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    • 7. 发明申请
    • HYBRID PLASMA PROCESSING SYSTEMS
    • 混合等离子体处理系统
    • WO2013128361A1
    • 2013-09-06
    • PCT/IB2013/051506
    • 2013-02-25
    • LAM RESEARCH CORPORATIONLAM RESEARCH AGDHINDSA, Rajinder
    • DHINDSA, Rajinder
    • H01L23/60H01L23/34H01L21/3065
    • H01J37/3255H01J37/321H01J37/32568
    • A hybrid plasma processing system and methods for manufacturing and operating same are disclosed. The hybrid plasma processing system includes an RF -powered lower electrode for supporting the substrate during processing and a hybrid upper electrode disposed in a spaced-apart relationship above the lower electrode. The hybrid upper electrode may be thermally controlled and includes a first plate formed of a first material having a first electrical resistivity, a conductive grounded plate having therein a plurality of radial slots and disposed above the first plate. The conductive plate is formed of a second material having a second electrical resistivity different from the first electrical resistivity. The hybrid upper electrode also includes an RF -powered inductive coil disposed above the conductive ground plate.
    • 公开了一种混合等离子体处理系统及其制造和操作方法。 混合等离子体处理系统包括用于在处理期间支撑衬底的RF供电下电极和在下电极上方以间隔关系设置的混合上电极。 混合上电极可以是热控制的,并且包括由具有第一电阻率的第一材料形成的第一板,其中具有多个径向槽并且设置在第一板上方的导电接地板。 导电板由具有不同于第一电阻率的第二电阻率的第二材料形成。 混合上电极还包括布置在导电接地板上方的RF施力感应线圈。