专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5457318A Thermal detector apparatus and method using reduced thermal capacity 失效
标题翻译：热检测装置和使用降低热容量的方法
公开(公告)号：US5457318A
公开(公告)日：1995-10-10
申请号：US235413
申请日：1994-04-29
申请人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
发明人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
IPC分类号： G01J1/02 , G01J5/34 , G01J5/48 , H01L37/02 , H04N5/33 , G01J5/06
CPC分类号： G01J5/34 , H01L37/02 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144
摘要： A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
摘要翻译：热检测系统（10）包括焦平面阵列（12），热隔离结构（14）和集成电路基板（16）。焦平面阵列（12）包括热传感器（28），每个具有相关联的热敏元件（30）。热敏元件（30）与一侧耦合到红外线吸收器和公共电极组件（36），并且与设置在集成电路衬底（16）上的相关接触焊盘（20）的相对侧耦合。相邻的热敏元件（30a，30b，30c）与单个热敏元件（30a，30b，30c）的平均宽度（44,46）的至少一半的距离分开。可以在热敏元件（30a，30b，30c）上设置连续的非网状光学涂层（38），以最大程度地吸收入射到焦平面阵列（12）的热辐射。

2. 发明授权

US5604977A Method of fabricating focal plane array 失效
标题翻译：焦平面阵列的制作方法
公开(公告)号：US5604977A
公开(公告)日：1997-02-25
申请号：US478570
申请日：1995-06-07
申请人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
发明人： James E. Robinson , James F. Belcher , Howard R. Beratan , Steven N. Frank , Charles M. Hanson , Paul O. Johnson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton , William K. Walker
IPC分类号： G01J1/02 , G01J5/34 , G01J5/48 , H01L37/02 , H04N5/33 , H01R43/00
CPC分类号： G01J5/34 , H01L37/02 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144
摘要： A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).
摘要翻译：热检测系统（10）包括焦平面阵列（12），热隔离结构（14）和集成电路基板（16）。焦平面阵列（12）包括热传感器（28），每个具有相关联的热敏元件（30）。热敏元件（30）与一侧耦合到红外线吸收器和公共电极组件（36），并且与设置在集成电路衬底（16）上的相关接触焊盘（20）的相对侧耦合。相邻的热敏元件（30a，30b，30c）与单个热敏元件（30a，30b，30c）的平均宽度（44,46）的至少一半的距离分开。可以在热敏元件（30a，30b，30c）上设置连续的非网状光学涂层（38），以最大程度地吸收入射到焦平面阵列（12）的热辐射。

3. 发明授权

US5478242A Thermal isolation of hybrid thermal detectors through an anisotropic etch 失效
标题翻译：通过各向异性蚀刻对混合热探测器进行热隔离
公开(公告)号：US5478242A
公开(公告)日：1995-12-26
申请号：US236778
申请日：1994-04-29
申请人： William K. Walker , Steven N. Frank , Charles M. Hanson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton
发明人： William K. Walker , Steven N. Frank , Charles M. Hanson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton
IPC分类号： H01L27/146 , H01L37/02 , H01L31/18
CPC分类号： H01L37/02 , H01L27/1465
摘要： A thermal isolation structure (10) is disposed between a focal plane array and an integrated circuit substrate (12). The thermal isolation structure (10) includes a mesa-type formation (16) and a mesa strip conductor (18, 26) extending from the top of the mesa-type formation (16) to an associated contact pad (14) on the integrated circuit substrate (12). After formation of the mesa-type formation (16) and the mesa strip conductor (18, 26), an anisotropic etch using the mesa strip conductor (18, 26) as an etch mask removes excess mesa material to form trimmed mesa-type formation (24) for improved thermal isolation. Bump bonding material (20) may be deposited on mesa strip conductor (18, 26) and can also be used as an etch mask during the anisotropic etch. Thermal isolation structure (100) can include mesa-type formations (102), each with a centrally located via (110) extending vertically to an associated contact pad (104) of integrated circuit substrate (106). A conductor (108) is deposited on top of mesa-type formation (102), along the walls of via (110), and overlying contact pad (104). An anisotropic etch using the conductor (108) as an etch mask removes excess mesa material (118) for improved thermal isolation.
摘要翻译：热隔离结构（10）设置在焦平面阵列和集成电路基板（12）之间。热隔离结构（10）包括从台面型结构（16）的顶部延伸到集成的台面型结构（16）的相关接触垫（14）的台面型结构（16）和台面状导体（18,26）电路基板（12）。在形成台面型结构（16）和台面状导体（18,26）之后，使用台面导体（18,26）作为蚀刻掩模的各向异性蚀刻去除多余的台面材料以形成修整的台面形成（24），用于改善热隔离。凸起接合材料（20）可以沉积在台面状导体（18,26）上，并且也可以在各向异性蚀刻期间用作蚀刻掩模。热隔离结构（100）可以包括台面型结构（102），每个都具有垂直延伸到集成电路衬底（106）的相关接触焊盘（104）的中心定位的通孔（110）。导体（108）沿着通孔（110）的壁和覆盖接触垫（104）沉积在台面型结构（102）的顶部上。使用导体（108）作为蚀刻掩模的各向异性蚀刻去除多余的台面材料（118）以改善热隔离。

