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    • 1. 发明授权
    • Alignment method usable in a step-and-repeat type exposure apparatus for
either global or dye-by-dye alignment
    • 可用于全球或逐个染料对齐的步进重复型曝光装置中的对准方法
    • US4918320A
    • 1990-04-17
    • US170359
    • 1988-03-18
    • Bunei HamasakiHajime IgarashiAkiya NakaiNaoki Ayata
    • Bunei HamasakiHajime IgarashiAkiya NakaiNaoki Ayata
    • G03F9/00
    • G03F9/7003
    • A method of aligning a semiconductor wafer, usable in a step-and-repeat type exposure apparatus for projecting, in a reduced scale, images of a pattern formed on a reticle upon different shot areas on the semiconductor wafer in a predetermined sequence. According to this alignment method, the wafer is moved stepwise before the initiation of step-and-repeat exposures of the shot areas on the wafer and in accordance with a predetermined layout grid concerning the sites of the shot areas on the wafer. While moving the wafer stepwise in this manner, any positional deviation of each of some of the shot areas with respect to the layout grid is measured by use of a reduction projection lens system and, from the results of measurement, a corrected grid is prepared according to which grid the amount of stepwise movement of the wafer to be made for the step-and-repeat exposures thereof is determined. By this, for the exposures, the wafer can be moved stepwise exactly in accordance with the actual layout of the shot areas. Sample shot areas which are the subject of measurement can be selected under predetermined conditions. Additionally, of the values obtained as a result of the measurement, any extraordinary one or ones may be determined on the basis of the variance and then are excluded at the time of calculations made to determine the corrected grid. Thus, the stepwise movement of the wafer for the step-and-repeat exposures thereof can be controlled with higher precision.
    • 一种可用于步进重复型曝光装置中的半导体晶片的对准方法,用于以预定的顺序,在半导体晶片上的不同照射区域上以缩小的尺度投影形成在掩模版上的图案的图像。 根据这种对准方法,晶片在晶片上的拍摄区域的重复曝光开始之前逐步移动,并且根据关于晶片上的照射区域的位置的预定布局网格。 当以这种方式逐步移动晶片时,通过使用还原投影透镜系统来测量相对于布局格栅的一些照射区域中的每一个的任何位置偏差,并且根据测量结果,根据 确定要进行步进重复曝光的晶圆的逐步移动量。 由此,对于曝光,晶片可以根据拍摄区域的实际布局精确地逐步移动。 作为测量对象的采样拍摄区域可以在预定条件下选择。 此外,作为测量结果获得的值,可以基于方差来确定任何非常一个或一个,然后在进行计算时排除以确定校正的网格。 因此,可以更高精度地控制用于步进重复曝光的晶片的逐步移动。
    • 2. 发明授权
    • Alignment method
    • 对齐方法
    • US4811059A
    • 1989-03-07
    • US104582
    • 1987-10-02
    • Bunei HamasakiShinji UtamuraAkiya Nakai
    • Bunei HamasakiShinji UtamuraAkiya Nakai
    • G03F9/00H01L21/027H01L21/30H01L21/67H01L21/68G03B27/32
    • G03F9/70
    • An improved alignment method usable in a step-and-repeat type alignment and exposure apparatus for photolighographically transferring images of a pattern of a reticle onto different shot areas on a semiconductor wafer, for manufacture of semiconductor devices. According to this method, the alignment is executed with respect to an X direction, a Y direction and a rotational direction parallel to a plane containing the X and Y directions. With regard to the rotational direction, positional deviation of the wafer as a whole with respect to the reticle is measured and corrected prior to the initiation of the step-and-repeat photoprinting. With regard to the X and Y directions, detection and correction of any deviation are executed for each of the shot areas of the wafer. By this, high-accuracy and high-speed alignment is attainable for all the shot areas of the wafer.
    • 一种可用于步进重复型对准和曝光装置的改进的对准方法,用于将半导体晶片上的不同射出区域的图案的图像转印到半导体器件的制造中。 根据该方法,相对于与包含X和Y方向的平面平行的X方向,Y方向和旋转方向执行对准。 关于旋转方向,在开始步进重复照相打印之前测量和校正晶片相对于掩模版的位置偏差。 对于X方向和Y方向,对于晶片的每个拍摄区域执行任何偏差的检测和校正。 由此,可以对晶片的所有照射区域实现高精度和高速对准。
    • 3. 发明授权
    • Alignment method
    • 对齐方法
    • US4881100A
    • 1989-11-14
    • US273187
    • 1988-11-16
    • Akiya NakaiBunei HamasakiShinji Utamura
    • Akiya NakaiBunei HamasakiShinji Utamura
    • G03F9/00
    • G03F9/7046
    • An alignment method usable in an apparatus for transferring images of a pattern of a mask onto different portions of a semiconductor wafer in a step-and-repeat manner, is disclosed. In this alignment method, positional deviation of at least one portion of the wafer with respect to the mask is measured and, on the basis of this measurement, the mask and the wafer are aligned with each other. After this,step-and-repeat exposure is executed. When the measurement of the positional deviation of the at least one portion of the wafer is unattainable, another portion of the wafer is selected and the deviation measurement is executed in respect to the selected portion. In another aspect of the invention, with regard to a rotational component of the deviation of the wafer, measurement and alignment are repeatedly executed until the rotational component becomes less than a predetermined value. Thereafter, the step-and-repeat exposure is initiated.
