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    • 1. 发明申请
    • BIPOLAR TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
    • 双极晶体管及其制造方法
    • WO2006008689A1
    • 2006-01-26
    • PCT/IB2005/052260
    • 2005-07-07
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.MONTREE, Andreas, H.SLOTBOOM, Jan, W.AGARWAL, PrabhatMEUNIER-BEILLARD, Philippe
    • MONTREE, Andreas, H.SLOTBOOM, Jan, W.AGARWAL, PrabhatMEUNIER-BEILLARD, Philippe
    • H01L29/73
    • H01L29/7317H01L29/1004H01L29/365H01L29/66265H01L29/735H01L2924/0002H01L2924/00
    • The invention relates to a semiconductor device (10) with a semiconductor body (12) comprising a bipolar transistor with an emitter region (1), a base region (2) and a collector region (3) of, respectively, a first conductivity type, a second conductivity type, opposite to the first conductivity type, and the first conductivity type, wherein, viewed in projection, the emitter region (1) is positioned above or below the base region (2), and the collector region (3) laterally borders the base region (2). According to the invention, the base region (2) comprises a highly doped sub­region (2A) the doping concentration of which has a delta-shaped profile in the thickness direction, and said highly doped sub-region (2A) extends laterally as far as the collector region (3). Such a lateral bipolar transistor has excellent high-frequency properties and a relatively high breakdown voltage between the base and collector regions (2, 3), implying that the device is suitable for high power applications. The doping concentration lies preferably between about 10 19 and about 10 20 at/cm 3 , and the thickness of the sub-region (2A) lies between 1 and 15 nm and preferably between 1 and 10 nm. The invention also comprises a method of manufacturing such a device (10).
    • 本发明涉及具有半导体本体(12)的半导体器件(10),该半导体器件(12)包括分别具有第一导电类型的发射极区域(1),基极区域(2)和集电极区域(3) ,与第一导电类型相反的第二导电类型和第一导电类型,其中从投影中看,发射极区域(1)位于基极区域(2)的上方或下方,并且集电极区域(3) 横向地邻接基部区域(2)。 根据本发明,基极区域(2)包括其掺杂浓度在厚度方向上具有δ形轮廓的高掺杂子区域(2A),并且所述高度掺杂子区域(2A)横向延伸至 收集器区域(3)。 这种横向双极晶体管在基极和集电极区域(2,3)之间具有优异的高频特性和较高的击穿电压,这意味着该器件适用于高功率应用。 掺杂浓度优选在约10
    • 2. 发明申请
    • SEMICONDUCTOR DEVICE WITH A BIPOLAR TRANSISTOR AND METHOD OF MANUFACTURING SUCH A DEVICE
    • 具有双极晶体管的半导体器件及制造这种器件的方法
    • WO2007036861A2
    • 2007-04-05
    • PCT/IB2006/053446
    • 2006-09-22
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.MEUNIER-BEILLARD, PhilippeDUFFY, Raymond, J.AGARWAL, PrabhatHURKX, Godefridus, A., M.
    • MEUNIER-BEILLARD, PhilippeDUFFY, Raymond, J.AGARWAL, PrabhatHURKX, Godefridus, A., M.
    • H01L29/7378H01L29/0817H01L29/66242
    • The invention relates to a semiconductor device (10) with a substrate and a semiconductor body of silicon comprising a bipolar transistor with an emitter region (1), a base region (2) and a collector region (3) which are respectively of the N-type conductivity, the P-type conductivity and the N-type conductivity by the provision of suitable doping atoms, wherein the base region (2) comprises a mixed crystal of silicon and germanium, the base region (2) is separated from the emitter region by an intermediate region (22) of silicon having a doping concentration which is lower than the doping concentration of the emitter region (1) and with a thickness smaller than the thickness of the emitter region (1) and the emitter region (1) comprises a sub-region comprising a mixed crystal of silicon and germanium which is positioned at the side of emitter region (1) remote from the intermediate region (22). According to the invention, the sub-region comprising the mixed crystal of silicon and germanium extend substantially through the whole emitter region (1) up to the interlace with the intermediate region (22) and the doping atoms of the emitter region (1) are arsenic atoms. Such a device has a very steep n-type doping profile (50) and a very steep p- type doping profile (20) at or within the intermediate region (22) and thus excellent high- frequency behavior with a high cut-off frequency (fr). Preferably the emitter region (1) is doped with an arsenic implantation (I) in its upper half, the final doping profile being formed after an RTA. The invention also comprises a method of manufacturing a device (10) according to the invention.
