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热词
    • 4. 发明授权
    • Method for packaging electronic parts and adhesive for use in said method
    • 用于包装用于所述方法的电子部件和粘合剂的方法
    • US5137936A
    • 1992-08-11
    • US558236
    • 1990-07-26
    • Takashi AkiguchiYukio MaedaDaisuke Irii
    • Takashi AkiguchiYukio MaedaDaisuke Irii
    • H05K3/34C08F2/46C08G59/00C08G59/18C09D4/06C09J4/02C09J163/00H05K3/30
    • H05K3/305C09D4/06H05K2201/10636Y02P70/611Y02P70/613
    • An adhesive composition comprising 10 to 60 parts by weight per 100 parts of the total weight of components (1) to (4) of a monofunctional (meth)acrylic monomer, 0.01 to 10 parts by weight per 100 parts of the total weight of components (1) to (4) of a compound having at least two (meth)acryloyl groups in a molecule, 30 to 80 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a heat resistant epoxy resin, 0.1 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of an imidazole compound, 0.001 to 10 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a photopolymerization initiator, and 0.01 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a thixotropic agent, with which an electronic part can be effectively packaged to a printed board.
    • 一种粘合剂组合物,其包含每100份单官能(甲基)丙烯酸单体的组分(1)至(4))的总重量为10至60重量份,相对于每100份组分的总重量为0.01至10重量份 在分子中具有至少两个(甲基)丙烯酰基的化合物的(1)〜(4)中,相对于热成分(1)〜(4)的总重量的100重量份,为30〜80重量份 相对于100重量份的咪唑化合物的组分(1)〜(4)的总重量为0.1〜20重量份,相对于100重量份的组分 (1)〜(4),相对于触变剂的成分(1)〜(4)的总重量的100重量份为0.01〜20重量份,电子部件能够有效地 包装到印刷板上。