4. 发明授权

US5572059A Thermal isolation of hybrid thermal detectors through an anisotropic etch 失效
标题翻译：通过各向异性蚀刻对混合热探测器进行热隔离
公开(公告)号：US5572059A
公开(公告)日：1996-11-05
申请号：US477718
申请日：1995-06-07
申请人： William K. Walker , Steven N. Frank , Charles M. Hanson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton
发明人： William K. Walker , Steven N. Frank , Charles M. Hanson , Robert J. S. Kyle , Edward G. Meissner , Robert A. Owen , Gail D. Shelton
IPC分类号： H01L27/146 , H01L37/02 , H01L27/095
CPC分类号： H01L37/02 , H01L27/1465
摘要： A thermal isolation structure (10) is disposed between a focal plane array and an integrated circuit substrate (12). The thermal isolation structure (10) includes a mesa-type formation (16) and a mesa strip conductor (18, 26) extending from the top of the mesa-type formation (16) to an associated contact pad (14) on the integrated circuit substrate (12). After formation of the mesa-type formation (16) and the mesa strip conductor (18, 26), an anisotropic etch using the mesa strip conductor (18, 26) as an etch mask removes excess mesa material to form trimmed mesa-type formation (24) for improved thermal isolation. Bump bonding material (20) may be deposited on mesa strip conductor (18, 26) and can also be used as an etch mask during the anisotropic etch. Thermal isolation structure (100) can include mesa-type formations (102), each with a centrally located via (110) extending vertically to an associated contact pad (104) of integrated circuit substrate (106). A conductor (108) is deposited on top of mesa-type formation (102), along the walls of via (110), and overlaying contact pad (104). An anistropic etch using the conductor (108) as an etch mask removes excess mesa material (118) for improved thermal isolation.
摘要翻译：热隔离结构（10）设置在焦平面阵列和集成电路基板（12）之间。热隔离结构（10）包括从台面型结构（16）的顶部延伸到集成的台面型结构（16）的相关接触垫（14）的台面型结构（16）和台面状导体（18,26）电路基板（12）。在形成台面型结构（16）和台面状导体（18,26）之后，使用台面导体（18,26）作为蚀刻掩模的各向异性蚀刻去除多余的台面材料以形成修整的台面形成（24），用于改善热隔离。凸起接合材料（20）可以沉积在台面状导体（18,26）上，并且也可以在各向异性蚀刻期间用作蚀刻掩模。热隔离结构（100）可以包括台面型结构（102），每个都具有垂直延伸到集成电路衬底（106）的相关接触焊盘（104）的中心定位的通孔（110）。导体（108）沿着通孔（110）的壁和覆盖接触焊盘（104）沉积在台面型结构（102）的顶部上。使用导体（108）作为蚀刻掩模的无捻蚀刻去除多余的台面材料（118）以改善热隔离。

5. 发明授权

US5424544A Inter-pixel thermal isolation for hybrid thermal detectors 失效
标题翻译：用于混合热探测器的像素间隔热隔离
公开(公告)号：US5424544A
公开(公告)日：1995-06-13
申请号：US235835
申请日：1994-04-29
申请人： Gail D. Shelton , James F. Belcher , Steven N. Frank , Charles M. Hanson , Edward G. Meissner , Robert A. Owen
发明人： Gail D. Shelton , James F. Belcher , Steven N. Frank , Charles M. Hanson , Edward G. Meissner , Robert A. Owen
IPC分类号： G01J5/34 , H01L37/02 , H04N5/33
CPC分类号： G01J5/34 , H01L37/02
摘要： A thermal detection system (100, 200) includes a focal plane array (102, 202), a thermal isolation structure (104, 204) and an integrated circuit substrate (106, 206). The focal plane array (102, 202) includes thermal sensors (114, 214) formed from a pyroelectric element (116, 216), such as barium strontium titanate (BST). One side of the pyroelectric element (116, 216) is coupled to a contact pad (110, 210) disposed on the integrated circuit substrate (106, 206) through a mesa strip conductor (112, 212) of the thermal isolation structure (104, 204). The other side of the pyroelectric element (116, 216) is coupled to a common electrode (120, 220). In one embodiment, slots (128) are formed in the common electrode (120) intermediate the thermal sensors (114) to improve inter-pixel thermal isolation. In another embodiment, slots (236) are formed in the optical coating (224) to improve inter-pixel thermal isolation. The common electrode (120, 220) may be formed from a thermally insulating material, such as a silicon monoxide and chromium matrix (cermet) or other metal oxide.
摘要翻译：热检测系统（100,200）包括焦平面阵列（102,202），热隔离结构（104,204）和集成电路基板（106,206）。焦平面阵列（102,202）包括由热电元件（116,216）形成的热传感器（114,214），例如钛酸锶钡（BST）。热电元件（116,216）的一侧通过热隔离结构（104,210）的台面导体（112,212）耦合到设置在集成电路基板（106,206）上的接触焊盘（110,210），204）。热电元件（116,216）的另一侧耦合到公共电极（120,220）。在一个实施例中，槽（128）形成在热传感器（114）中间的公共电极（120）中，以改进像素间热隔离。在另一个实施例中，槽（236）形成在光学涂层（224）中以改进像素间热隔离。公共电极（120,220）可以由诸如一氧化硅和铬基体（金属陶瓷）或其它金属氧化物的绝热材料形成。

