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    • 4. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • WO2006011073A1
    • 2006-02-02
    • PCT/IB2005/052267
    • 2005-07-07
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.HURKX, Godefridus, A., M.AGARWAL, PrabhatHIJZEN, ErwinHUETING, Raymond, J. E.
    • HURKX, Godefridus, A., M.AGARWAL, PrabhatHIJZEN, ErwinHUETING, Raymond, J. E.
    • H01L29/08
    • H01L29/0821B82Y10/00H01L29/06H01L29/0665H01L29/0673H01L29/0676H01L29/08H01L29/423H01L29/42304H01L29/66242H01L29/737H01L29/7378
    • The invention relates to a semiconductor device (10) with a substrate (11) and a semiconductor body (12) comprising a vertical bipolar transistor with an emitter region, a base region and a collector region (1, 2, 3) of, respectively, a first conductivity type, a second conductivity type opposite to the first conductivity type and the first conductivity type, wherein the collector region (3) comprises a first sub-region (3A) bordering the base region (2) and a second sub-region (3B) bordering the first sub-region (3A) which has a lower doping concentration than the second sub-region (3B), and the transistor is provided with a gate electrode (5) which laterally borders the first sub-region (3A) and by means of which the first sub-region (3A) may be depleted. According to the invention the collector region (3) borders the surface of the semiconductor body (12), while the emitter region (1) is recessed in the semiconductor body (12), and the collector region (3) forms part of a mesa structure (6) formed at the surface of the semiconductor body (12). Such a device (10) has very favorable properties at high frequencies and high voltages and, moreover, is easy to manufacture. In a preferred embodiment the collector (3) comprises a nanowire (30) forming the mesa structure (6).
    • 本发明涉及一种具有衬底(11)和半导体本体(12)的半导体器件(10),该半导体器件包括分别具有发射极区,基极区和集电极区(1,2,3)的垂直双极晶体管 ,第一导电类型,与第一导电类型和第一导电类型相反的第二导电类型,其中集电极区域(3)包括与基极区域(2)接壤的第一子区域(3A) 与第二子区域(3A)接合的第一子区域(3A)的区域(3B),其具有比第二子区域(3B)低的掺杂浓度,并且晶体管设置有与第一子区域横向相邻的栅电极(5) 3A),并且借助于此可以使第一子区域(3A)耗尽。 根据本发明,集电极区域(3)与半导体本体(12)的表面相接触,而发射极区域(1)凹入半导体本体(12)中,并且集电极区域(3)形成台面的一部分 结构(6)形成在半导体本体(12)的表面。 这种装置(10)在高频和高电压下具有非常有利的特性,而且易于制造。 在优选实施例中,收集器(3)包括形成台面结构(6)的纳米线(30)。
    • 7. 发明申请
    • BIPOLAR TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
    • 双极晶体管及其制造方法
    • WO2006008689A1
    • 2006-01-26
    • PCT/IB2005/052260
    • 2005-07-07
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.MONTREE, Andreas, H.SLOTBOOM, Jan, W.AGARWAL, PrabhatMEUNIER-BEILLARD, Philippe
    • MONTREE, Andreas, H.SLOTBOOM, Jan, W.AGARWAL, PrabhatMEUNIER-BEILLARD, Philippe
    • H01L29/73
    • H01L29/7317H01L29/1004H01L29/365H01L29/66265H01L29/735H01L2924/0002H01L2924/00
    • The invention relates to a semiconductor device (10) with a semiconductor body (12) comprising a bipolar transistor with an emitter region (1), a base region (2) and a collector region (3) of, respectively, a first conductivity type, a second conductivity type, opposite to the first conductivity type, and the first conductivity type, wherein, viewed in projection, the emitter region (1) is positioned above or below the base region (2), and the collector region (3) laterally borders the base region (2). According to the invention, the base region (2) comprises a highly doped sub­region (2A) the doping concentration of which has a delta-shaped profile in the thickness direction, and said highly doped sub-region (2A) extends laterally as far as the collector region (3). Such a lateral bipolar transistor has excellent high-frequency properties and a relatively high breakdown voltage between the base and collector regions (2, 3), implying that the device is suitable for high power applications. The doping concentration lies preferably between about 10 19 and about 10 20 at/cm 3 , and the thickness of the sub-region (2A) lies between 1 and 15 nm and preferably between 1 and 10 nm. The invention also comprises a method of manufacturing such a device (10).
