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    • 4. 发明申请
    • METHOD OF FABRICATING THIN FILM TRANSISTOR
    • 薄膜晶体管的制作方法
    • US20110294267A1
    • 2011-12-01
    • US13206227
    • 2011-08-09
    • Ji-Su AhnSung-Chul Kim
    • Ji-Su AhnSung-Chul Kim
    • H01L21/336
    • H01L21/02532H01L21/02667H01L27/124H01L27/1281H01L27/3262H01L29/66757
    • A thin film transistor includes a substrate, a buffer layer on the substrate, a semiconductor layer on the buffer layer, a gate insulating layer on the semiconductor layer, a gate electrode on the gate insulating layer, an interlayer insulating layer on the entire surface of the substrate having the gate electrode, a first contact hole and a second contact hole, and source and drain electrodes on the interlayer insulating layer, insulated from the gate electrode, and having a portion connected with the semiconductor layer through the first contact hole. An organic light emitting diode display may include the thin film transistor along with a passivation layer on the entire surface of the substrate, and a first electrode, an organic layer, and a second electrode, which are on the passivation layer and electrically connected with the source and drain electrodes.
    • 薄膜晶体管包括衬底,衬底上的缓冲层,缓冲层上的半导体层,半导体层上的栅极绝缘层,栅极绝缘层上的栅极电极,整个表面上的层间绝缘层 具有栅电极的基板,第一接触孔和第二接触孔,以及与栅电极绝缘的层间绝缘层上的源电极和漏电极,并且具有通过第一接触孔与半导体层连接的部分。 有机发光二极管显示器可以包括薄膜晶体管以及在基板的整个表面上的钝化层,以及第一电极,有机层和第二电极,它们位于钝化层上并与 源极和漏极。
    • 5. 发明申请
    • AMRPHOUS SILICON CRYSTALLIZATION APPARATUS
    • 无机硅结晶装置
    • US20110139767A1
    • 2011-06-16
    • US12898195
    • 2010-10-05
    • Beong-Ju KIMJi-Su AHNCheol-Ho YU
    • Beong-Ju KIMJi-Su AHNCheol-Ho YU
    • H05B3/06H05B3/22
    • H01L21/02532H01L21/02667H01L21/67259H01L21/68H01L21/6838
    • Provided is an amorphous silicon (a-Si) crystallization apparatus for crystallizing a-Si into polysilicon (poly-Si), and more particularly, to an a-Si crystallization apparatus for crystallizing a-Si into poly-Si by applying a certain power voltage to a conductive thin film disposed on a substrate including an a-Si layer to generate joule heat, wherein the a-Si formed on the substrate can be crystallized using the same equipment regardless of the size of the substrate. The a-Si crystallization apparatus includes a process chamber, a substrate holder disposed at a lower part of the process chamber, a power voltage application part disposed at an upper part of the process chamber and including a first electrode and a second electrode having a polarity different from the first electrode, and a controller for adjusting a distance between the first and second electrode.
    • 提供了一种用于将a-Si结晶成多晶硅(poly-Si)的非晶硅(a-Si)结晶装置,更具体地说,涉及通过施加一定的功率将a-Si结晶成多晶硅的a-Si结晶装置 电压设置在包括a-Si层的基板上的导电薄膜以产生焦耳热,其中形成在基板上的a-Si可以使用相同的设备结晶,而与基板的尺寸无关。 a-Si结晶装置包括处理室,设置在处理室的下部的基板保持件,设置在处理室的上部的电源施加部,包括第一电极和具有极性的第二电极 与第一电极不同,以及用于调节第一和第二电极之间的距离的控制器。
    • 10. 发明授权
    • Method of fabricating thin film transistor by crystallization through metal layer forming source and drain electrodes
    • 通过金属层形成源极和漏极结晶化制造薄膜晶体管的方法
    • US08343796B2
    • 2013-01-01
    • US13206227
    • 2011-08-09
    • Ji-Su AhnSung-Chul Kim
    • Ji-Su AhnSung-Chul Kim
    • H01L21/00
    • H01L21/02532H01L21/02667H01L27/124H01L27/1281H01L27/3262H01L29/66757
    • A method of fabricating a thin film transistor includes patterning the amorphous semiconductor layer to form an amorphous semiconductor layer pattern, forming a gate electrode corresponding to the amorphous semiconductor layer pattern on a gate insulating layer, forming an interlayer insulating layer on the entire surface of the substrate, forming a first contact hole partially exposing the amorphous semiconductor layer pattern, forming a second contact hole partially exposing the gate electrode, and forming a metal layer on the entire surface of the substrate. The method also includes applying an electrical field to the metal layer such that a semiconductor layer is formed by crystallization of the amorphous semiconductor layer pattern, and patterning the metal layer to form source and drain electrodes that are insulated from the gate electrode and that are electrically connected with the semiconductor layer through the first contact hole.
    • 一种制造薄膜晶体管的方法,包括图案化非晶半导体层以形成非晶半导体层图案,在栅绝缘层上形成对应于非晶半导体层图案的栅电极,在该绝缘层的整个表面上形成层间绝缘层 形成部分暴露非晶半导体层图案的第一接触孔,形成部分暴露栅电极的第二接触孔,以及在基板的整个表面上形成金属层。 该方法还包括向金属层施加电场,使得通过非晶半导体层图案的结晶形成半导体层,并且图案化金属层以形成与栅电极绝缘的电极和漏电极,并且是电 通过第一接触孔与半导体层连接。