    • 本发明涉及一种具有衬底和硅半导体主体的半导体器件(10),该半导体主体包括具有发射极区(1),基极区(2)和集电极区( 3),其通过提供合适的掺杂原子分别具有N型导电性,P型导电性和N型导电性,其中基极区(2)包括硅和锗的混合晶体,基极区 (2)通过掺杂浓度低于发射极区域(1)的掺杂浓度并且厚度小于发射极区域(1)的厚度的中间区域(22)与发射极区域分开 )并且发射极区(1)包括包含位于发射极区(1)的远离中间区(22)侧的硅和锗的混合晶体的子区。 根据本发明,包含硅和锗的混合晶体的子区域基本上延伸穿过整个发射极区域(1),直到与中间区域(22)交织并且发射极区域(1)的掺杂原子是 砷原子。 这种器件在中间区域(22)处或内部具有非常陡峭的n型掺杂分布(50)和非常陡峭的p型掺杂分布(20),因此具有高截止频率 (FR)。 优选地,发射极区(1)在其上半部分掺杂有砷注入(I),最终的掺杂分布在RTA之后形成。 本发明还包括制造根据本发明的装置(10)的方法。
    • 4. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH A DEVICE
    • 半导体器件及其制造方法
    • WO2005117104A1
    • 2005-12-08
    • PCT/IB2005/051636
    • 2005-05-19
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.AGARWAL, PrabhatSLOTBOOM, Jan, W.DOORNBOS, Gerben
    • AGARWAL, PrabhatSLOTBOOM, Jan, W.DOORNBOS, Gerben
    • H01L21/8249
    • H01L21/8249
    • The invention relates to a semiconductor device (10) comprising a substrate (11) and a semiconductor body (1) of silicon having a semiconductor layer structure comprising, in succession, a first and a second semiconductor layer (2, 3), and having a surface region of a first conductivity type which is provided with a field effect transistor (M) with a channel of a second conductivity type, opposite to the first conductivity type, wherein the surface region is provided with source and drain regions (4A, 4B) of the second conductivity type for the field effect transistor (M) and with - interposed between said source and drain regions- a channel region (3A) with a lower doping concentration which forms part of the second semiconductor layer (3) and with a buried first-conductivity-type semiconductor region (2A), buried below the channel region (3A), with a doping concentration that is much higher than that of the channel region (3A) and which forms part of the first semiconductor layer (2). According to the invention, the semiconductor body (1) is provided not only with the field effect transistor (M) but also with a bipolar transistor (B) with emitter, base and collector regions (5A, 5B, 5C) of respectively the second, the first and the second conductivity type, and the emitter region (5A) is formed in the second semiconductor layer (3) and the base region (5B) is formed in the first semiconductor layer (2). In this way a Bi(C)MOS IC (10) is obtained which is very suitable for high-frequency applications and which is easy to manufacture using a method according to the invention. Preferably the first semiconductor layer (2) comprises Si-Ge and is delta-doped, whereas the second semiconductor layer (3) comprises strained Si.
    • 本发明涉及一种半导体器件(10),它包括具有半导体层结构的硅衬底(12)和半导体本体(1),半导体层结构依次包括第一和第二半导体层(2,3),并且具有 具有与第一导电类型相反的具有第二导电类型的沟道的场效应晶体管(M)的第一导电类型的表面区域,其中所述表面区域设置有源极和漏极区域(4A,4B) )和用于场效应晶体管(M)的第二导电类型,并且插入在所述源极和漏极区之间 - 具有较低掺杂浓度的沟道区(3A),其形成第二半导体层(3)的一部分,并且具有 埋入第一导电型半导体区域(2A),其掺杂在沟道区域(3A)的下方,掺杂浓度比沟道区域(3A)的掺杂浓度高得多,并且形成第一半导体层(2)的一部分, 。 根据本发明,半导体本体(1)不仅具有场效应晶体管(M),而且还具有双极晶体管(B),发射极,基极和集电极区域(5A,5B,5C)分别为第二 第一和第二导电类型和发射极区域(5A)形成在第二半导体层(3)中,并且基极区域(5B)形成在第一半导体层(2)中。 以这种方式获得了非常适合于高频应用并且易于使用根据本发明的方法制造的Bi(C)MOS IC(10)。 优选地,第一半导体层(2)包括Si-Ge并且是δ掺杂的,而第二半导体层(3)包括应变Si。
    • 6. 发明申请
    • CONTROLLING PARASITIC BIPOLAR GAIN IN A CMOS DEVICE
    • 在CMOS器件中控制寄生双极增益
    • WO2006040720A2
    • 2006-04-20
    • PCT/IB2005/053308
    • 2005-10-10
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.AGARWAL, PrabhatSLOTBOOM, Jan, W.
    • AGARWAL, PrabhatSLOTBOOM, Jan, W.