    • 本发明涉及具有半导体本体(12)的半导体器件(10),该半导体器件(12)包括分别具有第一导电类型的发射极区域(1),基极区域(2)和集电极区域(3) ,与第一导电类型相反的第二导电类型和第一导电类型,其中从投影中看,发射极区域(1)位于基极区域(2)的上方或下方,并且集电极区域(3) 横向地邻接基部区域(2)。 根据本发明,基极区域(2)包括其掺杂浓度在厚度方向上具有δ形轮廓的高掺杂子区域(2A),并且所述高度掺杂子区域(2A)横向延伸至 收集器区域(3)。 这种横向双极晶体管在基极和集电极区域(2,3)之间具有优异的高频特性和较高的击穿电压,这意味着该器件适用于高功率应用。 掺杂浓度优选在约10
    • 10. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED WITH SUCH A METHOD
    • 制造半导体器件的方法和采用这种方法获得的半导体器件
    • WO2007057796A1
    • 2007-05-24
    • PCT/IB2006/053956
    • 2006-10-27
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.MADAKASIRA, VijayaraghavanAGARWAL, PrabhatDONKERS, Johannes, J., T., M.VAN DAL, Mark
    • MADAKASIRA, VijayaraghavanAGARWAL, PrabhatDONKERS, Johannes, J., T., M.VAN DAL, Mark
    • H01L21/768
    • H01L21/76877H01L21/28525H01L21/76889H01L2221/1094
    • The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (12) which is provided with at least one semiconductor element (E) and comprising a monocrystalline silicon (1) region on top of which an epitaxial silicon region (2) is formed by providing a metal silicide region (3) on the monocrystalline silicon region (1) and a low-crystallinity silicon region (4) on top of the metal silicide region (3), after which the low-crystallinity silicon region (4) is transformed by heating into the epitaxial silicon region (2) having a high-crystallinity, during which process the metal silicide region (3) is moved from the bottom of the low-crystallinity silicon region (4) to the top of the epitaxial silicon region (2). According to the invention above the level of the metal silicide region (3) an insulating layer (5) is formed which is provided with an opening (6), the low-crystallinity silicon region (4) is deposited in the opening (6) and on top of the insulating layer (5), the part (4A, 4B) of the low-crystallinity silicon region (4) on top of the insulating layer (5) is removed by a planarization process after which the epitaxial silicon region (2) is formed. In this way an epitaxial silicon region (2), preferably a nano wire (2), is simply obtained that is provided with a metal silicide contact (region) in a self-aligned manner and that can form a part of semiconductor element (E) like a transistor.
    • 本发明涉及一种制造具有衬底(11)和半导体本体(12)的半导体器件(10)的方法,该半导体器件(12)设置有至少一个半导体元件(E)并且包括顶部的单晶硅(1)区域 其中通过在单晶硅区域(1)上提供金属硅化物区域(3)和在金属硅化物区域(3)的顶部上的低结晶度硅区域(4)形成外延硅区域(2),之后 其中低结晶度硅区域(4)通过加热转变成具有高结晶度的外延硅区域(2),在该过程中,金属硅化物区域(3)从低结晶度硅区域的底部移动 (4)到外延硅区域(2)的顶部。 根据上述本发明,金属硅化物区域(3)的水平形成有设置有开口(6)的绝缘层(5),低结晶度硅区域(4)沉积在开口(6)中, 并且在绝缘层(5)的顶部,通过平坦化工艺除去绝缘层(5)顶部上的低结晶性硅区域(4)的部分(4A,4B),之后将外延硅区域 2)。 以这种方式,简单地获得外延硅区域(2),优选纳米线(2),其以自对准方式设置有金属硅化物接触(区域),并且可以形成半导体元件(E )像晶体管。