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1. 发明申请

WO2006026110A2 YTTRIA INSULATOR RING FOR USE INSIDE A PLASMA CHAMBER 审中-公开
标题翻译： YTTRIA绝缘子环用于等离子体室内
公开(公告)号：WO2006026110A2
公开(公告)日：2006-03-09
申请号：PCT/US2005/028571
申请日：2005-08-12
申请人： LAM RESEARCH CORPORATION , KADKHODAYAN, Babak , DHINDSA, Rajinder , FU, Yuehong
发明人： KADKHODAYAN, Babak , DHINDSA, Rajinder , FU, Yuehong
IPC分类号： H01L21/306 , B44C1/22
CPC分类号： C04B35/505 , C04B2235/725 , C04B2235/728 , C04B2235/77 , C04B2235/9692 , H01J37/32642 , H01J2237/0206 , Y10T29/4973
摘要： A yttria insulator ring for use in a plasma processing apparatus is provided to minimize arcing between the apparatus and a ground extension, while also increasing a mean time between cleanings (MTBC). The yttria insulator ring may be located between a ground extension and a plasma generation zone, or gap, of the chamber of the apparatus, as well as between an edge ring and the ground extension. Compared to a quartz ring, the yttria insulator ring can also provide improved semiconductor substrate uniformity because of improved RF coupling as a result of decreased reactivity and increased dielectric constant.
摘要翻译：提供用于等离子体处理装置的氧化钇绝缘体环，以最小化装置和地面延伸部之间的电弧，同时也增加清洗之间的平均时间（MTBC）。氧化钇绝缘体环可以位于设备的室的接地延伸部和等离子体产生区域或间隙之间，以及边缘环和接地延伸部之间。与石英环相比，氧化钇绝缘体环也可以提供改善的半导体衬底均匀性，因为由于反应性降低和介电常数增加导致RF耦合改善。

2. 发明申请

WO2010005541A2 CLAMPED SHOWERHEAD ELECTRODE ASSEMBLY 审中-公开
标题翻译：夹式淋浴头电极组件
公开(公告)号：WO2010005541A2
公开(公告)日：2010-01-14
申请号：PCT/US2009/003953
申请日：2009-07-06
申请人： LAM RESEARCH CORPORATION , KADKHODAYAN, Babak , DHINDSA, Rajinder , DE LA LLERA, Anthony , KELLOGG, Michael, C.
发明人： KADKHODAYAN, Babak , DHINDSA, Rajinder , DE LA LLERA, Anthony , KELLOGG, Michael, C.
IPC分类号： H05H1/34 , H05H1/38 , H01L21/3065
CPC分类号： H01J37/32532 , H01J37/32091 , H01J37/3244 , H01J37/32449 , H01J37/32541 , H01J37/32568 , H01J37/32605
摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.
摘要翻译：用于半导体衬底处理中的等离子体反应室的电极组件。该组件包括上部喷头电极，该上部喷头电极包括通过夹环机械连接到背板的内电极以及通过一系列间隔开的凸轮锁附接到背板的外电极。保护环包围背板并可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以利用工具旋转以释放从外部的上表面向上延伸的凸轮销电极。为了补偿不同的热膨胀，夹环可以包括在间隔位置处的膨胀连接，这允许夹环吸收热应力。

3. 发明申请

WO2011014328A2 LIGHT-UP PREVENTION IN ELECTROSTATIC CHUCKS 审中-公开
标题翻译：静电卡匣中的防眩光
公开(公告)号：WO2011014328A2
公开(公告)日：2011-02-03
申请号：PCT/US2010/040284
申请日：2010-06-29
申请人： LAM RESEARCH CORPORATION , STEVENSON, Tom , BYUN, Daniel , ULLAL, Saurabh , KADKHODAYAN, Babak , DHINDSA, Rajinder
发明人： STEVENSON, Tom , BYUN, Daniel , ULLAL, Saurabh , KADKHODAYAN, Babak , DHINDSA, Rajinder
IPC分类号： H01L21/687 , B23Q3/15 , H02N13/00
CPC分类号： H01L21/68757 , H01J37/32541 , H01J37/3255 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L21/6875
摘要： An electrostatic chuck assembly is provided comprising a ceramic contact layer, a patterned bonding layer, an electrically conductive base plate, and a subterranean arc mitigation layer. The ceramic contact layer and the electrically conductive base plate cooperate to define a plurality of hybrid gas distribution channels formed in a subterranean portion of the electrostatic chuck assembly. Individual ones of the hybrid gas distribution channels comprise surfaces of relatively high electrical conductivity presented by the electrically conductive base plate and relatively low electrical conductivity presented by the ceramic contact layer. The subterranean arc mitigation layer comprises a layer of relatively low electrical conductivity and is formed over the relatively high conductivity surfaces of the hybrid gas distribution channels in the subterranean portion of the electrostatic chuck assembly. Semiconductor wafer processing chambers are also provided.
摘要翻译：提供了一种静电吸盘组件，其包括陶瓷接触层，图案化的接合层，导电基板和地下电弧缓和层。陶瓷接触层和导电基板共同限定形成在静电吸盘组件的地下部分中的多个混合气体分配通道。混合气体分配通道中的各个混合气体分配通道包括由导电基板呈现的相对高电导率的表面以及由陶瓷接触层呈现的相对低的电导率。地下电弧缓和层包括具有相对低电导率的层并形成在静电吸盘组件的地下部分中的混合气体分配通道的相对高导电性表面上。还提供了半导体晶圆处理室。

