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1. 发明授权

US5050111A Alignment and exposure apparatus and method for manufacture of integrated circuits 失效
标题翻译：对准和曝光装置及集成电路的制造方法
公开(公告)号：US5050111A
公开(公告)日：1991-09-17
申请号：US542653
申请日：1990-06-25
申请人： Naoki Ayata , Mitsugu Yamamura , Bunei Hamasaki , Masao Kosugi , Kazuo Takahashi , Mitsuaki Seki
发明人： Naoki Ayata , Mitsugu Yamamura , Bunei Hamasaki , Masao Kosugi , Kazuo Takahashi , Mitsuaki Seki
IPC分类号： G03F7/20 , G03F9/00
CPC分类号： G03F9/7088 , G03F7/70058 , G03F7/70725 , G03F9/7023 , G03F9/7057
摘要： An alignment apparatus includes a first off-axis alignment optical system having a magnification, and a second off-axis alignment optical system having a magnification higher than that of the first off-axis alignment optical system, wherein the apparatus is operable in a global alignment mode using the second off-axis alignment optical system. In another aspect, an alignment apparatus includes a first off-axis alignment optical system having a magnification, a second off-axis alignment optical system having a magnification higher than that of the first off-axis alignment optical system, and a TTL alignment optical system, wherein the alignment apparatus is operable in a global alignment mode using the second off-axis alignment optical system and is operable in another global alignment mode using the TTL optical alignment system.

2. 发明授权

US4937618A Alignment and exposure apparatus and method for manufacture of integrated circuits 失效
标题翻译：对准和曝光装置及集成电路的制造方法
公开(公告)号：US4937618A
公开(公告)日：1990-06-26
申请号：US368881
申请日：1989-06-20
申请人： Naoki Ayata , Mitsugu Yamamura , Bunei Hamasaki , Masao Kosugi , Kazuo Takahashi , Mitsuaki Seki
发明人： Naoki Ayata , Mitsugu Yamamura , Bunei Hamasaki , Masao Kosugi , Kazuo Takahashi , Mitsuaki Seki
IPC分类号： G03F7/20 , G03F9/00
CPC分类号： G03F9/7088 , G03F7/70058 , G03F7/70725 , G03F9/7023 , G03F9/7057
摘要： An alignment apparatus including a first off-axis alignment optical system having a magnification, and a second off-axis alignment optical system having a magnification higher than that of the first off-axis alignment optical system, wherein the apparatus is operable in a global alignment mode using the second off-axis alignment optical system. In another aspect, there is provided an alignment apparatus which includes a first off-axis alignment optical system having a magnification, a second off-axis alignment optical system having a magnification higher than that of the first off-axis alignment optical system, and a TTL alignment optical system, wherein the alignment apparatus is operable in a global alignment mode using the second off-axis alignment optical system and is operable in another global alignment mode using the TTL optical alignment system.
摘要翻译：一种对准装置，包括具有倍率的第一离轴对准光学系统和具有高于第一离轴对准光学系统的倍率的第二离轴对准光学系统，其中该装置可以全局对准模式使用第二离轴对准光学系统。在另一方面，提供了一种对准装置，其包括具有倍率的第一离轴对准光学系统，具有比第一离轴对准光学系统的放大率高的倍率的第二离轴对准光学系统，以及 TTL对准光学系统，其中对准装置可以使用第二离轴对准光学系统以全局对准模式操作，并且可以使用TTL光学对准系统以另一全局对准模式操作。