6. 发明授权

US5602392A Thermal crosstalk reduction for infrared detectors with common electrodes 失效
标题翻译：具有公共电极的红外探测器的热串扰降低
公开(公告)号：US5602392A
公开(公告)日：1997-02-11
申请号：US476409
申请日：1995-06-07
申请人： Robert A. Owen , William K. Walker , Steven E. Frank , Charles M. Hanson , Kevin N. Sweetser , Edward G. Meissner , Howard R. Beratan
发明人： Robert A. Owen , William K. Walker , Steven E. Frank , Charles M. Hanson , Kevin N. Sweetser , Edward G. Meissner , Howard R. Beratan
IPC分类号： H01L27/146 , H01L37/02
CPC分类号： H01L37/02 , H01L27/14623 , H01L27/1465
摘要： A hybrid thermal detector and method for producing same where the optical coating 32 of the hybrid thermal detector has elongated parallel thermal isolation stots 62 along one axis. The elongated parallel slots 62 improve the acuity, or MTF of the resultant image produced by the detector along one axis. The optical coating 32 may be corrugated, or elevated, in order to add structural support and allow mechanical compliance along the axis of the slots.
摘要翻译：一种混合式热检测器及其制造方法，其中混合热检测器的光学涂层32沿着一个轴具有细长的平行热隔离条62。细长的平行狭槽62改善由检测器沿着一个轴产生的合成图像的敏锐度或MTF。光学涂层32可以是波纹状或升高的，以便增加结构支撑并允许沿着槽的轴线的机械顺应性。

7. 发明授权

US5559332A Thermal detector and method 失效
标题翻译：热探测器和方法
公开(公告)号：US5559332A
公开(公告)日：1996-09-24
申请号：US334666
申请日：1994-11-04
申请人： Edward G. Meissner , Howard R. Beratan
发明人： Edward G. Meissner , Howard R. Beratan
IPC分类号： H01L27/16 , H04N5/33 , G01J5/02 , H01L27/02 , H01L31/00
CPC分类号： H01L27/16 , H04N5/33
摘要： A thermal imaging system (10) for providing an image representative of an amount of thermal radiation incident to the system is provided. The system (10) includes a thermal detector (28 or 30) made from a layer of temperature sensitive material forming a first element of a signal-producing circuit (54). The first element (28 or 30) has either a resistance or capacitance value depending on its temperature. The system (10) also includes an integrated circuit substrate (32) having a second element (56, 58, 62, or 64) of the signal-producing circuit (54) complementary and electrically coupled to the first element (28 or 30). The signal-producing circuit (54) may produce an output signal having a frequency. The frequency of the output signal is monitored as representing an absolute temperature of the detector (28 or 30) so as to determine the amount of thermal energy incident to the system (10).
摘要翻译：提供一种用于提供表示入射到系统的热辐射量的图像的热成像系统（10）。系统（10）包括由形成信号产生电路（54）的第一元件的感温材料层制成的热检测器（28或30）。第一个元件（28或30）的电阻或电容值取决于其温度。系统（10）还包括集成电路基板（32），其具有互补且电耦合到第一元件（28或30）的信号产生电路（54）的第二元件（56,58,62或64）。信号产生电路（54）可以产生具有频率的输出信号。监视输出信号的频率，表示检测器（28或30）的绝对温度，以便确定入射到系统（10）的热能的量。

