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1. 发明申请

WO2008076408A1 SHOWERHEAD ELECTRODE ASSEMBLY WITH GAS FLOW MODIFICATION FOR EXTENDED ELECTRODE LIFE 审中-公开
标题翻译：用于延长电极寿命的喷淋电极组件
公开(公告)号：WO2008076408A1
公开(公告)日：2008-06-26
申请号：PCT/US2007/025730
申请日：2007-12-17
申请人： LAM RESEARCH CORPORATION , AUGUSTINO, Jason , DE LA LLERA, Anthony , RONNE, Allan K. , KIM, Jaehyun , DHINDSA, Rajinder , WANG, Yen-Kun , ULLAL, Saurabh J. , NORELL, Anthony J. , COMENDANT, Keith , DENTY, William M., Jr.
发明人： AUGUSTINO, Jason , DE LA LLERA, Anthony , RONNE, Allan K. , KIM, Jaehyun , DHINDSA, Rajinder , WANG, Yen-Kun , ULLAL, Saurabh J. , NORELL, Anthony J. , COMENDANT, Keith , DENTY, William M., Jr.
IPC分类号： H01L21/3065 , C23C16/505 , H01L21/205
CPC分类号： H01L21/67069 , C23C16/45565 , C23C16/45582 , H01J37/3244 , H01J37/32449 , H01J37/32541 , H01L21/67017
摘要： A showerhead electrode assembly for a plasma processing apparatus is provided. The showerhead electrode assembly includes a first member attached to a second member. The first and second members have first and second gas passages in fluid communication. When a process gas is flowed through the gas passages, a total pressure drop is generated across the first and second gas passages. A fraction of the total pressure drop across the second gas passages is greater than a fraction of the total pressure drop across the first gas passages.
摘要翻译：提供了一种用于等离子体处理装置的喷头电极组件。喷头电极组件包括附接到第二构件的第一构件。第一和第二构件具有流体连通的第一和第二气体通道。当处理气体流过气体通道时，跨越第一和第二气体通道产生总压降。跨越第二气体通道的总压降的一小部分大于跨越第一气体通道的总压降的一部分。

2. 发明申请

WO2008048543A1 UPPER ELECTRODE BACKING MEMBER WITH PARTICLE REDUCING FEATURES 审中-公开
标题翻译：具有颗粒减少特性的上电极背部构件
公开(公告)号：WO2008048543A1
公开(公告)日：2008-04-24
申请号：PCT/US2007/021989
申请日：2007-10-16
申请人： LAM RESEARCH CORPORATION , DE LA LLERA, Anthony , RONNE, Allan, K. , KIM, Jaehyun , AUGUSTINO, Jason , DHINDSA, Rajinder , WANG, Yen-Kun , ULLAL, Saurabh, J. , NORELL, Anthony, J. , COMENDANT, Keith , DENTY, Jr., William
发明人： DE LA LLERA, Anthony , RONNE, Allan, K. , KIM, Jaehyun , AUGUSTINO, Jason , DHINDSA, Rajinder , WANG, Yen-Kun , ULLAL, Saurabh, J. , NORELL, Anthony, J. , COMENDANT, Keith , DENTY, Jr., William
IPC分类号： H01L21/205 , H01L21/203
CPC分类号： H01J37/32449 , H01J37/32009 , H01J37/32541 , H01J37/3255
摘要： Components of a plasma processing apparatus includes a backing member with gas passages attached to an upper electrode with gas passages. To compensate for the differences in coefficient of thermal expansion between the metallic backing member and upper electrode, the gas passages are positioned and sized such that they are misaligned at ambient temperature and substantially concentric at an elevated processing temperature. Non-uniform shear stresses can be generated in the elastomeric bonding material, due to the thermal expansion. Shear stresses can either be accommodated by applying an elastomeric bonding material of varying thickness or using a backing member comprising of multiple pieces.
摘要翻译：等离子体处理装置的组件包括具有气体通道的背衬构件，气体通道连接到具有气体通道的上部电极。为了补偿金属背衬构件和上部电极之间的热膨胀系数的差异，气体通道的定位和尺寸使得它们在环境温度下不对准并且在升高的处理温度下基本上同心。由于热膨胀，弹性粘合材料中可能会产生不均匀的剪切应力。剪切应力可以通过施加不同厚度的弹性粘合材料或使用包括多个片的背衬构件来适应。

