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1. 发明申请

US20070030791A1 Probe memory device and positioning method therefor 审中-公开
标题翻译：探头存储器及其定位方法
公开(公告)号：US20070030791A1
公开(公告)日：2007-02-08
申请号：US11483093
申请日：2006-07-10
申请人： Takehiko Hasebe , Yasushi Goto , Kiyoko Yamanaka
发明人： Takehiko Hasebe , Yasushi Goto , Kiyoko Yamanaka
IPC分类号： G11B9/00
CPC分类号： G11B9/1436 , B82Y10/00
摘要： In a probe memory device, a technique of realizing consistency of high-density recording and high-speed reading/writing is provided. A recording medium is placed to a probe array chip on which a plurality of probes are arranged in such a way as to maintain a constant spacing thereto by adopting a high-stiffness elastic support structure. The recording medium is equipped with a stage scanner that is driven continuously while drawing a constant trajectory on an X-Y plane almost in parallel to a probe array chip plane. The probes are equipped with respective actuators each being driven in a Z direction almost perpendicular to the X-Y plane. Each of the probes is made to write or read by altering a distance between the probe and the recording medium in parallel processing. The X-Y actuator is controlled so that the probe may continue a predetermined cyclic movement. Moreover, a tracking area is provided in a portion of the recording medium, and a trajectory of the probe by actuation is controlled so as to have a fixed geometry.
摘要翻译：在探针存储装置中，提供了实现高密度记录和高速读/写一致性的技术。将记录介质放置在探针阵列芯片上，通过采用高刚度弹性支撑结构，多个探针以其保持恒定间隔的方式布置在其上。记录介质配备有台式扫描仪，其在与探针阵列芯片平面几乎平行的X-Y平面上绘制恒定轨迹的同时连续驱动。探头配备有各自的致动器，每个致动器沿着几乎垂直于X-Y平面的Z方向驱动。通过在并行处理中改变探头和记录介质之间的距离，使每个探针进行写入或读取。控制X-Y致动器，使得探头可以继续预定的循环运动。此外，在记录介质的一部分中设置有跟踪区域，并且通过致动来控制探测器的轨迹以具有固定的几何形状。

2. 发明授权

US06744135B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US06744135B2
公开(公告)日：2004-06-01
申请号：US10147073
申请日：2002-05-17
申请人： Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
发明人： Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
IPC分类号： H01L2334
CPC分类号： H01L24/16 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L23/49822 , H01L23/49833 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/29139 , H01L2224/2929 , H01L2224/32057 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83385 , H01L2224/83851 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0206 , H05K1/0207 , H05K1/021 , H05K1/056 , H05K1/144 , H05K3/384 , H05K3/4608 , H05K3/4641 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H01L2924/05432 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
摘要翻译：本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子电子部件连接。在电子设备中，具有高导热性的部件被布置成与金属板和电子部件两者接触。因此，电子设备的散热性提高。

3. 发明授权

US07567019B2 Actuator system 失效
标题翻译：执行器系统
公开(公告)号：US07567019B2
公开(公告)日：2009-07-28
申请号：US11907057
申请日：2007-10-09
申请人： Kiyoko Yamanaka , Yasushi Goto , Takehiko Hasebe
发明人： Kiyoko Yamanaka , Yasushi Goto , Takehiko Hasebe
IPC分类号： H01L41/08
CPC分类号： H02N2/028 , B82Y10/00 , G11B9/1436 , H02N2/021
摘要： An actuator using a piezoelectric element is stably operated at high speed. The actuator includes driving units provided to face a carrier stage and moving the carrier stage in an X-axis direction, piezoelectric elements provided to the driving units respectively and expanding and contracting in the X-axis direction, a carrier electrode provided on a surface of the carrier stage on a driving-unit side, and driving electrodes provided on surfaces of the driving units on a carrier stage side and electrostatically adsorbing the carrier electrode. Signals not synchronized with each other are applied to the piezoelectric elements.
摘要翻译：使用压电元件的致动器稳定地高速运转。致动器包括驱动单元，其被设置为面向载物台并沿着X轴方向移动载物台，分别设置在驱动单元上并沿X轴方向扩张和收缩的压电元件，设置在载体台的表面上的载体电极驱动单元侧的载体台和设置在载体台一侧的驱动单元的表面上的驱动电极，并静电吸附载体电极。不同步的信号被施加到压电元件。