3. 发明授权

US5365342A Alignment and exposure apparatus and method for manufacture of integrated circuits 失效
标题翻译：对准和曝光装置及集成电路的制造方法
公开(公告)号：US5365342A
公开(公告)日：1994-11-15
申请号：US29363
申请日：1993-03-10
申请人： Naoki Ayata , Mitsugu Yamamura , Bunei Hamasaki , Masao Kosugi , Kazuo Takahashi , Mitsuaki Seki
发明人： Naoki Ayata , Mitsugu Yamamura , Bunei Hamasaki , Masao Kosugi , Kazuo Takahashi , Mitsuaki Seki
IPC分类号： G03F7/20 , G03F9/00 , H01L21/30 , G01B11/00
CPC分类号： G03F9/7088 , G03F7/70058 , G03F7/70725 , G03F9/7023 , G03F9/7057 , H01L21/30
摘要： An alignment apparatus includes a first off-axis alignment optical system having a magnification, and a second off-axis alignment optical system having a magnification higher than that of the first off-axis alignment optical system, wherein the apparatus is operable in a global alignment mode using the second off-axis alignment optical system. In another aspect, an alignment apparatus which includes a first off-axis alignment optical system having a magnification, a second off-axis alignment optical system having a magnification higher than that of the first off-axis alignment optical system, and a TTL alignment optical system, wherein the alignment apparatus is operable in a global alignment mode using the second off-axis alignment optical system and is operable in another global alignment mode using the TTL optical alignment system.
摘要翻译：对准装置包括具有倍率的第一离轴对准光学系统和具有高于第一离轴对准光学系统的倍率的第二离轴对准光学系统，其中该装置可以全局对准模式使用第二离轴对准光学系统。在另一方面，一种对准装置，包括具有放大率的第一离轴对准光学系统，具有高于第一离轴对准光学系统的倍率的第二离轴对准光学系统，以及TTL对准光学系统，其中所述对准装置可以使用所述第二离轴对准光学系统以全局对准模式操作，并且可以使用所述TTL光学对准系统在另一全局对准模式中操作。

4. 发明授权

US4918320A Alignment method usable in a step-and-repeat type exposure apparatus for either global or dye-by-dye alignment 失效
标题翻译：可用于全球或逐个染料对齐的步进重复型曝光装置中的对准方法
公开(公告)号：US4918320A
公开(公告)日：1990-04-17
申请号：US170359
申请日：1988-03-18
申请人： Bunei Hamasaki , Hajime Igarashi , Akiya Nakai , Naoki Ayata
发明人： Bunei Hamasaki , Hajime Igarashi , Akiya Nakai , Naoki Ayata
IPC分类号： G03F9/00
CPC分类号： G03F9/7003
摘要： A method of aligning a semiconductor wafer, usable in a step-and-repeat type exposure apparatus for projecting, in a reduced scale, images of a pattern formed on a reticle upon different shot areas on the semiconductor wafer in a predetermined sequence. According to this alignment method, the wafer is moved stepwise before the initiation of step-and-repeat exposures of the shot areas on the wafer and in accordance with a predetermined layout grid concerning the sites of the shot areas on the wafer. While moving the wafer stepwise in this manner, any positional deviation of each of some of the shot areas with respect to the layout grid is measured by use of a reduction projection lens system and, from the results of measurement, a corrected grid is prepared according to which grid the amount of stepwise movement of the wafer to be made for the step-and-repeat exposures thereof is determined. By this, for the exposures, the wafer can be moved stepwise exactly in accordance with the actual layout of the shot areas. Sample shot areas which are the subject of measurement can be selected under predetermined conditions. Additionally, of the values obtained as a result of the measurement, any extraordinary one or ones may be determined on the basis of the variance and then are excluded at the time of calculations made to determine the corrected grid. Thus, the stepwise movement of the wafer for the step-and-repeat exposures thereof can be controlled with higher precision.
摘要翻译：一种可用于步进重复型曝光装置中的半导体晶片的对准方法，用于以预定的顺序，在半导体晶片上的不同照射区域上以缩小的尺度投影形成在掩模版上的图案的图像。根据这种对准方法，晶片在晶片上的拍摄区域的重复曝光开始之前逐步移动，并且根据关于晶片上的照射区域的位置的预定布局网格。当以这种方式逐步移动晶片时，通过使用还原投影透镜系统来测量相对于布局格栅的一些照射区域中的每一个的任何位置偏差，并且根据测量结果，根据确定要进行步进重复曝光的晶圆的逐步移动量。由此，对于曝光，晶片可以根据拍摄区域的实际布局精确地逐步移动。作为测量对象的采样拍摄区域可以在预定条件下选择。此外，作为测量结果获得的值，可以基于方差来确定任何非常一个或一个，然后在进行计算时排除以确定校正的网格。因此，可以更高精度地控制用于步进重复曝光的晶片的逐步移动。

