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1. 发明授权

US5532484A Defective pixel signal substitution in thermal imaging systems 失效
标题翻译：热成像系统中的像素信号替代不良
公开(公告)号：US5532484A
公开(公告)日：1996-07-02
申请号：US304001
申请日：1994-09-09
申请人： Kevin N. Sweetser , Howard R. Beratan , Robert A. Owen
发明人： Kevin N. Sweetser , Howard R. Beratan , Robert A. Owen
IPC分类号： H04N5/217 , H04N5/33 , H04N5/367 , H04N7/18
CPC分类号： H04N5/367 , H04N5/33
摘要： Thermal imaging system (10) includes a focal plane array (18) having pixels (20). Signals produced by pixels (20) are addressed by integrated circuit substrate (22) and passed to video processor (24). Video processor (24) includes, among other modules, a detection and substitution module (28) that detects defective pixels (21) and substitutes the signals produced by defective pixels (21). The detection and substitution of signals produced by defective pixels (21) may be performed while viewing the thermal scene (12) or while stimulating pixels (20) with a stimulus. A thermal stimulus may be generated by a thermoelectric cooler (50) thermally coupled to integrated circuit substrate (22) and focal plane array (18). An electrical stimulus to identify defective pixels (21) may also be delivered to pixels (20) of focal plane array (18).
摘要翻译：热成像系统（10）包括具有像素（20）的焦平面阵列（18）。由像素（20）产生的信号由集成电路基板（22）寻址并传递到视频处理器（24）。除了其他模块之外，视频处理器（24）还包括检测和替换由缺陷像素（21）产生的信号的检测和替代模块（28）。可以在观看热场景（12）的同时或在刺激像素（20）的同时执行由缺陷像素（21）产生的信号的检测和替换。可以由热耦合到集成电路基板（22）和焦平面阵列（18）的热电冷却器（50）产生热刺激。用于识别缺陷像素（21）的电刺激也可以被传送到焦平面阵列（18）的像素（20）。

2. 发明授权

US5602392A Thermal crosstalk reduction for infrared detectors with common electrodes 失效
标题翻译：具有公共电极的红外探测器的热串扰降低
公开(公告)号：US5602392A
公开(公告)日：1997-02-11
申请号：US476409
申请日：1995-06-07
申请人： Robert A. Owen , William K. Walker , Steven E. Frank , Charles M. Hanson , Kevin N. Sweetser , Edward G. Meissner , Howard R. Beratan
发明人： Robert A. Owen , William K. Walker , Steven E. Frank , Charles M. Hanson , Kevin N. Sweetser , Edward G. Meissner , Howard R. Beratan
IPC分类号： H01L27/146 , H01L37/02
CPC分类号： H01L37/02 , H01L27/14623 , H01L27/1465
摘要： A hybrid thermal detector and method for producing same where the optical coating 32 of the hybrid thermal detector has elongated parallel thermal isolation stots 62 along one axis. The elongated parallel slots 62 improve the acuity, or MTF of the resultant image produced by the detector along one axis. The optical coating 32 may be corrugated, or elevated, in order to add structural support and allow mechanical compliance along the axis of the slots.
摘要翻译：一种混合式热检测器及其制造方法，其中混合热检测器的光学涂层32沿着一个轴具有细长的平行热隔离条62。细长的平行狭槽62改善由检测器沿着一个轴产生的合成图像的敏锐度或MTF。光学涂层32可以是波纹状或升高的，以便增加结构支撑并允许沿着槽的轴线的机械顺应性。

