专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06465306B1 Simultaneous formation of charge storage and bitline to wordline isolation 有权
标题翻译：同时形成电荷存储和位线到字线隔离
公开(公告)号：US06465306B1
公开(公告)日：2002-10-15
申请号：US09723635
申请日：2000-11-28
申请人： Mark T. Ramsbey , Jean Y. Yang , Hidehiko Shiraiwa , Michael A. Van Buskirk , David M. Rogers , Ravi Sunkavalli , Janet Wang , Narbeh Derhacobian , Yider Wu
发明人： Mark T. Ramsbey , Jean Y. Yang , Hidehiko Shiraiwa , Michael A. Van Buskirk , David M. Rogers , Ravi Sunkavalli , Janet Wang , Narbeh Derhacobian , Yider Wu
IPC分类号： H01L21336
CPC分类号： H01L27/11568 , H01L27/105 , H01L27/115 , H01L27/11573 , Y10S438/954 , Y10S438/981
摘要： One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving the sequential or non-sequential steps of forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; removing at least a portion of the charge trapping dielectric in the periphery region; forming a gate dielectric in the periphery region; forming buried bitlines in the core region; and forming gates in the core region and the periphery region.
摘要翻译：本发明的一个方面涉及一种形成非挥发性半导体存储器件的方法，涉及在衬底上形成电荷俘获电介质的顺序或非顺序步骤，所述衬底具有芯区域和外围区域; 去除外围区域中的电荷捕获电介质的至少一部分; 在周边区域形成栅电介质; 在核心区域形成掩埋位线; 并且在芯区域和周边区域中形成栅极。

2. 发明授权

US06468865B1 Method of simultaneous formation of bitline isolation and periphery oxide 有权
标题翻译：同时形成位线隔离和周边氧化物的方法
公开(公告)号：US06468865B1
公开(公告)日：2002-10-22
申请号：US09723653
申请日：2000-11-28
申请人： Jean Y. Yang , Mark T. Ramsbey , Hidehiko Shiraiwa , Michael A. Van Buskirk , David M. Rogers , Ravi Sunkavalli , Janet Wang , Narbeh Derhacobian , Yider Wu
发明人： Jean Y. Yang , Mark T. Ramsbey , Hidehiko Shiraiwa , Michael A. Van Buskirk , David M. Rogers , Ravi Sunkavalli , Janet Wang , Narbeh Derhacobian , Yider Wu
IPC分类号： H01L21336
CPC分类号： H01L27/11568 , H01L27/115
摘要： One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving the sequential or non-sequential steps of forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; removing at least a portion of the charge trapping dielectric in the periphery region; forming a gate dielectric in the periphery region; forming buried bitlines in the core region; removing at least a portion of the charge trapping dielectric positioned over the buried bitlines in the core region; forming a bitline isolation over the buried bitlines in the core region; and forming gates in the core region and the periphery region. Another aspect of the present invention relates to increasing the thickness of the gate dielectric in at least a portion of the periphery region simultaneously while forming the bitline isolation.
摘要翻译：本发明的一个方面涉及一种形成非挥发性半导体存储器件的方法，涉及在衬底上形成电荷俘获电介质的顺序或非顺序步骤，所述衬底具有芯区域和外围区域; 去除外围区域中的电荷捕获电介质的至少一部分; 在周边区域形成栅电介质; 在核心区域形成掩埋位线; 去除位于芯区域中的掩埋位线之上的电荷捕获电介质的至少一部分; 在核心区域的掩埋位线上形成位线隔离; 并且在芯区域和周边区域中形成栅极。本发明的另一方面涉及在形成位线隔离的同时在周边区域的至少一部分中增加栅极电介质的厚度。

3. 发明授权

US06555436B2 Simultaneous formation of charge storage and bitline to wordline isolation 失效
公开(公告)号：US06555436B2
公开(公告)日：2003-04-29
申请号：US10223195
申请日：2002-08-19
申请人： Mark T. Ramsbey , Jean Y. Yang , Hidehiko Shiraiwa , Michael A. Van Buskirk , David M. Rogers , Ravi Sunkavalli , Janet Wang , Narbeh Derhacobian , Yider Wu
发明人： Mark T. Ramsbey , Jean Y. Yang , Hidehiko Shiraiwa , Michael A. Van Buskirk , David M. Rogers , Ravi Sunkavalli , Janet Wang , Narbeh Derhacobian , Yider Wu
IPC分类号： H01L21336
CPC分类号： H01L27/11568 , H01L27/105 , H01L27/115 , H01L27/11573 , Y10S438/954 , Y10S438/981
摘要： One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving the sequential or non-sequential steps of forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; removing at least a portion of the charge trapping dielectric in the periphery region; forming a gate dielectric in the periphery region; forming buried bitlines in the core region; and forming gates in the core region and the periphery region.