4. 发明申请

WO2002093616A1 HOLLOW ANODE PLASMA REACTOR AND METHOD 审中-公开
标题翻译：中空阳极等离子体反应器和方法
公开(公告)号：WO2002093616A1
公开(公告)日：2002-11-21
申请号：PCT/US2002/015427
申请日：2002-05-14
申请人： LAM RESEARCH CORPORATION , BENZING, David, W. , KADKHODAYAN, Babak
发明人： BENZING, David, W. , KADKHODAYAN, Babak
IPC分类号： H01J37/32
CPC分类号： H01J37/3244 , H01J37/32623
摘要： The plasma processing apparatus includes a plasma chamber, a first electrode, a second electrode, and a plasma containment device. The plasma containment device has a plurality of slots and is electrically coupled to the first electrode. The containment device is configured to confine plasma within an inter-electrode volume while facilitating maximum process gas flow. When plasma is generated by applying electric fields to process gas within the inter-electrode volume, the containment device electrically confines the plasma to the inter-electrode volume without significantly restricting the flow of gas from the inter-electrode volume.
摘要翻译：等离子体处理装置包括等离子体室，第一电极，第二电极和等离子体容纳装置。等离子体容纳装置具有多个狭槽并且电耦合到第一电极。容纳装置被配置为将等离子体限制在电极间体积内，同时促进最大工艺气体流量。当通过施加电场来处理电极间体积内的气体而产生等离子体时，容纳装置将等离子体电气限制在电极间的体积上，而不会明显地限制气体从电极间的体积流动。

5. 发明申请

WO2004055855A2 UNIFORM ETCH SYSTEM 审中-公开
标题翻译：均匀蚀刻系统
公开(公告)号：WO2004055855A2
公开(公告)日：2004-07-01
申请号：PCT/US2003/038617
申请日：2003-12-04
申请人： LAM RESEARCH CORPORATION , LARSON, Dean, J. , KADKHODAYAN, Babak , WU, Di , TAKESHITA, Kenji , YEN, Bi-Ming , SU, Xingcai , DENTY, William, M., Jr. , LOEWENHARDT, Peter
发明人： LARSON, Dean, J. , KADKHODAYAN, Babak , WU, Di , TAKESHITA, Kenji , YEN, Bi-Ming , SU, Xingcai , DENTY, William, M., Jr. , LOEWENHARDT, Peter
IPC分类号： H01J37/00
CPC分类号： G05D7/0664 , H01J37/3244 , H01L21/31116
摘要： An apparatus for providing different gases to different zones of a processing chamber is provided. A gas supply for providing an etching gas flow is provided. A flow splitter in fluid connection with the gas supply for splitting the etching gas flow from the gas supply into a plurality of legs is provided. A tuning gas system in fluid connection to at least one of the legs of the plurality of legs is provided.
摘要翻译：提供了一种用于向处理室的不同区域提供不同气体的装置。提供了用于提供蚀刻气体流的气体供应。提供了一种与气体供应流体连接的分流器，用于将来自气体供给的蚀刻气体流分解成多个支腿。提供了与多个腿部中的至少一个腿流体连接的调节气体系统。

6. 发明申请

WO2007019049A2 EDGE RING ASSEMBLY WITH DIELECTRIC SPACER RING 审中-公开
标题翻译：边缘环组件与电介质间隔环
公开(公告)号：WO2007019049A2
公开(公告)日：2007-02-15
申请号：PCT/US2006/028844
申请日：2006-07-24
申请人： LAM RESEARCH CORPORATION , CHANG, Jeremy , FISCHER, Andreas , KADKHODAYAN, Babak
发明人： CHANG, Jeremy , FISCHER, Andreas , KADKHODAYAN, Babak
IPC分类号： H01L21/306 , H01L21/302
CPC分类号： H01L21/467 , H01J37/32623 , Y10T29/4973
摘要： An edge ring assembly surrounds a substrate support surface in a plasma etching chamber. The edge ring assembly comprises an edge ring and a dielectric spacer ring. The dielectric spacer ring, which surrounds the substrate support surface and which is surrounded by the edge ring in the radial direction, is configured to insulate the edge ring from the baseplate. Incorporation of the edge ring assembly around the substrate support surface can decrease the buildup of polymer at the underside and along the edge of a substrate and increase plasma etching uniformity of the substrate.
摘要翻译：边缘环组件围绕等离子体蚀刻室中的衬底支撑表面。边缘环组件包括边缘环和介电隔离环。围绕基板支撑表面并且沿着径向方向被边缘环包围的介电间隔环构造成使边缘环与基板绝缘。边缘环组件围绕衬底支撑表面的结合可以降低聚合物在衬底的下侧和沿着衬底边缘的聚集，并增加衬底的等离子体蚀刻均匀性。

