam for illuminating the mark substrate; light detection means which is on the same side as the means beaming a light beam for detecting reflected light reflected on the mark substrate; and electron detection means which is on the side opposite the light detection means with respect to the mark substrate for detecting a transmitted electron obtained by illumination of the electron beam onto the mark substrate, wherein relative position information of the light beam and the electron beam is obtained based on the signals of the detected reflected light and transmitted electron.
    • 本发明提供了一种写入技术,其能够通过光执行标记检测的电子束写入设备中执行高精度重叠写入。 电子束写入设备具有电子源; 电子光学系统将从电子源发射的电子束照射到样品上以进行扫描以在样品上形成所需图案; 安装样品的阶段; 设置在台上的标记基板; 意味着将用于位置检测的光束照射在与用于照射标记基板的电子束的照射方向相同的一侧; 光检测装置与发出用于检测在标记基板上反射的反射光的光束相同的一侧; 以及电子检测装置,其相对于用于检测通过将电子束照射到标记基板上而获得的透射电子的标记基板在与光检测装置相反的一侧,其中光束和电子束的相对位置信息为 基于检测到的反射光和透射电子的信号获得。