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    • 1. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH A DEVICE
    • 半导体器件及其制造方法
    • WO2007088494A1
    • 2007-08-09
    • PCT/IB2007/050210
    • 2007-01-22
    • NXP B.V.DONKERS, Johannes, J., T., M.MEUNIER-BEILLARD, PhilippeHIJZEN, Erwin
    • DONKERS, Johannes, J., T., M.MEUNIER-BEILLARD, PhilippeHIJZEN, Erwin
    • H01L21/336H01L21/8249
    • H01L29/66628H01L21/8249H01L27/0623H01L29/6653H01L29/6656
    • The invention relates to a semiconductor device (10) with a substrate (12) and a semiconductor body (11) of silicon that is provided at one location (A) with a field effect or bipolar transistor (Tl) with a semiconductor region which forms part of the transistor (Tl) and which comprises a source or drain region of the field effect transistor or a base region of the bipolar transistor and which is adjacent to the surface of the semiconductor body (11), which semiconductor region is provided with an epitaxially thickened region. According to the invention the surface of the semiconductor body (11) is provided with another epitaxially thickened region (1) at a location (B) other than the location where the transistor is present, and said other epitaxially thickened region is provided with at least one pn-junction (2,3). If the device is provided with two pn-junctions (2,3) it allows advantageously the integration of a bipolar transistor (T2) into a device with a MOSFET (Tl). The pn-junctions in the epitaxially thickened region of the latter can be removed without difficulty, e.g. by overdoping. The invention also relates to a method of manufacturing such a device (10).
    • 本发明涉及一种半导体器件(10),其具有衬底(12)和硅的半导体本体(11),所述半导体本体(11)设置在具有场效应的一个位置(A)或具有形成半导体区域的半导体区域(Tl) 晶体管(T1)的一部分,并且其包括场效应晶体管的源极或漏极区域或双极晶体管的基极区域,并且与半导体本体(11)的表面相邻,该半导体区域设置有 外延增厚区域。 根据本发明,半导体本体(11)的表面在除了存在晶体管的位置之外的位置(B)处设置有另外的外延加厚区域(1),并且所述其它外延加厚区域至少设置有 一个pn结(2,3)。 如果该器件具有两个pn结(2,3),则有利地将双极晶体管(T2)集成到具有MOSFET(T1)的器件中。 后者的外延增稠区域中的pn结可以毫无困难地被去除,例如, 通过过度使用 本发明还涉及制造这种装置(10)的方法。
    • 5. 发明申请
    • METHOD OF MANUFACTURING A BIPOLAR TRANSISTOR AND BIPOLAR TRANSITOR OBTAINED THEREWITH
    • 制造双极晶体管的方法和获得的双极晶体管
    • WO2008001249A1
    • 2008-01-03
    • PCT/IB2007/052226
    • 2007-06-12
    • NXP B.V.HIJZEN, ErwinMEUNIER-BEILLARD, PhilippeDONKERS, Johannes, J., T., M.
    • HIJZEN, ErwinMEUNIER-BEILLARD, PhilippeDONKERS, Johannes, J., T., M.
    • H01L21/331
    • H01L29/66287H01L29/66242
    • The invention relates to a method of manufacturing a semiconductor device (10) comprising a substrate (12) and a silicon semiconductor body (11) and comprising a bipolar transistor with an emitter region (1) of a first conductivity type, a base region (2) of a second conductivity type opposite to the first conductivity type, and a collector region (3) of the first conductivity type, on the surface of the semiconductor body (11) in which the collector region (3) is formed at least an epitaxial semiconductor layer (20,21,22) being deposited in which the base region (2) is formed, on top of this an etch stop layer (15) being deposited on which a silicon low-crystalline semiconductor layer (24) is deposited in which a connection zone of the base region (2) is formed and in which at the location of an emitter region (1) to be formed an opening (7) is provided running up to the etch stop layer (15), a portion of the etch stop layer (15) covering the opening (7) being removed by means of etching and also an adjoining portion of the etch stop layer (15), a hollow being created underneath the silicon low-crystalline semiconductor layer (24) adjoining and connected the opening (7), whereinafter a high-crystalline semiconductor layer (5) is formed within the hollow. In a method according to the invention the formation of the high-crystalline semiconductor layer (5) is carried out in such a way that a part of the surface of the semiconductor body (11) adjoining the opening (7) is kept free from the high-crystalline semiconductor layer (5). In this way a high-quality device (10) is obtained in easy manner. The relevant surface is kept free using a cover layer (6) or in a preferred manner even without the use of such a layer.
