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    • 2. 发明申请
    • NON-VOLATILE MEMORY DEVICE WITH IMPROVED DATA RETENTION
    • 具有改进数据保持性的非易失性存储器件
    • WO2007043010A1
    • 2007-04-19
    • PCT/IB2006/053724
    • 2006-10-10
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.VAN SCHAIJK, Robertus, T., F.AKIL, NaderSLOTBOOM, Michiel
    • VAN SCHAIJK, Robertus, T., F.AKIL, NaderSLOTBOOM, Michiel
    • H01L29/792H01L27/115H01L29/51
    • H01L27/115H01L29/513H01L29/792
    • A non-volatile memory device on a semiconductor substrate comprises a semiconductor base, and a programmable memory transistor comprising a storage stack, a control gate, source and drain regions and a channel in between source and drain. The storage stack comprises a first insulating layer (9) , a trapping layer (10) and a second insulating layer (11) . The first layer is positioned above the channel, the trapping layer above the first layer and the second layer above the trapping layer. Next, the control gate is arranged above the storage stack. The storage stack is arranged for trapping charge in the trapping layer by tunneling of charge carriers from the channel through the first layer which comprises a high-K material. The high-K material has a relatively smaller difference between the barrier height energy for electrons and the barrier height energy for holes in comparison to the difference between the barrier height energies for electrons and for holes in silicon dioxide .
    • 半导体衬底上的非易失性存储器件包括半导体基底和可编程存储晶体管,其包括存储堆叠,控制栅极,源极和漏极区域以及源极和漏极之间的沟道。 存储堆叠包括第一绝缘层(9),俘获层(10)和第二绝缘层(11)。 第一层位于通道上方,捕获层位于第一层上方,第二层位于捕获层上方。 接下来,控制门被布置在存储堆栈的上方。 存储堆叠被布置用于通过从沟道穿过包括高K材料的第一层的电荷载流子将捕获层中的电荷俘获。 与电子的势垒高度能量和二氧化硅中的空穴的差异相比,高K材料在电子的势垒高度能量和空穴的势垒高度能量之间具有相对较小的差异。
    • 3. 发明申请
    • SONOS MEMORY DEVICE AND METHOD OF OPERATING A SONOS MEMORY DEVICE
    • SONOS存储器件和操作SONOS存储器件的方法
    • WO2007135632A2
    • 2007-11-29
    • PCT/IB2007/051873
    • 2007-05-16
    • NXP B.V.VAN DUUREN, Michiel, J.VAN SCHAIJK, Robertus, T., F.AKIL, Nader
    • VAN DUUREN, Michiel, J.VAN SCHAIJK, Robertus, T., F.AKIL, Nader
    • G11C16/04G11C16/10
    • G11C16/0466G11C16/10
    • The present invention relates to a memory device, hereinafter SONOS memory device, comprising SONOS memory cells having a control gate terminal connected to a SONOS layer stack with a nitride layer, a source terminal and a drain terminal; and a programming unit, which is connected to the drain terminal and to the control gate terminal and which is configured to apply a predetermined positive drain voltage to the drain terminal of the selected SONOS memory cell and a predetermined negative gate voltage to the control gate terminal of the selected SONOS memory cell each upon receiving a programming request addressed to a selected SONOS memory cell, the drain voltage and the gate voltage being suitable for creating hot holes at a drain side of the selected SONOS memory cell in a gate-assisted band-to-band-tunneling process and for injecting the hot holes into the nitride layer of the selected SONOS memory cell, thus switching the selected SONOS memory cell from a high-V T state to a low-V T state.
    • 本发明涉及一种存储器件,以下称为SONOS存储器件,它包括具有连接到具有氮化物层的SONOS层堆叠的控制栅极端子的SONOS存储器单元,源极端子和漏极端子; 以及编程单元,其连接到所述漏极端子和所述控制栅极端子,并且被配置为向所述控制栅极端子的所选择的SONOS存储单元的漏极端子施加预定的正极漏极电压和预定的负极栅极电压 所选择的SONOS存储单元在接收到寻址到所选择的SONOS存储单元的编程请求时,所述漏极电压和栅极电压适于在门辅助带通滤波器中在所选择的SONOS存储器单元的漏极侧产生热孔, 并且用于将热孔注入到所选择的SONOS存储单元的氮化物层中,从而将所选择的SONOS存储单元从高V T T S状态切换到低V' SUB> T 状态。
    • 10. 发明申请
    • A MEMORY CELL, A MEMORY ARRAY AND A METHOD OF PROGRAMMING A MEMORY CELL
    • 存储器单元,存储器阵列和编程存储器单元的方法
    • WO2009081290A1
    • 2009-07-02
    • PCT/IB2008/053444
    • 2008-08-27
    • NXP B.V.AKIL, NaderVAN DUUREN, Michiel
    • AKIL, NaderVAN DUUREN, Michiel
    • G11C16/04H01L29/423
    • G11C16/0466H01L21/28282H01L27/11568H01L29/792
    • A method of programming a charge-trapping memory transistor (100) is disclosed. The transistor enters a first logical state by applying a first potential to the drain (107) and a second potential to the control gate (102). This causes injection of channel hot carriers of a first conductivity type. In an n-channel transistor, the potentials are positive and the transistor attains a high threshold voltage by hot electron injection. The transistor enters a second logical state by applying a fourth potential to the drain and a fifth potential of opposite polarity to the control gate. This causes charge carrier injection into the trapping structure. In an n-channel transistor, the fourth potential is positive, the fifth negative and the transistor resumes a low threshold voltage by hot hole injection.
    • 公开了一种对电荷俘获存储晶体管(100)进行编程的方法。 晶体管通过向漏极(107)施加第一电位并将第二电位施加到控制栅极(102)来进入第一逻辑状态。 这导致注入第一导电类型的通道热载体。 在n沟道晶体管中,电位为正,晶体管通过热电子注入获得高阈值电压。 晶体管通过向漏极施加第四电位而进入第二逻辑状态,并且与控制栅相反极性的第五电位。 这导致电荷载体注入陷阱结构。 在n沟道晶体管中,第四电位为正,第五负极和晶体管通过热空穴注入恢复低阈值电压。