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1. 发明授权

US06831236B2 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof 失效
标题翻译：多层布线板组件，多层布线板组装部件及其制造方法
公开(公告)号：US06831236B2
公开(公告)日：2004-12-14
申请号：US10102628
申请日：2002-03-22
申请人： Reiji Higuchi , Shouji Itou , Osamu Nakao
发明人： Reiji Higuchi , Shouji Itou , Osamu Nakao
IPC分类号： H05K111
CPC分类号： H05K3/4635 , H05K1/0393 , H05K3/246 , H05K3/247 , H05K3/386 , H05K3/4069 , H05K3/4617 , H05K3/4652 , H05K2201/0195 , H05K2201/0347 , H05K2201/035 , H05K2201/0352 , H05K2201/0355 , H05K2201/09481 , H05K2201/096 , H05K2203/0156 , H05K2203/0191 , H05K2203/0554 , H05K2203/072 , H05K2203/1453 , H05K2203/1461 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T428/249996
摘要： A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components, having a flexible resin film with a copper foil bonded to one surface and an adhesive layer bonded to the other surface, opening a through hole in the copper plated resin film through the copper foil, resin film, and the adhesive layer, and filling the through hole with a conductive paste projecting from the adhesive layer and laterally extending beyond through hole opening of the copper foil.
摘要翻译：多层布线基板组件，多层布线基板组装部件及其制造方法。多层布线基板组合体是将多个多层布线基板组装部件层叠而成的，该多个多层布线基板装配部件具有粘结在一个表面上的铜箔的柔性树脂膜和与该另一面接合的粘合剂层，在镀铜通过铜箔，树脂膜和粘合剂层的树脂膜，并且用从粘合剂层突出并且横向延伸超过铜箔的开孔的导电膏填充通孔。

2. 发明授权

US06816380B2 Electronic devices with small functional elements supported on a carrier 有权
标题翻译：载体上支持小功能元件的电子设备
公开(公告)号：US06816380B2
公开(公告)日：2004-11-09
申请号：US10464031
申请日：2003-06-17
申请人： Thomas Lloyd Credelle , Glenn Gengel , Roger Green Stewart , William Hill Joseph
发明人： Thomas Lloyd Credelle , Glenn Gengel , Roger Green Stewart , William Hill Joseph
IPC分类号： H05K111
CPC分类号： H01L24/96 , G06K19/07749 , G06K19/0775 , G06K19/07752 , G06K19/07779 , G06K19/07783 , H01L24/24 , H01L24/82 , H01L24/95 , H01L29/0657 , H01L2224/24137 , H01L2224/24227 , H01L2224/95085 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10158 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01Q1/2208 , H01Q7/00 , H05K1/141 , H05K1/183 , H05K3/222 , H05K3/321 , H05K2201/10477 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204 , H01L2924/00
摘要： Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.
摘要翻译：电子组件的方法和装置。电子组件具有从主体衬底产生并分离的第一对象。第一个对象在其中具有第一电路。载体基板耦合到第一物体，其中第一物体正在凹陷在载体基底的表面下方。载体基板还包括第一载体连接焊盘和使用金属连接器与第一对象互连的第二载体连接焊盘。接收基板，其基本上是平面的，包括第二电路，第一接收连接焊盘和与使用金属连接器与第二电路互连的第二接收连接焊盘。使用所述连接焊盘将载体衬底耦合到接收衬底。

3. 发明授权

US06791846B2 Power distribution system with a dedicated power structure and a high performance voltage regulator 有权
标题翻译：配电系统具有专用电源结构和高性能稳压器
公开(公告)号：US06791846B2
公开(公告)日：2004-09-14
申请号：US09809826
申请日：2001-03-16
申请人： Larry D. Smith , Istvan Novak , Michael C. Freda
发明人： Larry D. Smith , Istvan Novak , Michael C. Freda
IPC分类号： H05K111
CPC分类号： H05K1/0231 , G06F1/26 , H05K1/0262 , H05K1/141 , H05K3/325 , H05K3/3436 , H05K3/368 , H05K2201/09309 , H05K2201/10545 , H05K2201/10734 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144
摘要： A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is to be distributed may be electrically coupled to the PCB. The power laminate may include one or more power planes and one or more reference (i.e. ground) planes, with each pair of power/reference planes separated by a dielectric layer. The power laminate may also include a connector or other means for receiving power from an external power source. The power laminate may be electrically coupled to the integrated circuit, thereby enabling it to provide power to the integrated circuit. The power laminate may also include a voltage regulator circuit, and a plurality of decoupling capacitors.
摘要翻译：一种用于向集成电路分配电力的系统和方法。在一个实施例中，功率层压板可以安装到印刷电路板（PCB）。要分配功率的集成电路可以电耦合到PCB。功率层压板可以包括一个或多个电源平面和一个或多个参考（即接地）平面，每对功率/参考平面由电介质层分开。功率层压板还可以包括用于从外部电源接收功率的连接器或其它装置。功率层压板可以电耦合到集成电路，从而使其能够向集成电路提供电力。电力层压板还可以包括电压调节器电路和多个去耦电容器。