    • 本发明涉及一种制造半导体器件(10)的方法,该半导体器件(10)包括衬底(12)和硅半导体本体(11),并且包括具有第一导电类型的发射极区域(1),基极区域 2)与第一导电类型相反的第二导电类型和第一导电类型的集电极区域(3),其中集电区域(3)至少形成在半导体本体(11)的表面上, 外延半导体层(20,21,22)被沉积在其中形成有基极区域(2)的上方,沉积有沉积有硅低温半导体层(24)的蚀刻停止层(15) 在其中形成基部区域(2)的连接区域,并且其中在要形成开口(7)的发射极区域(1)的位置处设置有延伸到蚀刻停止层(15)的部分 通过蚀刻去除覆盖开口(7)的蚀刻停止层(15) 以及蚀刻停止层(15)的相邻部分,在邻接和连接开口(7)的硅低温半导体层(24)下方形成中空,其后,高结晶半导体层(5)为 形成在空心中。 在根据本发明的方法中,高结晶半导体层(5)的形成是这样一种方式进行的:半导体本体(11)的与开口(7)相邻的表面的一部分保持与 高结晶半导体层(5)。 以这种方式,以容易的方式获得了高质量的装置(10)。 使用覆盖层(6)或以优选的方式即使不使用这种层也可以使相关表面保持自由。
    • 9. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED WITH SUCH A METHOD
    • 制造半导体器件的方法和采用这种方法获得的半导体器件
    • WO2007057796A1
    • 2007-05-24
    • PCT/IB2006/053956
    • 2006-10-27
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.MADAKASIRA, VijayaraghavanAGARWAL, PrabhatDONKERS, Johannes, J., T., M.VAN DAL, Mark
    • MADAKASIRA, VijayaraghavanAGARWAL, PrabhatDONKERS, Johannes, J., T., M.VAN DAL, Mark
    • H01L21/768
    • H01L21/76877H01L21/28525H01L21/76889H01L2221/1094
    • The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (12) which is provided with at least one semiconductor element (E) and comprising a monocrystalline silicon (1) region on top of which an epitaxial silicon region (2) is formed by providing a metal silicide region (3) on the monocrystalline silicon region (1) and a low-crystallinity silicon region (4) on top of the metal silicide region (3), after which the low-crystallinity silicon region (4) is transformed by heating into the epitaxial silicon region (2) having a high-crystallinity, during which process the metal silicide region (3) is moved from the bottom of the low-crystallinity silicon region (4) to the top of the epitaxial silicon region (2). According to the invention above the level of the metal silicide region (3) an insulating layer (5) is formed which is provided with an opening (6), the low-crystallinity silicon region (4) is deposited in the opening (6) and on top of the insulating layer (5), the part (4A, 4B) of the low-crystallinity silicon region (4) on top of the insulating layer (5) is removed by a planarization process after which the epitaxial silicon region (2) is formed. In this way an epitaxial silicon region (2), preferably a nano wire (2), is simply obtained that is provided with a metal silicide contact (region) in a self-aligned manner and that can form a part of semiconductor element (E) like a transistor.
    • 本发明涉及一种制造具有衬底(11)和半导体本体(12)的半导体器件(10)的方法,该半导体器件(12)设置有至少一个半导体元件(E)并且包括顶部的单晶硅(1)区域 其中通过在单晶硅区域(1)上提供金属硅化物区域(3)和在金属硅化物区域(3)的顶部上的低结晶度硅区域(4)形成外延硅区域(2),之后 其中低结晶度硅区域(4)通过加热转变成具有高结晶度的外延硅区域(2),在该过程中,金属硅化物区域(3)从低结晶度硅区域的底部移动 (4)到外延硅区域(2)的顶部。 根据上述本发明,金属硅化物区域(3)的水平形成有设置有开口(6)的绝缘层(5),低结晶度硅区域(4)沉积在开口(6)中, 并且在绝缘层(5)的顶部,通过平坦化工艺除去绝缘层(5)顶部上的低结晶性硅区域(4)的部分(4A,4B),之后将外延硅区域 2)。 以这种方式,简单地获得外延硅区域(2),优选纳米线(2),其以自对准方式设置有金属硅化物接触(区域),并且可以形成半导体元件(E )像晶体管。