7. 发明公开

EP1190437A1 PLASMA PROCESSING SYSTEM, APPARATUS, AND METHOD FOR DELIVERING RF POWER TO A PLASMA PROCESSING CHAMBER 有权
标题翻译：用于等离子处理腔室的RF电源的等离子体处理装置和方法
公开(公告)号：EP1190437A1
公开(公告)日：2002-03-27
申请号：EP00948512.9
申请日：2000-06-15
申请人： LAM Research Corporation
发明人： FISCHER, Andreas , KADKHODAYAN, Babak , KUTHI, Andras
IPC分类号： H01J37/32
CPC分类号： H01J37/32174 , H01J37/32082 , H01J37/32577
摘要： The present invention provides a plasma processing apparatus, system, and method for providing RF power to a plasma processing chamber. The plasma processing system (300) includes an RF generator (310), a plasma chamber (304), a match network box (308), a first cable (314), a second cable (316), and means for electrically isolating (312) the match network box. The RF generator generates RF power for transmission to the plasma chamber. The plasma chamber receives the RF power for processing the wafer (302) and is characterized by an internal impedance during the plasma processing. The plasma chamber has one or more walls (344) for returning RF currents. The match network box is capable of receiving the RF currents and generates an impedance that matches the internal impedance of the plasma chamber to the impedance of the RF generator. The first cable is coupled between the RF generator and the match network box for transmitting RF power between the RF generator and the match network box. The second cable is coupled between the match network box and the plasma chamber for transmitting RF power between the match network and the plasma chamber. The second cable provides a return path for an RF return current from the plasma chamber to the match network box. The electrically isolating means electrically isolates the match network box from electrical contacts with the plasma chamber such that only the second cable provides the return path for the RF return current from the plasma chamber to the match network box.

8. 发明公开

EP2460179A2 LIGHT-UP PREVENTION IN ELECTROSTATIC CHUCKS 审中-公开
标题翻译：点火保护在静电吸盘
公开(公告)号：EP2460179A2
公开(公告)日：2012-06-06
申请号：EP10804865.3
申请日：2010-06-29
申请人： LAM Research Corporation
发明人： STEVENSON, Tom , BYUN, Daniel , ULLAL, Saurabh , KADKHODAYAN, Babak , DHINDSA, Rajinder
IPC分类号： H01L21/687 , B23Q3/15 , H02N13/00 , H01L21/683 , C23C16/458
CPC分类号： H01L21/68757 , H01J37/32541 , H01J37/3255 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L21/6875
摘要： An electrostatic chuck assembly is provided comprising a ceramic contact layer, a patterned bonding layer, an electrically conductive base plate, and a subterranean arc mitigation layer. The ceramic contact layer and the electrically conductive base plate cooperate to define a plurality of hybrid gas distribution channels formed in a subterranean portion of the electrostatic chuck assembly. Individual ones of the hybrid gas distribution channels comprise surfaces of relatively high electrical conductivity presented by the electrically conductive base plate and relatively low electrical conductivity presented by the ceramic contact layer. The subterranean arc mitigation layer comprises a layer of relatively low electrical conductivity and is formed over the relatively high conductivity surfaces of the hybrid gas distribution channels in the subterranean portion of the electrostatic chuck assembly. Semiconductor wafer processing chambers are also provided.

9. 发明授权

EP2301309B1 CLAMPED SHOWERHEAD ELECTRODE ASSEMBLY 有权
标题翻译：商定装纸花洒电极装置
公开(公告)号：EP2301309B1
公开(公告)日：2015-05-06
申请号：EP09794804.6
申请日：2009-07-06
申请人： Lam Research Corporation
发明人： KADKHODAYAN, Babak , DHINDSA, Rajinder , DE LA LLERA, Anthony , KELLOGG, Michael, C.
IPC分类号： H05H1/34 , H05H1/38 , H01L21/3065 , C23C16/455 , C23C16/509 , H01J37/32
CPC分类号： H01J37/32532 , H01J37/32091 , H01J37/3244 , H01J37/32449 , H01J37/32541 , H01J37/32568 , H01J37/32605

10. 发明公开

EP2301309A2 CLAMPED SHOWERHEAD ELECTRODE ASSEMBLY 有权
标题翻译：商定装纸花洒电极装置
公开(公告)号：EP2301309A2
公开(公告)日：2011-03-30
申请号：EP09794804.6
申请日：2009-07-06
申请人： Lam Research Corporation
发明人： KADKHODAYAN, Babak , DHINDSA, Rajinder , DE LA LLERA, Anthony , KELLOGG, Michael, C.
IPC分类号： H05H1/34 , H05H1/38 , H01L21/3065
CPC分类号： H01J37/32532 , H01J37/32091 , H01J37/3244 , H01J37/32449 , H01J37/32541 , H01J37/32568 , H01J37/32605
摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.

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