5. 发明授权

US5197118A Control system for a fine pattern printing apparatus 失效
标题翻译：精细图案印刷装置的控制系统
公开(公告)号：US5197118A
公开(公告)日：1993-03-23
申请号：US752986
申请日：1991-09-03
申请人： Ryuichi Sato , Masanori Numata , Bunei Hamasaki , Naoki Ayata
发明人： Ryuichi Sato , Masanori Numata , Bunei Hamasaki , Naoki Ayata
IPC分类号： G03F7/20
CPC分类号： G03F7/70525
摘要： A system for controlling operation of a fine pattern printing apparatus. The system including a command storing portion in which a plurality of unit-operation instructing commands capable of instructing execution of corresponding unit operations which are components of the pattern printing operation of the apparatus and at least one sequential operation instructing command including a combination of at least a predetermined portion of the unit-operation instructing commands are stored. A command selecting portion for allowing selection of the commands stored in the command storing portion; a sequence setting portion cooperative with the command selecting portion so as to set, in the command storing portion, a desired sequential operation instructing command formed by a plurality of unit-operation instructing commands each of which is stored in the command storing portion. The sequential operation instructing command set in the storing portion by the sequence setting portion is selectable by the command selecting portion and operation controlling portion cooperative with the command selecting portion so as to control the operation of the apparatus in accordance with such one of the commands stored in the storing portion that is selected by the selection portion.
摘要翻译：一种用于控制精细图案印刷装置的操作的系统。该系统包括命令存储部分，其中能够指示作为装置的图案打印操作的组成部分的相应单元操作的多个单元操作指令命令以及包括至少一个组合的至少一个顺序操作指令命令存储单位操作指示命令的预定部分。命令选择部分，用于允许选择存储在命令存储部分中的命令; 与命令选择部分协作的序列设置部分，以便在命令存储部分中设置由存储在命令存储部分中的多个单元操作指令命令形成的期望的顺序操作指令命令。由命令选择部分和操作控制部分与命令选择部分协调选择由序列设置部分在存储部分中设置的顺序操作指令命令，以便根据存储的命令之一来控制装置的操作在由选择部分选择的存储部分中。

6. 发明授权

US06499007B1 Parameter editing method and semiconductor exposure system 失效
标题翻译：参数编辑方法和半导体曝光系统
公开(公告)号：US06499007B1
公开(公告)日：2002-12-24
申请号：US09351902
申请日：1999-07-14
申请人： Yoichi Kuroki , Bunei Hamasaki , Hiroki Suzukawa , Kenichi Kawai , Takahiro Senda
发明人： Yoichi Kuroki , Bunei Hamasaki , Hiroki Suzukawa , Kenichi Kawai , Takahiro Senda
IPC分类号： G06F945
CPC分类号： G03F7/70525
摘要： In editing of a job parameter in a semiconductor exposure apparatus controlled by the job parameter, which is a collection of parameters, a first parameter set independent of the model of the semiconductor exposure apparatus and a second parameter set dependent upon the model are edited and saved independently. This makes it possible to improve operability of parameter editing and management in the semiconductor exposure apparatus, ease of maintenance thereof and the ability to use job parameters among various models of apparatus.
摘要翻译：在由作为参数的集合的作业参数控制的半导体曝光装置中的作业参数的编辑中，编辑并保存与半导体曝光装置的模型无关的第一参数集和依赖于模型的第二参数集独立。这使得可以提高半导体曝光装置中的参数编辑和管理的可操作性，易于维护以及在各种型号的装置中使用作业参数的能力。