3. 发明申请

WO2012039744A2 PLASMA CONFINEMENT RING ASSEMBLY FOR PLASMA PROCESSING CHAMBERS 审中-公开
标题翻译：用于等离子体处理室的等离子体约束环组件
公开(公告)号：WO2012039744A2
公开(公告)日：2012-03-29
申请号：PCT/US2011/001501
申请日：2011-08-25
申请人： LAM RESEARCH CORPORATION , DE LA LLERA, Anthony , CARMAN, David , TAYLOR, Travis, R. , ULLAL, Saurabh, J. , SINGH, Harmeet
发明人： DE LA LLERA, Anthony , CARMAN, David , TAYLOR, Travis, R. , ULLAL, Saurabh, J. , SINGH, Harmeet
IPC分类号： H01L21/3065
CPC分类号： H01L21/67069
摘要： A plasma confinement ring assembly with a single movable lower ring can be used for controlling wafer area pressure in a capacitively coupled plasma reaction chamber wherein a wafer is supported on a lower electrode assembly and process gas is introduced into the chamber by an upper showerhead electrode assembly. The assembly includes an upper ring, the lower ring, hangers, hanger caps, spacer sleeves and washers. The lower ring is supported by the hangers and is movable towards the upper ring when the washers come into contact with the lower electrode assembly during adjustment of the gap between the upper and lower electrodes. The hanger caps engage upper ends of the hangers and fit in upper portions of hanger bores in the upper ring. The spacer sleeves surround lower sections of the hangers and fit within lower portions of the hanger bores. The washers fit between enlarged heads of the hangers and a lower surface of the lower ring. The spacer sleeves are dimensioned to avoid rubbing against the inner surfaces of the hanger bores during lifting of the lower ring.
摘要翻译：可以使用具有单个可移动下环的等离子体约束环组件来控制电容耦合等离子体反应室中的晶片面积压力，其中晶片支撑在下电极组件上并且将处理气体引入该室由上部喷头电极组件组成。该组件包括上部环，下部环，衣架，衣架帽，隔套和垫圈。当调节上下电极之间的间隙时，垫圈与下电极组件接触时，下环由吊架支撑并可朝上环移动。衣架帽与衣架的上端接合并且装配在上环中的衣架孔的上部中。隔离套筒围绕吊架的下部并装配在吊架孔的下部内。垫圈放在衣架的扩大头部和下部环的下表面之间。隔离套的尺寸设计为避免在提升下环期间与悬挂孔的内表面摩擦。

4. 发明申请

WO2008063324A2 COMPONENTS FOR A PLASMA PROCESSING APPARATUS 审中-公开
标题翻译：等离子体加工设备的组件
公开(公告)号：WO2008063324A2
公开(公告)日：2008-05-29
申请号：PCT/US2007/022027
申请日：2007-10-16
申请人： LAM RESEARCH CORPORATION , DE LA LLERA, Anthony , ULLAL, Saurabh, J.
发明人： DE LA LLERA, Anthony , ULLAL, Saurabh, J.
IPC分类号： H05H1/34
CPC分类号： H01J37/32449 , H01J37/32009 , H01J37/32541 , H01J37/3255
摘要： Components for a plasma processing apparatus are provided, including fastener members adapted to accommodate the stresses generated during thermal cycling. The fasteners include deflectable spacers to accommodate forces generated by the difference in thermal expansion while minimizing generation of additional particulate contamination.
摘要翻译：提供了一种用于等离子体处理装置的部件，包括适于容纳热循环期间产生的应力的紧固件部件。紧固件包括可偏转间隔件，以适应由热膨胀差产生的力，同时最小化附加颗粒污染物的产生。