3. 发明授权

US5426304A Infrared detector thermal isolation structure and method 失效
标题翻译：红外探测器热隔离结构及方法
公开(公告)号：US5426304A
公开(公告)日：1995-06-20
申请号：US182865
申请日：1994-01-13
申请人： James F. Belcher , Robert A. Owen , Charles M. Hanson , Howard R. Beratan
发明人： James F. Belcher , Robert A. Owen , Charles M. Hanson , Howard R. Beratan
IPC分类号： G01J1/02 , G01J5/02 , G01J5/12 , G01J5/34 , H01L37/02 , G01J5/06
CPC分类号： H01L37/02
摘要： In an exemplary thermal imaging system (20, 120, 220 and 320), a thermal isolation structure (50 and 150) is disposed on an integrated circuit substrate (70 and 170) for electrically connecting and mechanically bonding a corresponding focal plane array (30, 130, and 230) of thermal sensors (40, 140, and 240). Each mesa-type structure (52, 54 and 152) includes at least one mesa conductor (56, 58, 156 and 158) that extends from the top of the mesa-type structure (52, 54 and 152) to an adjacent contact pad (72 and 74). The mesa conductors (56, 58, 156 and 158) provide both biasing voltage (V.sub.B) for the respective thermal sensor (40 and 240) and a signal flowpath (V.sub.s) for the respective thermal sensor (40 and 240). The mesa conductors (56, 58, 156 and 158) may be used to provide biasing voltage (V.sub.B) to either a single ferroelectric element (242 and 243) having a void space (277 and 279) or a pair of ferroelectric elements (42 and 44). When the focal plane array (30, 130 and 230) is bonded to the corresponding array of mesa-type structures (52, 54 and 152), a thermally isolated, but electrically conductive path is provided between electrodes (43 and 45) of the thermal sensor (40 and 240) and the corresponding contact pad (72 and 172) of the integrated circuit substrate (70 and 74).
摘要翻译：在示例性热成像系统（20,120,220和320）中，热隔离结构（50和150）设置在集成电路衬底（70和170）上，用于电连接和机械地结合相应的焦平面阵列（30 ，130和230）热传感器（40,140和240）。每个台面型结构（52,54和152）包括从台面型结构（52,54和152）的顶部延伸到相邻接触垫的至少一个台面导体（56,58,156和158）（72和74）。台面导体（56,58,156和158）为相应的热传感器（40和240）提供偏压（VB）和相应的热传感器（40和240）的信号流路（Vs）。台面导体（56,58,156和158）可用于向具有空隙空间（277和279）或一对铁电元件（42）的单个铁电元件（242和243）提供偏置电压（VB）和44）。当焦平面阵列（30,130和230）被结合到相应的台面型结构（52,54和152）阵列时，热隔离但是导电的路径被提供在电极（43和45）之间热传感器（40和240）以及集成电路基板（70和74）的相应接触焊盘（72和172）。

4. 发明授权

US5457318A Thermal detector apparatus and method using reduced thermal capacity 失效
标题翻译：热检测装置和使用降低热容量的方法
公开(公告)号：US5457318A
公开(公告)日：1995-10-10
申请号：US235413
申请日：1994-04-29
申请人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
发明人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
IPC分类号： G01J1/02 , G01J5/34 , G01J5/48 , H01L37/02 , H04N5/33 , G01J5/06
CPC分类号： G01J5/34 , H01L37/02 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144
摘要： A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
摘要翻译：热检测系统（10）包括焦平面阵列（12），热隔离结构（14）和集成电路基板（16）。焦平面阵列（12）包括热传感器（28），每个具有相关联的热敏元件（30）。热敏元件（30）与一侧耦合到红外线吸收器和公共电极组件（36），并且与设置在集成电路衬底（16）上的相关接触焊盘（20）的相对侧耦合。相邻的热敏元件（30a，30b，30c）与单个热敏元件（30a，30b，30c）的平均宽度（44,46）的至少一半的距离分开。可以在热敏元件（30a，30b，30c）上设置连续的非网状光学涂层（38），以最大程度地吸收入射到焦平面阵列（12）的热辐射。

5. 发明授权

US5436450A Infrared detector local biasing structure and method 失效
标题翻译：红外探测器局部偏置结构及方法
公开(公告)号：US5436450A
公开(公告)日：1995-07-25
申请号：US182268
申请日：1994-01-13
申请人： James F. Belcher , Robert A. Owen , Charles M. Hanson , Howard R. Beratan
发明人： James F. Belcher , Robert A. Owen , Charles M. Hanson , Howard R. Beratan
IPC分类号： G01J1/02 , G01J5/48 , H01L37/02 , H04N5/33 , G01J5/06
CPC分类号： H01L37/02
摘要： In an exemplary thermal imaging system (20, 120, 220 and 320), a thermal isolation structure (50 and 150) is disposed on an integrated circuit substrate (70 and 170) for electrically connecting and mechanically bonding a focal plane array (30 and 230) of thermal sensors (40 and 240). Each mesa-type structure (52, 54 and 152) includes at least one mesa conductor (56, 58, 156 and 158) that extends from the top of the mesa-type structure (52, 54 and 152) to an adjacent contact pad (72 and 74). The mesa conductors (56, 58, 156 and 158) provide both biasing voltage (V.sub.B) for the respective thermal sensor (40 and 240) and a signal flow path (V.sub.S) for the respective thermal sensor (40 and 240). The mesa conductors (56, 56, 156 and 158) may be used to provide biasing voltage (V.sub.B) to either a single ferroelectric element (242) or a pair of ferroelectric elements (42 and 44). When the focal plane array (30 and 230) is bonded to the corresponding array of mesa-type structures (52, 54 and 152), a thermally isolated, but electrically conductive path is provided between electrodes (43 and 45) of the thermal sensor (40 and 240) and the corresponding contact pad (72 and 172) of the integrated circuit substrate (70 and 74).
摘要翻译：在示例性热成像系统（20,120,220和320）中，热隔离结构（50和150）设置在集成电路基板（70和170）上，用于电连接和机械地结合焦平面阵列（30和 230）的热传感器（40和240）。每个台面型结构（52,54和152）包括从台面型结构（52,54和152）的顶部延伸到相邻接触垫的至少一个台面导体（56,58,156和158）（72和74）。台面导体（56,58,156和158）为相应的热传感器（40和240）提供偏压（VB）和相应的热传感器（40和240）的信号流路（VS）。台面导体（56,56,156和158）可用于向单个铁电元件（242）或一对铁电元件（42和44）提供偏置电压（VB）。当焦平面阵列（30和230）被结合到对应的台面型结构（52,54和152）阵列时，在热传感器的电极（43和45）之间提供热隔离但是导电的路径（40和240）以及集成电路基板（70和74）的对应的接触垫（72和172）。