4. 发明申请

US20090008128A1 ELECTRONIC APPARATUS 审中-公开
标题翻译：电子设备
公开(公告)号：US20090008128A1
公开(公告)日：2009-01-08
申请号：US12184119
申请日：2008-07-31
申请人： Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
发明人： Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
IPC分类号： H05K1/00
CPC分类号： H01L24/16 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L23/49822 , H01L23/49833 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/29139 , H01L2224/2929 , H01L2224/32057 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83385 , H01L2224/83851 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0206 , H05K1/0207 , H05K1/021 , H05K1/056 , H05K1/144 , H05K3/384 , H05K3/4608 , H05K3/4641 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H01L2924/05432 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
摘要翻译：本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子电子部件连接。在电子设备中，具有高导热性的部件被布置成与金属板和电子部件都接触。因此，电子设备的散热性提高。

5. 发明申请

US20050173532A1 Semiconductor chip with coil antenna and communication system 有权
标题翻译：半导体芯片采用线圈天线和通讯系统
公开(公告)号：US20050173532A1
公开(公告)日：2005-08-11
申请号：US11030058
申请日：2005-01-07
申请人： Takehiko Hasebe , Yasushi Goto , Kouichi Uesaka , Yoshiaki Yazawa , Makoto Torigoe
发明人： Takehiko Hasebe , Yasushi Goto , Kouichi Uesaka , Yoshiaki Yazawa , Makoto Torigoe
IPC分类号： G06K19/07 , G06K19/077 , H01F17/04 , H01L21/822 , H01L23/48 , H01L23/522 , H01L23/538 , H01L27/04 , H01Q1/22 , H01Q7/00 , H01Q7/06 , G06K7/08 , G06K19/06
CPC分类号： H01Q1/2225 , G06K7/10178 , G06K19/07749 , G06K19/07756 , G06K19/07775 , G06K19/07779 , G06K19/07783 , G06K19/07784 , H01L23/48 , H01L23/5227 , H01L2223/6677 , H01L2224/04105 , H01L2924/0002 , H01L2924/3011 , H01Q1/22 , H01Q7/00 , H01L2924/00
摘要： The present invention intends to prevent the communication distance from becoming shorter with a reduction in size of a coil antenna to the chip size and with a consequent decrease of an induced voltage. According to the present invention there is provided a semiconductor chip having a coil antenna and a circuit surface and adapted to transmit and receive signals by radio to and from an external device. The semiconductor chip has a configuration for increasing an electromagnetic coupling coefficient between the coil antenna and the external device. According to a concrete example thereof, a magnetic material is disposed, the coil antenna is formed by a stacked structure comprising plural conductor layers and insulating layers superimposed one on another, or the coil antenna is disposed outside an external form of a circuit of the semiconductor chip.
摘要翻译：本发明旨在通过将线圈天线的尺寸减小到芯片尺寸以及由此导致的感应电压降低来防止通信距离变短。根据本发明，提供一种具有线圈天线和电路表面的半导体芯片，其适于通过无线电向外部设备发送和接收信号。半导体芯片具有用于增加线圈天线和外部设备之间的电磁耦合系数的配置。根据其具体实例，设置磁性材料，线圈天线由包括多个导体层和彼此重叠的绝缘层的堆叠结构形成，或者线圈天线设置在半导体的电路的外部形式的外部芯片。