5. 发明申请

WO2010005541A2 CLAMPED SHOWERHEAD ELECTRODE ASSEMBLY 审中-公开
标题翻译：夹式淋浴头电极组件
公开(公告)号：WO2010005541A2
公开(公告)日：2010-01-14
申请号：PCT/US2009/003953
申请日：2009-07-06
申请人： LAM RESEARCH CORPORATION , KADKHODAYAN, Babak , DHINDSA, Rajinder , DE LA LLERA, Anthony , KELLOGG, Michael, C.
发明人： KADKHODAYAN, Babak , DHINDSA, Rajinder , DE LA LLERA, Anthony , KELLOGG, Michael, C.
IPC分类号： H05H1/34 , H05H1/38 , H01L21/3065
CPC分类号： H01J37/32532 , H01J37/32091 , H01J37/3244 , H01J37/32449 , H01J37/32541 , H01J37/32568 , H01J37/32605
摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.
摘要翻译：用于半导体衬底处理中的等离子体反应室的电极组件。该组件包括上部喷头电极，该上部喷头电极包括通过夹环机械连接到背板的内电极以及通过一系列间隔开的凸轮锁附接到背板的外电极。保护环包围背板并可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以利用工具旋转以释放从外部的上表面向上延伸的凸轮销电极。为了补偿不同的热膨胀，夹环可以包括在间隔位置处的膨胀连接，这允许夹环吸收热应力。

6. 发明申请

WO2012030382A2 SHOWERHEAD ELECTRODE 审中-公开
标题翻译：淋浴电极
公开(公告)号：WO2012030382A2
公开(公告)日：2012-03-08
申请号：PCT/US2011/001500
申请日：2011-08-25
申请人： LAM RESEARCH CORPORATION , DE LA LLERA, Anthony , MANKIDY, Pratik , KELLOGG, Michael C. , DHINDSA, Rajinder
发明人： DE LA LLERA, Anthony , MANKIDY, Pratik , KELLOGG, Michael C. , DHINDSA, Rajinder
IPC分类号： H01L21/3065 , H01L21/205 , H05H1/46
CPC分类号： H01R13/20
摘要： Abstract A showerhead electrode, a gasket set and an assembly thereof in plasma reaction chamber for etching semiconductor substrates are provided with improved a gas injection hole pattern, positioning accuracy and reduced warping, which leads to enhanced uniformity of plasma processing rate. A method of assembling the inner electrode and gasket set to a supporting member includes simultaneous engagement of cam locks.
摘要翻译：摘要提供了一种用于蚀刻半导体衬底的等离子体反应室中的喷头电极，垫圈组件及其组件，其具有改进的气体注入孔图案，定位精度和减小的翘曲，这导致等离子体处理速率的均匀性提高。将内部电极和垫圈组装在支撑构件上的方法包括凸轮锁的同时接合。

7. 发明申请

WO2013081844A2 MOVABLE GROUNDING ARRANGEMENTS IN A PLASMA PROCESSING CHAMBER AND METHODS THEREFOR 审中-公开
标题翻译：等离子体加工室中的可移动接地装置及其方法
公开(公告)号：WO2013081844A2
公开(公告)日：2013-06-06
申请号：PCT/US2012/065214
申请日：2012-11-15
申请人： LAM RESEARCH CORPORATION , DE LA LLERA, Anthony , KELLOG, Michael C. , MARAKHTANOV, Alexei , DHINDSA, Rajinder
发明人： DE LA LLERA, Anthony , KELLOG, Michael C. , MARAKHTANOV, Alexei , DHINDSA, Rajinder
IPC分类号： H05H1/24 , H05K13/00
CPC分类号： H01J37/32082 , H01J37/32577
摘要： A plasma processing systems having at least one plasma processing chamber, comprising a movable grounding component, an RF contact component configured to receive RF energy from an RF source when the RF source provides the RF energy to the RF contact component, and a ground contact component coupled to ground. The plasma processing system further includes an actuator operatively coupled to the movable grounding component for disposing the movable grounding component in a first position and a second position. The first position represents a position whereby the movable grounding component is not in contact with at least one of the RF contact component and the ground contact component. The second position represents a position whereby the movable grounding component is in contact with both the RF contact component and the ground contact component.
摘要翻译：一种具有至少一个等离子体处理室的等离子体处理系统，包括可移动接地部件，RF接触部件，其被配置为当RF源向RF接触部件提供RF能量时从RF源接收RF能量;以及接地部件加上地面。等离子体处理系统还包括可操作地耦合到可移动接地部件的致动器，用于将可移动接地部件设置在第一位置和第二位置。第一位置表示可移动接地部件不与RF接触部件和接地部件中的至少一个接触的位置。第二位置表示可移动接地部件与RF接触部件和接地部件接触的位置。