    • 公开了一种可用于将半导体晶片图案的图像以步进重复的方式传送到半导体晶片的不同部分的装置的对准方法。 在该对准方法中,测量晶片相对于掩模的至少一部分的位置偏移,并且基于该测量,掩模和晶片彼此对准。 之后,执行逐步重复曝光。 当晶片的至少一部分的位置偏移的测量是不可测量的时,选择晶片的另一部分,并相对于所选择的部分执行偏差测量。 在本发明的另一方面,关于晶片的偏离的旋转分量,重复执行测量和对准直到旋转分量变得小于预定值。 此后,开始步进和重复曝光。
    • 4. 发明授权
    • Aligning method utilizing reliability weighting coefficients
    • 利用可靠性加权系数对齐方法
    • US5543921A
    • 1996-08-06
    • US465098
    • 1995-06-05
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • G03F9/00G01B11/00
    • G03F9/7088G03F9/7003G03F9/7092
    • An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine the corrected positional data.
    • 适用于步进重复类型的半导体器件制造曝光设备中的对准方法,用于将晶片上的区域顺序地定位到曝光位置。 在一个优选形式中,检测提供在晶片的选定区域上的标记以获得对应的标记信号,然后基于标记信号测量与所选区域的位置或位置误差相关的各个位置数据。 然后,基于对应的标记信号的状态或测量的位置数据的状态,并通过使用模糊推理来检测对应的选择区域的每个测量位置数据的可靠性。 然后通过使用测量的所选择的区域的位置数据来准备与晶片上的所有区域的配置相关的位置数据,其中,为了准备校正的位置数据,根据检测到的可靠性对每个测量的位置数据进行加权 使得具有较高可靠性的测量位置数据对确定校正的位置数据更有影响力。
    • 7. 发明授权
    • Aligning method
    • 对齐方式
    • US06333786B1
    • 2001-12-25
    • US08139059
    • 1993-10-21
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • G01B1100
    • G03F9/7092G03F9/7003G03F9/7088
    • An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine of the corrected positional data. For sequential positioning of the regions on the wafer to the exposure position, the wafer movement is controlled on the basis of the prepared corrected positional data, whereby high-precision alignment of each region is assured.
    • 适用于步进重复类型的半导体器件制造曝光设备中的对准方法,用于将晶片上的区域顺序地定位到曝光位置。 在一个优选形式中,检测提供在晶片的选定区域上的标记以获得对应的标记信号,然后基于标记信号测量与所选区域的位置或位置误差相关的各个位置数据。 然后,基于对应的标记信号的状态或测量的位置数据的状态,并通过使用模糊推理来检测对应的选择区域的每个测量位置数据的可靠性。 然后通过使用测量的所选择的区域的位置数据来准备与晶片上的所有区域的配置相关的位置数据,其中,为了准备校正的位置数据,根据检测到的可靠性对每个测量的位置数据进行加权 使得具有较高可靠性的测量位置数据对确定校正的位置数据更有影响力。 为了将晶片上的区域顺序定位到曝光位置,基于准备的校正位置数据来控制晶片移动,从而确保每个区域的高精度对准。
    • 8. 发明授权
    • Aligning method
    • 对齐方式
    • US6097495A
    • 2000-08-01
    • US102752
    • 1998-06-23
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • Shigeyuki UzawaAkiya NakaiMasaaki ImaizumiHiroshi TanakaNoburu TakakuraYoshio Kaneko
    • G03F9/00G01B11/00
    • G03F9/7088G03F9/7003G03F9/7092
    • An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine the corrected positional data. For sequential positioning of the regions on the wafer to the exposure position, the wafer movement is controlled on the basis of the prepared corrected positional data, whereby high-precision alignment of each region is assured.
    • 适用于步进重复类型的半导体器件制造曝光设备中的对准方法,用于将晶片上的区域顺序地定位到曝光位置。 在一个优选形式中,检测提供在晶片的选定区域上的标记以获得对应的标记信号,然后基于标记信号测量与所选区域的位置或位置误差相关的各个位置数据。 然后,基于对应的标记信号的状态或测量的位置数据的状态,并通过使用模糊推理来检测对应的选择区域的每个测量位置数据的可靠性。 然后通过使用测量的所选择的区域的位置数据来准备与晶片上的所有区域的配置相关的位置数据,其中,为了准备校正的位置数据,根据检测到的可靠性对每个测量的位置数据进行加权 使得具有较高可靠性的测量位置数据对确定校正的位置数据更有影响力。 为了将晶片上的区域顺序定位到曝光位置,基于准备的校正位置数据来控制晶片移动,从而确保每个区域的高精度对准。