4. 发明授权

US06541816B2 Planar structure for non-volatile memory devices 失效
公开(公告)号：US06541816B2
公开(公告)日：2003-04-01
申请号：US09893026
申请日：2001-06-27
申请人： Mark T. Ramsbey , Jean Y. Yang , Hidehiko Shiraiwa , Michael A. Van Buskirk , David M. Rogers , Ravi S. Sunkavalli , Janet S. Wang , Narbeh Derhacobian
发明人： Mark T. Ramsbey , Jean Y. Yang , Hidehiko Shiraiwa , Michael A. Van Buskirk , David M. Rogers , Ravi S. Sunkavalli , Janet S. Wang , Narbeh Derhacobian
IPC分类号： H01L29792
CPC分类号： H01L27/11568 , H01L27/105 , H01L27/115 , H01L27/11573 , Y10S438/954 , Y10S438/981
摘要： One aspect of the present invention relates to a non-volatile semiconductor memory device, containing a substrate, the substrate having a core region and a periphery region; a charge trapping dielectric over the core region of the substrate; a gate dielectric in the periphery region of the substrate; buried bitlines under the charge trapping dielectric in the core region; and wordlines over the charge trapping dielectric in the core region, wherein the core region is substantially planar.

5. 发明授权

US06493261B1 Single bit array edges 有权
标题翻译：单位阵列边缘
公开(公告)号：US06493261B1
公开(公告)日：2002-12-10
申请号：US09795865
申请日：2001-02-28
申请人： Darlene G. Hamilton , Kulachet Tanpairoj , Ravi Sunkavalli , Narbeh Derhacobian , Michael A. Van Buskirk
发明人： Darlene G. Hamilton , Kulachet Tanpairoj , Ravi Sunkavalli , Narbeh Derhacobian , Michael A. Van Buskirk
IPC分类号： G11C1604
CPC分类号： G11C16/3409 , G11C16/0475 , G11C16/0491 , G11C16/16 , G11C16/3404 , G11C16/344 , G11C16/3445 , H01L27/115
摘要： Dummy columns of memory cells formed during fabrication outside edge columns are connected to the actual used memory cells of sectors or the like. The columns of dummy memory cells are compensated by floating the dummy memory cells during normal programming and erase cycles, or alternatively, by programming and erasing the dummy memory cells along with the actual used memory cells in the sector. By treating the dummy memory cells similar to the actual used cells, charge that leaks into the dummy cells during fabrication and normal operation that has deleterious effects at higher stress temperatures and/or due to the longevity of customer operation is substantially eliminated.
摘要翻译：在制造外边缘列时形成的存储单元的虚拟柱被连接到扇区等的实际使用的存储单元。虚拟存储单元的列通过在正常编程和擦除周期期间浮置伪存储单元来补偿，或者通过编程和擦除虚存储单元以及扇区中的实际使用的存储单元来补偿。通过处理类似于实际使用的电池的虚拟存储器单元，在制造和正常操作期间泄漏到虚拟电池中的电荷在较高应力温度和/或由于客户操作的寿命而具有有害影响的基本上被消除。