7. 发明授权

US4801808A Alignment and exposure apparatus having an objective lens system capable of observing a mark on an exposure optical holding member to permit alignment of a mask relative to the exposure optical system 失效
标题翻译：具有能够观察曝光光学保持构件上的标记以允许掩模相对于曝光光学系统对准的物镜系统的对准和曝光装置
公开(公告)号：US4801808A
公开(公告)日：1989-01-31
申请号：US80246
申请日：1987-07-28
申请人： Bunei Hamasaki
发明人： Bunei Hamasaki
IPC分类号： G03F9/00 , G01B11/27
CPC分类号： G03F9/70
摘要： An alignment system in an alignment and exposure apparatus for exposing a wafer to a pattern of a mask, for use in the manufacture of semiconductor devices, the alignment system including an objective lens system for observing alignment marks formed on the mask and the wafer respectively, in order to bring the mask and the wafer into a predetermined alignment relation, prior to the exposure of the wafer. The objective lens system is capable of observing a mark that is formed on a member for holding an exposure optical system in order to allow alignment of the mask relative to the exposure optical system, whereby a reference position of the objective lens system is determined on the basis of the mark formed on the holding member and whereby accurate movement of the objective lens system during movement thereof to a position for observing the alignment marks on the mask and the wafer is assured.
摘要翻译：在用于将半导体器件制造中使用的用于将晶片暴露于掩模图案的对准和曝光设备中的对准系统，所述对准系统包括分别用于观察形成在掩模和晶片上的对准标记的物镜系统，以便在晶片曝光之前使掩模和晶片进入预定的对准关系。物镜系统能够观察形成在用于保持曝光光学系统的构件上的标记，以便允许掩模相对于曝光光学系统对准，由此物镜系统的基准位置在确保在保持构件上形成的标记的基础，从而确保物镜系统在其移动期间的准确移动到用于观察掩模和晶片上的对准标记的位置。

8. 发明授权

US4811059A Alignment method 失效
标题翻译：对齐方法
公开(公告)号：US4811059A
公开(公告)日：1989-03-07
申请号：US104582
申请日：1987-10-02
申请人： Bunei Hamasaki , Shinji Utamura , Akiya Nakai
发明人： Bunei Hamasaki , Shinji Utamura , Akiya Nakai
IPC分类号： G03F9/00 , H01L21/027 , H01L21/30 , H01L21/67 , H01L21/68 , G03B27/32
CPC分类号： G03F9/70
摘要： An improved alignment method usable in a step-and-repeat type alignment and exposure apparatus for photolighographically transferring images of a pattern of a reticle onto different shot areas on a semiconductor wafer, for manufacture of semiconductor devices. According to this method, the alignment is executed with respect to an X direction, a Y direction and a rotational direction parallel to a plane containing the X and Y directions. With regard to the rotational direction, positional deviation of the wafer as a whole with respect to the reticle is measured and corrected prior to the initiation of the step-and-repeat photoprinting. With regard to the X and Y directions, detection and correction of any deviation are executed for each of the shot areas of the wafer. By this, high-accuracy and high-speed alignment is attainable for all the shot areas of the wafer.
摘要翻译：一种可用于步进重复型对准和曝光装置的改进的对准方法，用于将半导体晶片上的不同射出区域的图案的图像转印到半导体器件的制造中。根据该方法，相对于与包含X和Y方向的平面平行的X方向，Y方向和旋转方向执行对准。关于旋转方向，在开始步进重复照相打印之前测量和校正晶片相对于掩模版的位置偏差。对于X方向和Y方向，对于晶片的每个拍摄区域执行任何偏差的检测和校正。由此，可以对晶片的所有照射区域实现高精度和高速对准。