8. 发明申请

WO2008156562A3 SHOWERHEAD ELECTRODE ASSEMBLIES FOR PLASMA PROCESSING APPARATUSES 审中-公开
公开(公告)号：WO2008156562A3
公开(公告)日：2008-12-24
申请号：PCT/US2008/007089
申请日：2008-06-05
申请人： LAM RESEARCH CORPORATION , STEVENSON, Thomas, R. , DE LA LLERA, Anthony , ULLAL, Saurabh
发明人： STEVENSON, Thomas, R. , DE LA LLERA, Anthony , ULLAL, Saurabh
IPC分类号： C23C16/455 , C23C16/00
摘要： Showerhead electrode assemblies are disclosed, which include a showerhead electrode adapted to be mounted in an interior of a vacuum chamber; an optional backing plate attached to the showerhead electrode; a thermal control plate attached to the backing plate or to the showerhead electrode at multiple contact points across the backing plate; and at least one thermally and electrically conductive gasket separating the backing plate and the thermal control plate, or the backing plate and showerhead electrode, at the contact points. Methods of processing semiconductor substrates using the showerhead electrode assemblies are also disclosed.

9. 发明申请

WO2003057404A3 METHOD AND APPARATUS FOR APPLYING DOWNWARD FORCE ON WAFER DURING CMP 审中-公开
公开(公告)号：WO2003057404A3
公开(公告)日：2003-07-17
申请号：PCT/US2002/040942
申请日：2002-12-20
申请人： LAM RESEARCH CORPORATION
发明人： DE LA LLERA, Anthony , PHAM, Xuyen , SIU, Andrew , NGUYEN, Tuan, A. , LUONG, Tony
IPC分类号： B24B49/00
摘要： A methods and an apparatus (100) for applying a wafer (104) to a polishing belt (102) during a CMP operation includes a spindle (126) having an upper end and a lower end; a wafer carrier (106) coupled to the lower end of the spindle (126); a linear force generator (134) disposed at the upper end of the spindle (126); a load cell (124) positioned between the linear force generator and the upper end of the spindle (126); and a controller coupled to the load cell for controlling the force applied by the linear force generator.

10. 发明申请

WO2021162895A1 TUNABILITY OF EDGE PLASMA DENSITY TILT CONTROL 审中-公开
公开(公告)号：WO2021162895A1
公开(公告)日：2021-08-19
申请号：PCT/US2021/016267
申请日：2021-02-02
申请人： LAM RESEARCH CORPORATION
发明人： HOLLAND, John , PIOTROWSKI, Stephan, K. , KIM, Jaewon , MANKIDY, Pratik , YANAGAWA, Takumi , WU, Dongjun , DE LA LLERA, Anthony , JIN, Zehua
IPC分类号： H01J37/32
摘要： A plasma lining structure is used in a process chamber to block direct line-of-sight for plasma generated within to grounded surface. The plasma lining structure includes a plurality of sections to cover at least one or more portions of an inside surface of a plasma confinement structure disposed in the process chamber. The sections of the plasma lining structure are positioned between a plasma region and the sidewall of the plasma confinement structure, when the plasma lining structure and the plasma confinement structure are disposed in the plasma chamber, such that the sections directly face the plasma region.

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