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    • 1. 发明申请
    • ORGANIC LIGHT EMITTING DIODE DISPLAY
    • 有机发光二极管显示
    • US20120001156A1
    • 2012-01-05
    • US13077045
    • 2011-03-31
    • Kyu-Sik CHOWon-Kyu LEETae-Hoon YANGByoung-Kwon CHOOSang-Ho MOONBo-Kyung CHOIYong-Hwan PARKJoon-Hoo CHOIMin-Chul SHINYun-Gyu LEE
    • Kyu-Sik CHOWon-Kyu LEETae-Hoon YANGByoung-Kwon CHOOSang-Ho MOONBo-Kyung CHOIYong-Hwan PARKJoon-Hoo CHOIMin-Chul SHINYun-Gyu LEE
    • H01L51/52
    • H01L27/3279H01L27/124H01L27/1248H01L27/3244H01L27/3262H01L27/3265
    • An organic light emitting diode display is disclosed. The organic light emitting diode display includes: a substrate including a first region and a second region, a first gate electrode formed over the first region, a second gate electrode formed over the second region, a first gate insulator formed on the first gate electrode, a second gate insulator formed on the second gate electrode, a first semiconductor layer formed on the first gate insulator, the first semiconductor layer including a first channel region, a second semiconductor layer formed on the second gate insulator, the second semiconductor layer including a second channel region, an interlayer insulator formed over the substrate and over at least part of the first and second semiconductor layers, a first etching stop layer formed over the first channel region and surrounded by the interlayer insulator, a second etching stop layer formed over the second channel region and surrounded by the interlayer insulator, a first source electrode and a first drain electrode contacting the first semiconductor layer through the interlayer insulator, and a second source electrode and a second drain electrode contacting the second semiconductor layer through the interlayer insulator.
    • 公开了一种有机发光二极管显示器。 有机发光二极管显示器包括:包括第一区域和第二区域的基板,形成在第一区域上的第一栅极电极,形成在第二区域上的第二栅极电极,形成在第一栅电极上的第一栅极绝缘体, 形成在所述第二栅电极上的第二栅极绝缘体,形成在所述第一栅极绝缘体上的第一半导体层,所述第一半导体层包括第一沟道区,形成在所述第二栅极绝缘体上的第二半导体层,所述第二半导体层包括第二栅极绝缘体, 沟道区域,形成在所述衬底上并且在所述第一和第二半导体层的至少一部分上方的层间绝缘体,形成在所述第一沟道区域上并被所述层间绝缘体包围的第一蚀刻停止层,形成在所述第二沟槽区上的第二蚀刻停止层 沟道区域并被层间绝缘体包围,第一源电极和与其接触的第一漏电极 e通过层间绝缘体的第一半导体层,以及通过层间绝缘体与第二半导体层接触的第二源电极和第二漏电极。
    • 8. 发明申请
    • METHOD OF FABRICATING THIN FILM TRANSISTOR
    • 薄膜晶体管的制作方法
    • US20070267704A1
    • 2007-11-22
    • US11741273
    • 2007-04-27
    • Tae-Hoon YANGKi-Yong LeeJin-Wook SeoByoung-Keon Park
    • Tae-Hoon YANGKi-Yong LeeJin-Wook SeoByoung-Keon Park
    • H01L29/94H01L21/8238
    • H01L21/02672H01L21/02488H01L21/02532H01L21/3226H01L27/1277H01L27/1288
    • A method of fabricating a CMOS thin film transistor includes: providing a substrate; forming an amorphous silicon layer on the substrate; performing a first annealing process on the substrate and crystallizing the amorphous silicon layer into a polysilicon layer; patterning the polysilicon layer to form first and second semiconductor layers; implanting first impurities into the first and second semiconductor layers; implanting second impurities into the first or second semiconductor layer; and performing a second annealing process on the semiconductor layers to remove the metal catalyst remaining in the first or second semiconductor layer, on which the second impurities are implanted, wherein the first impurities are implanted at a dose of 6×1013/cm2 to 5×1015/cm2, and the second impurities are implanted at a dose of 1×1011/cm2to 3×1015/cm2.