6. 发明授权

US06506982B1 Multi-layer wiring substrate and manufacturing method thereof 失效
公开(公告)号：US06506982B1
公开(公告)日：2003-01-14
申请号：US09501596
申请日：2000-02-10
申请人： Hidetaka Shigi , Naoya Kitamura , Masashi Nishiki , Tetsuya Yamazaki , Takehiko Hasebe , Masayuki Kyooi , Yukio Maeda
发明人： Hidetaka Shigi , Naoya Kitamura , Masashi Nishiki , Tetsuya Yamazaki , Takehiko Hasebe , Masayuki Kyooi , Yukio Maeda
IPC分类号： H05K111
CPC分类号： H05K3/403 , H01L2224/16237 , H05K1/056 , H05K3/045 , H05K3/42 , H05K3/445 , H05K3/4608 , H05K2201/09636 , H05K2201/09645 , H05K2201/09809 , H05K2201/09854
摘要： A multi-layer wiring substrate capable of high density packaging, and a method of manufacturing the same, in which a carrier substrate, in which through holes can be easily formed in high density corresponding substantially to a pitch of connecting terminals in a semiconductor chip, and build-up layers are formed on the substrate with the application of a conventional build-up technique. When the build-up technique for repeatedly forming insulating layers and wiring layers on a carrier substrate is used to manufacture a multi-layer wiring substrate, the carrier substrate is formed in the following manner. First, an insulating resin layer is formed in a copper foil, in which a plurality of first windows are regularly provided, to cover the copper foil, and the resin layer fills the interior of the windows. Subsequently, second windows of a particular shape are provided in regions of layers of the insulating resin filled in the windows, and independent conducting paths are formed through the second windows to extend from front sides of the second windows to back sides thereof. The conducting paths are formed radially to be spaced a substantially equal distance from centers of the respective second windows.

7. 发明申请

US20120312126A1 Metal Recovery Method and Dialysis Device 有权
标题翻译：金属回收方法和透析装置
公开(公告)号：US20120312126A1
公开(公告)日：2012-12-13
申请号：US13574253
申请日：2010-11-19
申请人： Yoshihide Yamaguchi , Takehiko Hasebe , Yasuko Yamada
发明人： Yoshihide Yamaguchi , Takehiko Hasebe , Yasuko Yamada
IPC分类号： C22B26/12 , C22B5/00
CPC分类号： C22B26/12 , B01D61/246 , B01D61/30 , B01D63/16 , B01D2315/02 , C22B7/006 , C22B7/007 , H01M10/54 , Y02P10/234 , Y02W30/84
摘要： Provided is a valuable-metal recovery method for recovering metals from lithium ion batteries using comparatively simple equipment and without using a cumbersome process. In said method, a positive electrode material from lithium ion batteries, containing lithium and a transition metal, is dissolved in an acidic solution, thereby generating lithium ions and ions of the transition metal in the acidic solution. Said acidic solution and a recovery liquid are then made to flow with an anion-permeable membrane interposed therebetween, causing the lithium ions to permeate from the acidic solution to recovery solution. Lithium ions are then recovered from the recovery liquid containing dissolved lithium ions.
摘要翻译：提供了一种用于使用相对简单的设备从不使用麻烦的方法从锂离子电池中回收金属的有价值的金属回收方法。在所述方法中，将含有锂和过渡金属的锂离子电池的正极材料溶解在酸性溶液中，从而在酸性溶液中产生过渡金属的锂离子和离子。然后使所述酸性溶液和回收液体与其间插入阴离子可渗透膜流动，导致锂离子从酸性溶液渗透到回收溶液中。然后从含有溶解的锂离子的回收液中回收锂离子。

8. 发明申请

US20110237001A1 SEMICONDUCTOR CHIP USED FOR EVALUATION, EVALUATION SYSTEM, AND REPAIRING METHOD THEREOF 审中-公开
标题翻译：用于评估，评估系统及其修复方法的半导体芯片
公开(公告)号：US20110237001A1
公开(公告)日：2011-09-29
申请号：US13034510
申请日：2011-02-24
申请人： Takehiko HASEBE , Masako Kato , Yoshihide Yamaguchi , Masashi Nishiki , Naoki Matsushima , Teiichi Inada , Rei Yamamoto , Hiroyuki Temmei , Ukyo Ikeda
发明人： Takehiko HASEBE , Masako Kato , Yoshihide Yamaguchi , Masashi Nishiki , Naoki Matsushima , Teiichi Inada , Rei Yamamoto , Hiroyuki Temmei , Ukyo Ikeda
IPC分类号： H01L21/02 , H01L23/544 , G01K7/16
CPC分类号： H01L25/0657 , G01R31/2874 , H01L23/481 , H01L23/49811 , H01L24/48 , H01L25/50 , H01L2224/16145 , H01L2224/48091 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06596 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A technique for evaluating a semiconductor chip is provided. The semiconductor chip is mounted on a mount substrate, the semiconductor chip laminating on one surface of a silicone substrate, at least any of a metal wiring film 101 serving as a resistance temperature detector made up of multiple regions and a metal wiring film 102 serving as a heater made up of one or more regions, and an electrode 103 for connecting the metal wiring film 101 and the metal wiring film 102 with the mount substrate. Then, the metal wiring film 101 is electrically connected with an ammeter and a voltmeter, and the metal wiring film 102 is electrically connected with a power source, thereby providing an evaluation system which is capable of evaluating temperature measurement, heating, and temperature profile in each of the regions on the semiconductor chip.
摘要翻译：提供了一种用于评估半导体芯片的技术。半导体芯片安装在安装基板上，半导体芯片层叠在硅树脂基板的一个表面上，至少由用作由多个区域构成的电阻温度检测器的金属布线膜101和用作由一个或多个区域构成的加热器和用于将金属布线膜101和金属布线膜102与安装基板连接的电极103。然后，金属配线膜101与电流表和电压表电连接，并且金属布线膜102与电源电连接，从而提供能够评价温度测量，加热和温度分布的评估系统半导体芯片上的每个区域。