6. 发明授权

US06630384B1 Method of fabricating double densed core gates in sonos flash memory 有权
标题翻译：在sonos闪存中制造双激光核心门的方法
公开(公告)号：US06630384B1
公开(公告)日：2003-10-07
申请号：US09971483
申请日：2001-10-05
申请人： Yu Sun , Michael A. Van Buskirk , Mark T. Ramsbey
发明人： Yu Sun , Michael A. Van Buskirk , Mark T. Ramsbey
IPC分类号： H01L21336
CPC分类号： H01L27/11568 , H01L27/115
摘要： One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; forming a first set of memory cell gates over the charge trapping dielectric in the core region; forming a conformal insulation material layer around the first set of memory cell gates; and forming a second set of memory cell gates in the core region, wherein each memory cell gate of the second set of memory cell gates is adjacent to at least one memory cell gate of the first set of memory cell gates, each memory cell gate of the first set of memory cell gates is adjacent at least one memory cell gate of the second set of memory cell gates, and the conformal insulation material layer is positioned between each adjacent memory cell gate.
摘要翻译：本发明的一个方面涉及一种形成非易失性半导体存储器件的方法，包括在衬底上形成电荷俘获电介质，所述衬底具有芯区域和外围区域; 在芯区域中的电荷俘获电介质上形成第一组存储单元栅极; 在所述第一组存储单元栅极周围形成保形绝缘材料层; 以及在所述核心区域中形成第二组存储器单元栅极，其中所述第二组存储单元栅极的每个存储单元栅极与所述第一组存储单元栅极的至少一个存储单元栅极相邻，第一组存储单元栅极与第二组存储单元栅极的至少一个存储单元栅极相邻，并且保形绝缘材料层位于每个相邻的存储单元栅极之间。

7. 发明申请

US20140003125A1 Resistive Devices and Methods of Operation Thereof 有权
标题翻译：电阻器件及其操作方法
公开(公告)号：US20140003125A1
公开(公告)日：2014-01-02
申请号：US13610690
申请日：2012-09-11
申请人： Foroozan Sarah Koushan , Michael A. Van Buskirk
发明人： Foroozan Sarah Koushan , Michael A. Van Buskirk
IPC分类号： G11C11/00
CPC分类号： G11C13/003 , G11C13/0002 , G11C13/0004 , G11C13/0007 , G11C13/0009 , G11C13/0011 , G11C13/004 , G11C13/0069 , G11C2013/0071 , G11C2013/0092 , G11C2213/74 , G11C2213/79
摘要： In accordance with an embodiment of the present invention, a method of operating a resistive switching device includes applying a signal including a pulse on a first access terminal of an access device having the first access terminal and a second access terminal. The second access terminal is coupled to a first terminal of a two terminal resistive switching device. The resistive switching device has the first terminal and a second terminal. The resistive switching device has a first state and a second state. The pulse includes a first ramp from a first voltage to a second voltage over a first time period, a second ramp from the second voltage to a third voltage over a second time period, and a third ramp from the third voltage to a fourth voltage over a third time period. The second ramp and the third ramp have an opposite slope to the first ramp. The sum of the first time period and the second time period is less than the third time period.
摘要翻译：根据本发明的实施例，一种操作电阻式交换设备的方法包括：在具有第一接入终端的接入设备的第一接入终端和第二接入终端上应用包括脉冲的信号。第二接入终端耦合到两端电阻式交换设备的第一终端。电阻式开关装置具有第一端子和第二端子。电阻式开关装置具有第一状态和第二状态。脉冲包括在第一时间段内从第一电压到第二电压的第一斜坡，在第二时间段内从第二电压到第三电压的第二斜坡，以及从第三电压到第四电压的第三斜坡第三个时期。第二斜坡和第三斜坡与第一坡道具有相反的斜坡。第一时间段和第二时间段的总和小于第三时间段。

8. 发明授权

US08547738B2 Techniques for providing a semiconductor memory device 有权
标题翻译：提供半导体存储器件的技术
公开(公告)号：US08547738B2
公开(公告)日：2013-10-01
申请号：US13047097
申请日：2011-03-14
申请人： Srinivasa Rao Banna , Michael A. Van Buskirk , Timothy Thurgate
发明人： Srinivasa Rao Banna , Michael A. Van Buskirk , Timothy Thurgate
IPC分类号： G11C11/34
CPC分类号： H01L27/10802 , G11C7/00 , H01L27/105 , H01L27/1052 , H01L27/1203 , H01L29/0847 , H01L29/1029 , H01L29/1095 , H01L29/7841
摘要： Techniques for providing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. Each memory cell including a first region, a a second region, and a body region capacitively coupled to at least one word line and disposed between the first region and the second region. Each memory cell also including a third region, wherein the third region may be doped differently than the first region, the second region, and the body region.
摘要翻译：公开了一种用于提供半导体存储器件的技术。在一个特定示例性实施例中，这些技术可以被实现为包括布置成行和列阵列的多个存储器单元的半导体存储器件。每个存储单元包括电容耦合到至少一个字线并且设置在第一区域和第二区域之间的第一区域，第二区域和体区域。每个存储单元还包括第三区域，其中第三区域可以掺杂不同于第一区域，第二区域和体区域。