    • 制造CMOS薄膜晶体管的方法包括:提供衬底; 在所述基板上形成非晶硅层; 在所述衬底上进行第一退火处理并将所述非晶硅层结晶成多晶硅层; 图案化多晶硅层以形成第一和第二半导体层; 将第一杂质注入到第一和第二半导体层中; 将第二杂质注入第一或第二半导体层; 以及对所述半导体层执行第二退火处理以去除留在其中注入所述第二杂质的所述第一或第二半导体层中的金属催化剂,其中所述第一杂质以6×10 13 / > / cm 2至5×10 15 / cm 2,并且以1×10 11 /次的剂量注入第二杂质 > / cm 2至3×10 15 / cm 2。
    • 10. 发明申请
    • THIN FILM TRANSISTOR AND METHOD OF FABRICATING THE SAME
    • 薄膜晶体管及其制造方法
    • US20070087490A1
    • 2007-04-19
    • US11611238
    • 2006-12-15
    • Jin-Wook SEOKi-Yong LEETae-Hoon YANGByoung-Keon PARK
    • Jin-Wook SEOKi-Yong LEETae-Hoon YANGByoung-Keon PARK
    • H01L21/84
    • H01L21/02672H01L21/2022H01L29/04H01L29/66765H01L29/78609H01L29/78678H01L29/78696
    • A bottom gate thin film transistor and method of fabricating the same are disclosed, in which a channel region is crystallized by a super grain silicon (SGS) crystallization method, including: forming a gate electrode and a gate insulating layer on an insulating substrate; forming an amorphous silicon layer on the gate insulating layer followed by forming a capping layer and a metal catalyst layer; performing heat treatment to crystallize the amorphous silicon layer into a polysilicon layer; and forming an etch stopper, source and drain regions and source and drain electrodes. The thin film transistor includes: an insulating substrate; a gate electrode formed on the substrate; a gate insulating layer formed on the gate electrode; a polysilicon layer formed on the gate insulating layer and crystallized by an SGS crystallization method; and source and drain regions and source and drain electrodes formed in a predetermined region of the substrate. As described, a method of fabricating the conventional top-gate thin film transistor has problems in that an interface between a channel region and a gate insulating layer is directly exposed to air or in direct contact with a photoresist pattern or etchant so that the thin film transistor may be contaminated by impurities such as oxide, organic and metal, or damaged in grains, and in that a metal catalyst remains at an interface in crystallization so that leakage current may occur. However, advantageously, a method of fabricating a bottom-gate thin film transistor according to the present invention has merits in that an interface between the channel region and the gate insulating layer is not exposed to air so that the aforementioned problems do not occur. Therefore, a thin film transistor having excellent characteristics may be fabricated and a fabrication process thereof may be simplified.
    • 公开了一种底栅薄膜晶体管及其制造方法,其中沟道区域通过超晶硅(SGS)结晶方法结晶,包括:在绝缘基板上形成栅电极和栅极绝缘层; 在所述栅极绝缘层上形成非晶硅层,接着形成覆盖层和金属催化剂层; 进行热处理以将非晶硅层结晶成多晶硅层; 以及形成蚀刻停止器,源极和漏极区域以及源极和漏极电极。 薄膜晶体管包括:绝缘基板; 形成在所述基板上的栅电极; 形成在所述栅电极上的栅极绝缘层; 形成在栅极绝缘层上并通过SGS结晶法结晶的多晶硅层; 以及形成在基板的预定区域中的源极和漏极区域以及源极和漏极电极。 如上所述,制造常规顶栅薄膜晶体管的方法的问题在于,沟道区和栅极绝缘层之间的界面直接暴露于空气或与光致抗蚀剂图案或蚀刻剂直接接触,使得薄膜 晶体管可能被诸如氧化物,有机和金属的杂质污染或在晶粒中损坏,并且金属催化剂保留在结晶界面处,从而可能发生漏电流。 然而,有利的是,根据本发明的制造底栅极薄膜晶体管的方法的优点在于,沟道区和栅极绝缘层之间的界面不暴露于空气,从而不会发生上述问题。 因此,可以制造具有优异特性的薄膜晶体管,并且可以简化其制造工艺。