8. 发明授权

US5708269A Thermal detector and method 失效
标题翻译：热探测器和方法
公开(公告)号：US5708269A
公开(公告)日：1998-01-13
申请号：US693770
申请日：1996-08-07
申请人： Edward G. Meissner , Charles M. Hanson
发明人： Edward G. Meissner , Charles M. Hanson
IPC分类号： G01J5/22 , G01J5/34 , H01L37/02 , H04N5/33 , H01L31/09
CPC分类号： H01L37/02 , G01J5/22 , G01J5/34 , H04N5/33
摘要： A thermal imaging system (10) for providing an image representative of an amount of thermal radiation incident to the system is provided. The system (10) includes a thermal detector (28 or 30) made from a layer of temperature sensitive material forming a first element of a signal-producing circuit (54). The first element (28 or 30) has either a resistance or capacitance value depending on its temperature. The system (10) also includes an integrated circuit substrate (32) having a second element (56 or 58) of the signal-producing circuit (54) complementary and electrically coupled to the first element (28 or 30). The signal-producing circuit (54) may produce an output signal having a amplitude. The amplitude of the output signal is monitored as representing an absolute temperature of the detector (28 or 30) so as to determine the amount of thermal energy incident to the system (10).
摘要翻译：提供一种用于提供表示入射到系统的热辐射量的图像的热成像系统（10）。系统（10）包括由形成信号产生电路（54）的第一元件的感温材料层制成的热检测器（28或30）。第一个元件（28或30）的电阻或电容值取决于其温度。系统（10）还包括集成电路基板（32），其具有互补且电耦合到第一元件（28或30）的信号产生电路（54）的第二元件（56或58）。信号产生电路（54）可以产生具有振幅的输出信号。监测输出信号的振幅，表示检测器（28或30）的绝对温度，以便确定入射到系统（10）的热能的量。

9. 发明授权

US5047644A Polyimide thermal isolation mesa for a thermal imaging system 失效
标题翻译：用于热成像系统的聚酰亚胺热隔离台面
公开(公告)号：US5047644A
公开(公告)日：1991-09-10
申请号：US387918
申请日：1989-07-31
申请人： Edward G. Meissner , Robert A. Owen , Mary E. Cronin
发明人： Edward G. Meissner , Robert A. Owen , Mary E. Cronin
IPC分类号： G01J5/48 , H01L37/02 , H04N5/33
CPC分类号： H01L37/02
摘要： A mesa (31) is formed from polyimide (or a similar polymer material) to achieve a high thermal resistance. In an exemplary thermal imaging application, an array of thermal isolation mesa structures (30) are disposed on an integrated circuit substrate (20) for electrically connecting and bonding a corresponding focal plane array (5) of thermal sensors (10). Each mesa structure (30) includes a polyimide mesa (31) over which is formed a metal conductor (32) that extends from the top of the mesa down a mesa sidewall to an adjacent IC contact pad (22). When the focal plane array (5) is bonded to the corresponding array of thermal isolation mesa structure (30), a thermally isolated, but electrically conductive path is provided between the sensor signal electrode (16) of the thermal sensor (10) and the corresponding contact pad (22) of the integrated circuit substrate (20).

10. 发明授权

US5264326A Polyimide thermal isolation mesa for a thermal imaging system 失效
标题翻译：用于热成像系统的聚酰亚胺热隔离台面
公开(公告)号：US5264326A
公开(公告)日：1993-11-23
申请号：US741205
申请日：1991-07-30
申请人： Edward G. Meissner , Robert A. Owen , Mary E. Cronin
发明人： Edward G. Meissner , Robert A. Owen , Mary E. Cronin
IPC分类号： H01L37/02 , G03C5/00
CPC分类号： H01L37/02
摘要： A mesa (31) is formed from polyimide (or a similar polymer material) to achieve a high thermal resistance. In an exemplary thermal imaging application, an array of thermal isolation mesa structures (30) are disposed on an integrated circuit substrate (20) for electrically connecting and bonding a corresponding focal plane array (5) of thermal sensors (10). Each mesa structure (30) includes a polyimide mesa (31) over which is formed a metal conductor (32) that extends from the top of the mesa down a mesa sidewall to an adjacent IC contact pad (22). When the focal plane array (5) is bonded to the corresponding array of thermal isolation mesa structures (30), a thermally isolated, but electrically conductive path is provided between the sensor signal electrode (16) of the thermal sensor (10) and the corresponding contact pad (22) of the integrated circuit substrate (20).
摘要翻译：台面（31）由聚酰亚胺（或类似的聚合物材料）形成以获得高耐热性。在示例性热成像应用中，热隔离台面结构（30）的阵列设置在集成电路基板（20）上，用于电连接和结合相应的热传感器（10）的焦平面阵列（5）。每个台面结构（30）包括聚酰亚胺台面（31），在其上形成金属导体（32），金属导体从台面的顶部向下延伸到台面侧壁到相邻的IC接触垫（22）。当焦平面阵列（5）结合到相应的热隔离台面结构（30）阵列时，在热传感器（10）的传感器信号电极（16）和热传感器集成电路基板（20）的相应的接触焊盘（22）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式