6. 发明授权

US6087661A Thermal isolation of monolithic thermal detector 失效
标题翻译：单片热探测器的隔热
公开(公告)号：US6087661A
公开(公告)日：2000-07-11
申请号：US959943
申请日：1997-10-29
申请人： Robert A. Owen , Charles M. Hanson , Steven N. Frank , Howard R. Beratan , Scott R. Summerfelt
发明人： Robert A. Owen , Charles M. Hanson , Steven N. Frank , Howard R. Beratan , Scott R. Summerfelt
IPC分类号： G01J5/10 , G01J5/20 , G01J5/22
CPC分类号： G01J5/10 , G01J5/20
摘要： A thermal sensor (36, 84, 114) comprising a thermal assembly (44, 88, 118) and a signal flowpath (46, 90, 120). The thermal assembly (44, 88, 118) may comprise a thermally sensitive element (50) and a pair of electrodes (52, 54). The thermally sensitive element (50) may generate a signal representative of an amount of thermal radiation incident to the thermally sensitive element (50). The electrodes (52, 54) may collect the signal generated by the thermally sensitive element (50). The signal flowpath (46, 90, 120) may transmit the signal collected by the electrodes (52, 54) to the substrate (34, 82, 112). The signal flowpath (46, 90, 120) may comprise a pair of arms (56, 58, 92, 122) each extending from an electrode (52, 54) and be connected to the substrate (34, 82, 112). The arms (56, 58, 92, 122) may support the thermal assembly (44, 88, 118) in spaced relation with the substrate (34, 82, 112). The arms (56, 58, 92, 122) may be formed of a thermally insulating material.
摘要翻译：包括热组件（44,88,118）和信号流路（46,90,120）的热传感器（36,84,114）。热组件（44,88,118）可以包括热敏元件（50）和一对电极（52,54）。热敏元件（50）可以产生表示入射到热敏元件（50）的热辐射量的信号。电极（52,54）可以收集由热敏元件（50）产生的信号。信号流路（46,90,120）可以将由电极（52,54）收集的信号传送到基板（34,82,112）。信号流路（46,90,120）可以包括一对臂（56,58,92,122），每对臂从电极（52,54）延伸并连接到衬底（34,82,112）。臂（56,58,92,122）可以以与衬底（34,82,112）间隔开的关系支撑热组件（44,48,118）。臂（56,58,92,122）可以由隔热材料形成。

7. 发明授权

US5604977A Method of fabricating focal plane array 失效
标题翻译：焦平面阵列的制作方法
公开(公告)号：US5604977A
公开(公告)日：1997-02-25
申请号：US478570
申请日：1995-06-07
申请人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
发明人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
IPC分类号： G01J1/02 , G01J5/34 , G01J5/48 , H01L37/02 , H04N5/33 , H01R43/00
CPC分类号： G01J5/34 , H01L37/02 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144
摘要： A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
摘要翻译：热检测系统（10）包括焦平面阵列（12），热隔离结构（14）和集成电路基板（16）。焦平面阵列（12）包括热传感器（28），每个具有相关联的热敏元件（30）。热敏元件（30）与一侧耦合到红外线吸收器和公共电极组件（36），并且与设置在集成电路衬底（16）上的相关接触焊盘（20）的相对侧耦合。相邻的热敏元件（30a，30b，30c）与单个热敏元件（30a，30b，30c）的平均宽度（44,46）的至少一半的距离分开。可以在热敏元件（30a，30b，30c）上设置连续的非网状光学涂层（38），以最大程度地吸收入射到焦平面阵列（12）的热辐射。