9. 发明授权

US08315099B2 Techniques for providing a direct injection semiconductor memory device 有权
标题翻译：提供直接注入半导体存储器件的技术
公开(公告)号：US08315099B2
公开(公告)日：2012-11-20
申请号：US12844477
申请日：2010-07-27
申请人： Michael A. Van Buskirk , Betina Hold , Wayne Ellis
发明人： Michael A. Van Buskirk , Betina Hold , Wayne Ellis
IPC分类号： G11C16/04
CPC分类号： G11C5/02 , G11C5/06 , G11C7/00 , G11C11/402 , G11C16/26 , H01L27/1023 , H01L27/10802 , H01L29/73 , H01L29/7841
摘要： Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. At least one of the plurality of memory cells may include a first region coupled to a respective bit line of the array and a second region coupled to a respective source line of the array. At least one of the plurality of memory cells may also include a body region spaced apart from and capacitively coupled to a respective word line of the array, wherein the body region may be electrically floating and disposed between the first region and the second region. At least one of the plurality of memory cells may further include a third region coupled to a respective carrier injection line of the array and wherein the respective carrier injection line may be one of a plurality of carrier injection lines in the array that are coupled to each other.
摘要翻译：公开了提供直接注入半导体存储器件的技术。在一个特定的示例性实施例中，这些技术可以被实现为包括布置成行和列阵列的多个存储单元的直接注入半导体存储器件。多个存储器单元中的至少一个可以包括耦合到阵列的相应位线的第一区域和耦合到阵列的相应源极线的第二区域。多个存储器单元中的至少一个还可以包括与阵列的相应字线间隔开并且电容耦合到阵列的相应字线的主体区域，其中主体区域可以是电浮置的并且设置在第一区域和第二区域之间。多个存储器单元中的至少一个可以进一步包括耦合到阵列的相应载流子注入线的第三区域，并且其中相应的载流子注入管线可以是阵列中耦合到每个的多个载流子注入管线之一其他。

10. 发明申请

US20110019482A1 TECHNIQUES FOR PROVIDING A DIRECT INJECTION SEMICONDUCTOR MEMORY DEVICE 有权
标题翻译：提供直接注入半导体存储器件的技术
公开(公告)号：US20110019482A1
公开(公告)日：2011-01-27
申请号：US12844477
申请日：2010-07-27
申请人： Michael A. Van Buskirk , Betina Hold , Wayne Ellis
发明人： Michael A. Van Buskirk , Betina Hold , Wayne Ellis
IPC分类号： G11C16/04
CPC分类号： G11C5/02 , G11C5/06 , G11C7/00 , G11C11/402 , G11C16/26 , H01L27/1023 , H01L27/10802 , H01L29/73 , H01L29/7841
摘要： Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a plurality of memory cells arranged in an array of rows and columns. At least one of the plurality of memory cells may include a first region coupled to a respective bit line of the array and a second region coupled to a respective source line of the array. At least one of the plurality of memory cells may also include a body region spaced apart from and capacitively coupled to a respective word line of the array, wherein the body region may be electrically floating and disposed between the first region and the second region. At least one of the plurality of memory cells may further include a third region coupled to a respective carrier injection line of the array and wherein the respective carrier injection line may be one of a plurality of carrier injection lines in the array that are coupled to each other.
摘要翻译：公开了提供直接注入半导体存储器件的技术。在一个特定的示例性实施例中，这些技术可以被实现为包括布置成行和列阵列的多个存储单元的直接注入半导体存储器件。多个存储器单元中的至少一个可以包括耦合到阵列的相应位线的第一区域和耦合到阵列的相应源极线的第二区域。多个存储器单元中的至少一个还可以包括与阵列的相应字线间隔开并且电容耦合到阵列的相应字线的主体区域，其中主体区域可以是电浮置的并且设置在第一区域和第二区域之间。多个存储器单元中的至少一个可以进一步包括耦合到阵列的相应载流子注入线的第三区域，并且其中相应的载流子注入管线可以是阵列中耦合到每个的多个载流子注入管线之一其他。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式