9. 发明申请

US20090111062A1 Pattern Formation Method 审中-公开
标题翻译：图案形成方法
公开(公告)号：US20090111062A1
公开(公告)日：2009-04-30
申请号：US12260546
申请日：2008-10-29
申请人： Masako Kato , Yoshihide Yamaguchi , Takehiko Hasebe , Masakazu Kishi , Tsuyoshi Yamaguchi
发明人： Masako Kato , Yoshihide Yamaguchi , Takehiko Hasebe , Masakazu Kishi , Tsuyoshi Yamaguchi
IPC分类号： G03F7/20
CPC分类号： G03F7/095 , G03F7/0952 , G03F7/2024 , H05K3/0023 , H05K3/0082 , H05K3/106 , H05K3/28 , H05K2203/0505 , H05K2203/0551
摘要： The present invention provides a pattern formation method comprising a step of forming on a substrate a film of a first photosensitive material having low sensitivity to a light beam with a main wavelength at h-line emitted from a mask-less drawing exposure apparatus but having high sensitivity to an energy light beam containing ultraviolet light; a step of forming on the first photosensitive material a film of a second photosensitive material having higher sensitivity to a light beam with the main wavelength at h-line; a step of drawing a second pattern on the second photosensitive material with the mask-less direct drawing exposure apparatus; a step of developing the second photosensitive material; and a step of exposing to a light beam the second photosensitive material with the second pattern formed thereon and the first photosensitive material in batch to form a target first pattern on the first photosensitive material.
摘要翻译：本发明提供了一种图案形成方法，包括以下步骤：在基板上形成具有低光敏性的第一感光材料的膜，所述第一感光材料具有从无掩模拉制曝光装置发射的h线处的主波长的光束，但是具有高的对含有紫外光的能量光束的敏感性; 在第一感光材料上形成对具有主要波长为h线的光束具有较高灵敏度的第二感光材料的膜; 用无掩模直接拉伸曝光装置在第二感光材料上绘制第二图案的步骤; 显影第二感光材料的步骤; 以及将第二感光材料以第二图案形成在第一感光材料上并分批照射第一感光材料以在第一感光材料上形成目标第一图案的步骤。

10. 发明授权

US07425762B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US07425762B2
公开(公告)日：2008-09-16
申请号：US11607910
申请日：2006-12-04
申请人： Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
发明人： Takehiko Hasebe , Takehide Yokozuka , Nobuyuki Ushifusa , Masahide Harada , Eiji Matsuzaki , Hiroshi Hozoji
IPC分类号： H01L23/34
CPC分类号： H01L24/16 , H01L23/142 , H01L23/367 , H01L23/3677 , H01L23/49822 , H01L23/49833 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/29139 , H01L2224/2929 , H01L2224/32057 , H01L2224/32188 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/83385 , H01L2224/83851 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0206 , H05K1/0207 , H05K1/021 , H05K1/056 , H05K1/144 , H05K3/384 , H05K3/4608 , H05K3/4641 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/096 , H05K2201/09845 , H05K2201/10734 , H01L2924/05432 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
摘要翻译：本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子电子部件连接。在电子设备中，具有高导热性的部件被布置成与金属板和电子部件都接触。因此，电子设备的散热性提高。

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