8. 发明授权

US09126400B2 Negotiable instruments with intelligent microprint 有权
标题翻译：具有智能微型打印的面议仪器
公开(公告)号：US09126400B2
公开(公告)日：2015-09-08
申请号：US13289840
申请日：2011-11-04
申请人： David S. Davies , Robert A. Owen
发明人： David S. Davies , Robert A. Owen
IPC分类号： G06K19/06 , B41J3/01
CPC分类号： B41J3/01 , B41J2/01 , B41J2/442 , B41M3/14 , B42D25/21 , B42D25/30 , B42D25/405 , G06F3/1258 , G06K15/1809 , G06K15/1852 , G06Q20/042 , G06Q30/0621 , G06Q30/0635 , G06Q40/02 , H04N1/32149 , H04N2201/3236
摘要： A negotiable instrument such as a check includes a unique microprint identifier that allows for authentication while preventing unauthorized reproduction and alternation. A printing system generates the identifier after receiving a customer order for printing a plurality of negotiable instruments, to allow inclusion of information that is specific to the customer order and/or the printing process. In various embodiments, the identifier is unique to each or each subset of the plurality of negotiable instruments and facilitates authentication of each of the negotiable instruments when needed.
摘要翻译：诸如支票的可转让票据包括独特的微型打印标识符，其允许认证，同时防止未授权的再现和交替。打印系统在接收到用于打印多个可转让票据的客户订单之后生成标识符，以允许包含特定于客户订单和/或打印处理的信息。在各种实施例中，标识符对于多个可转让票据的每一个或每个子集是唯一的，并且有助于在需要时对每个可转让票据的认证。

9. 发明申请

US20130112759A1 NEGOTIABLE INSTRUMENTS WITH INTELLIGENT MICROPRINT 有权
公开(公告)号：US20130112759A1
公开(公告)日：2013-05-09
申请号：US13289840
申请日：2011-11-04
申请人： David S. Davies , Robert A. Owen
发明人： David S. Davies , Robert A. Owen
IPC分类号： G06K19/06 , B41J2/01
CPC分类号： B41J3/01 , B41J2/01 , B41J2/442 , B41M3/14 , B42D25/21 , B42D25/30 , B42D25/405 , G06F3/1258 , G06K15/1809 , G06K15/1852 , G06Q20/042 , G06Q30/0621 , G06Q30/0635 , G06Q40/02 , H04N1/32149 , H04N2201/3236
摘要： A negotiable instrument such as a check includes a unique microprint identifier that allows for authentication while preventing unauthorized reproduction and alternation. A printing system generates the identifier after receiving a customer order for printing a plurality of negotiable instruments, to allow inclusion of information that is specific to the customer order and/or the printing process. In various embodiments, the identifier is unique to each or each subset of the plurality of negotiable instruments and facilitates authentication of each of the negotiable instruments when needed.

10. 发明授权

US07122788B1 Adaptively reducing offset in a thermal imaging camera 有权
标题翻译：适应性地降低热像仪中的偏移
公开(公告)号：US07122788B1
公开(公告)日：2006-10-17
申请号：US10961975
申请日：2004-10-08
申请人： Robert A. Owen , Vicki D. Paul , Humphrey W. Ha , Roger C. Knott , Mark A. Gohlke , Charles M. Hanson
发明人： Robert A. Owen , Vicki D. Paul , Humphrey W. Ha , Roger C. Knott , Mark A. Gohlke , Charles M. Hanson
IPC分类号： G01D18/00
CPC分类号： H04N5/33 , H04N5/361 , H04N5/3651
摘要： Collecting samples to adjust a signal includes providing a shutter in an opened position to allow a detector of an infrared camera to detect infrared radiation and generate a signal corresponding to the infrared radiation. A first touchup iteration is initiated by moving the shutter to a closed position, and samples of a reference frame are collected according to a collection instruction. The shutter is then moved to the opened position. If there is a change in a state of the infrared camera, the collection instruction is adjusted in response to the change. A second touchup iteration is initiated by moving the shutter to the closed position, and samples are collected according to the adjusted collection instruction. A modification of the signal is determined in accordance with at least some of the samples.
摘要翻译：收集样品以调整信号包括在打开位置提供快门以允许红外摄像机的检测器检测红外辐射并产生对应于红外辐射的信号。通过将快门移动到关闭位置来启动第一触摸迭代，并且根据收集指令来收集参考帧的采样。然后将快门移动到打开位置。如果红外线摄像机的状态发生变化，则响应于该变化来调整收集指令。通过将快门移动到关闭位置来启动第二次触摸迭代，并且根据调整的收集指令收集样本。根据至少一些采样来确定信号的修改。

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