9. 发明授权

US4881100A Alignment method 失效
标题翻译：对齐方法
公开(公告)号：US4881100A
公开(公告)日：1989-11-14
申请号：US273187
申请日：1988-11-16
申请人： Akiya Nakai , Bunei Hamasaki , Shinji Utamura
发明人： Akiya Nakai , Bunei Hamasaki , Shinji Utamura
IPC分类号： G03F9/00
CPC分类号： G03F9/7046
摘要： An alignment method usable in an apparatus for transferring images of a pattern of a mask onto different portions of a semiconductor wafer in a step-and-repeat manner, is disclosed. In this alignment method, positional deviation of at least one portion of the wafer with respect to the mask is measured and, on the basis of this measurement, the mask and the wafer are aligned with each other. After this,step-and-repeat exposure is executed. When the measurement of the positional deviation of the at least one portion of the wafer is unattainable, another portion of the wafer is selected and the deviation measurement is executed in respect to the selected portion. In another aspect of the invention, with regard to a rotational component of the deviation of the wafer, measurement and alignment are repeatedly executed until the rotational component becomes less than a predetermined value. Thereafter, the step-and-repeat exposure is initiated.
摘要翻译：公开了一种可用于将半导体晶片图案的图像以步进重复的方式传送到半导体晶片的不同部分的装置的对准方法。在该对准方法中，测量晶片相对于掩模的至少一部分的位置偏移，并且基于该测量，掩模和晶片彼此对准。之后，执行逐步重复曝光。当晶片的至少一部分的位置偏移的测量是不可测量的时，选择晶片的另一部分，并相对于所选择的部分执行偏差测量。在本发明的另一方面，关于晶片的偏离的旋转分量，重复执行测量和对准直到旋转分量变得小于预定值。此后，开始步进和重复曝光。

10. 发明授权

US4677474A Wafer prober 失效
标题翻译：晶圆探测器
公开(公告)号：US4677474A
公开(公告)日：1987-06-30
申请号：US749505
申请日：1985-06-27
申请人： Mitsuya Sato , Bunei Hamasaki
发明人： Mitsuya Sato , Bunei Hamasaki
IPC分类号： H01L21/66 , H01L21/00 , H01L21/68 , H04N7/18
CPC分类号： H01L21/67259 , H01L21/682
摘要： A probing apparatus for use in examination of a chip formed on a wafer, in co-operation with a sheet-like member having probe needles to be contacted to the chip on the wafer, the probing apparatus being arranged so that the positions of the probe needles of the sheet-like member, when it is held by a holder of the probing apparatus, are detected automatically and, in accordance with the detected positions, the sheet-like member is displaced automatically so as to be aligned with the probing apparatus. According to another aspect of the invention, the position of the wafer when it is at a location under the probe needles is detected automatically and, in accordance with the detected position, the wafer is displaced so as to be aligned with the sheet-like member which has been aligned automatically with the probing apparatus. In one preferred form, a TV camera is provided at a position above the probing station, the TV camera being adapted to view the probe needles of the sheet-like member during positioning of it and to view the wafer when it is at a probing station, during positioning of the wafer.
摘要翻译：一种用于检查形成在晶片上的芯片的探测装置，与具有与晶片上的芯片接触的探针的片状构件配合，探测装置被布置成使得探针的位置片状构件的针由检测装置的保持器保持时被自动检测，并且根据检测到的位置，片状构件自动移位以与探测装置对准。根据本发明的另一方面，当晶片处于探针下方的位置时，自动检测晶片的位置，并且根据检测到的位置，晶片移位以与片状构件对准其已经与探测装置自动对准。在一个优选的形式中，电视摄像机设置在探测站上方的一个位置处，电视摄像机适于在定位时观察片状构件的探针，并且当它位于探测站时观察晶片，在晶片定位期间。

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