    • H01L27/092H01L29/08
    • H01L27/0921
    • A CMOS device comprising an n-channel MOS transistor (102) and a p­channel MOS transistor (100), defining a pair of parasitic bipolar transitors (110a, 110b) therebetween, wherein a layer (120) of doped SiGe is provided over the source region (106a) of at least one of the MOS transistors (100, 102), between the source region (106a) and the source contact (122). The layer (120) of material acts as a sink for minority carriers (holes in an N-type device) at the source, which has the effect of increasing surface recombination velocity (because the landgap of SiGe is lower than that of the Si substrate (104)), which, in turn, lowers the current gain of the respective parasitic bipolar device. As a result, the effects and/or occurrence of latch-up, and other breakdown instabilities associated with parasitic bipolar devices, can be limited.
    • 一种CMOS器件,包括在其间限定一对寄生双极晶体管(110a,110b)的n沟道MOS晶体管(102)和p沟道MOS晶体管(100),其中层 在源极区(106a)和源极接触(122)之间,在至少一个MOS晶体管(100,102)的源极区(106a)上提供掺杂的SiGe。 材料层(120)充当源极处的少数载流子(N型器件中的空穴)的汇,其具有增加表面复合速度的作用(因为SiGe的焊盘间隙低于Si衬底 (104)),这又降低了相应寄生双极器件的电流增益。 结果,与寄生双极器件相关的闩锁效应和/或出现的闩锁以及其他击穿不稳定性可能受到限制。
    • 7. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH A DEVICE
    • 半导体器件及其制造方法
    • WO2004075300A1
    • 2004-09-02
    • PCT/IB2004/050103
    • 2004-02-12
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.VAN DALEN, RobAGARWAL, PrabhatSLOTBOOM, Jan, W.KOOPS, Gerrit, E., J.
    • VAN DALEN, RobAGARWAL, PrabhatSLOTBOOM, Jan, W.KOOPS, Gerrit, E., J.
    • H01L29/08
    • H01L29/66242H01L29/7378
    • The invention relates to a semiconductor device with a substrate (11) and a semiconductor body (12) with a heterojunction bipolar, in particular npn, transistor with an emitter region (1), a base region (2) and a collector region (3), which are provided with, respectively, a first, a second and a third connection conductor (4, 5, 6), and wherein the bandgap of the base region (2) is smaller than that of the collector region (3) or of the emitter region (1), for example by the use of a silicon-germanium mixed crystal instead of pure silicon in the base region (2). Such a device is characterized by a very high speed, but its transistor shows a relatively low BVeeo. In a device (10) according to the invention the doping flux of the emitter region (1) is locally reduced by a further semiconductor region (20) of the second conductivity type which is embedded in the emitter region (1). In this way, on the one hand, a low-impedance emitter contact is ensured, while locally the Gummel number is increased without the drawbacks normally associated with such an increase. In this way, the hole current in the, npn, transistor is increased and thus the gain is decreased. The relatively high gain of a Si-Ge transistor is responsible for the low BVCeOf which is consequently avoided in a device (10) according to the invention. Preferably the further semiconductor region (20) is recessed in the emitter region (1) and said emitter region (1) preferably comprises a lower doped part that borders on the base region (2) and that is situated below the further semiconductor region (20). The invention also comprises a method of manufacturing a semiconductor device (10) according to the invention.
    • 本发明涉及具有衬底(11)和具有异质结双极性的半导体本体(12)的半导体器件,特别是具有发射极区域(1),基极区域(2)和集电极区域(3)的npn晶体管 ),其分别设置有第一,第二和第三连接导体(4,5,6),并且其中所述基极区域(2)的带隙小于所述集电极区域(3)的带隙或 的发射极区域(1),例如通过在基极区域(2)中使用硅 - 锗混合晶体代替纯硅。 这种器件的特点是非常高的速度,但其晶体管显示相对较低的BVeeo。 在根据本发明的器件(10)中,发射极区域(1)的掺杂通量被嵌入在发射极区域(1)中的第二导电类型的另外的半导体区域(20)局部地减小。 以这种方式,一方面,确保了低阻抗发射极接触,而局部地增加了Gummel数量,而没有通常与这种增加相关联的缺点。 以这种方式,npn晶体管中的空穴电流增加,因此增益降低。 Si-Ge晶体管的相对高的增益负责在本发明的器件(10)中避免的低BVCeOf。 优选地,另外的半导体区域(20)凹陷在发射极区域(1)中,并且所述发射极区域(1)优选地包括在基极区域(2)上接合并位于另外的半导体区域(20)下方的下部掺杂部分 )。 本发明还包括制造根据本发明的半导体器件(10)的方法。