4. 发明授权

US06765805B2 Circuit component 失效
标题翻译：电路元件
公开(公告)号：US06765805B2
公开(公告)日：2004-07-20
申请号：US09970355
申请日：2001-10-03
申请人： Takumi Naruse , Kenichi Kozaki , Kazuhiro Eguchi , Katsumi Sasaki
发明人： Takumi Naruse , Kenichi Kozaki , Kazuhiro Eguchi , Katsumi Sasaki
IPC分类号： H05K111
CPC分类号： H01R12/57 , H01P1/00 , H01P1/2053 , H01R12/52 , H01R12/718 , H01R12/721 , H05K3/3405 , H05K3/3426 , H05K3/368 , H05K2201/10386 , H05K2201/10757 , H05K2201/10772 , Y02P70/613
摘要： A circuit component comprising a circuit board and a terminal for mounting the circuit board on a second circuit board. A length of the circuit board is 10 mm-80 mm, a difference in a coefficient of thermal expansion between the circuit board and the second circuit board is 0.2×10−5/° C. or greater. The terminal is made of an elastic material, and comprised of a first connection section, a second connection section and an elastic section disposed between the first and second connection sections, and the terminal separates the circuit board from the second circuit board by 0.3 mm-5 mm. In the circuit components of the present invention, deterioration in the conduction between the circuit board and the second circuit board due to heat cycles can be prevented. Thus, a circuit component having stable operating characteristics for a long period of time is obtained.
摘要翻译：一种电路部件，包括电路板和用于将电路板安装在第二电路板上的端子。电路板的长度为10mm-80mm，电路板和第二电路板之间的热膨胀系数的差为0.2×10 -5 /℃或更高。端子由弹性材料制成，包括第一连接部分，第二连接部分和布置在第一和第二连接部分之间的弹性部分，并且端子将电路板与第二电路板分开0.3mm- 5毫米。在本发明的电路部件中，可以防止由于热循环导致的电路板和第二电路板之间的导通性的恶化。因此，获得长时间具有稳定的工作特性的电路部件。

5. 发明授权

US06762369B2 Multilayer ceramic substrate and method for manufacturing the same 失效
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：US06762369B2
公开(公告)日：2004-07-13
申请号：US10282293
申请日：2002-10-28
申请人： Ryuichi Saito , Hidenori Katsumura , Hiroshi Kagata
发明人： Ryuichi Saito , Hidenori Katsumura , Hiroshi Kagata
IPC分类号： H05K111
CPC分类号： H05K1/11 , H01L23/49827 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/092 , H05K3/4061 , H05K3/4629 , Y10T428/24926 , H01L2924/00
摘要： A multilayer ceramic substrate includes a glass ceramic body, a conductive pattern, and a via conductor. The conductive pattern is formed in the glass ceramic body and on at least one principal surface of the glass ceramic body. The via conductor makes a connection between the predetermined conductive patterns. The via conductor includes a conductive material and a Mo compound or a Mo metal. The conductive material includes at least one selected from the group consisting of Ag, Au, Pt and Pd as a main component. The amount of Mo compound or Mo metal is in the range of 0.05 to 10 parts by weight in terms of Mo metal with respect to 100 parts by weight of the conductive material. This multilayer ceramic substrate can achieve sufficient flatness and high dimensional accuracy, while preventing defects that occurs in the vicinity of electrodes after firing.
摘要翻译：多层陶瓷基板包括玻璃陶瓷体，导电图案和通孔导体。导电图案形成在玻璃陶瓷体中和玻璃陶瓷体的至少一个主表面上。通孔导体在预定导电图案之间形成连接。通孔导体包括导电材料和Mo化合物或Mo金属。导电材料包括选自由Ag，Au，Pt和Pd组成的组中的至少一种作为主要成分。相对于100重量份的导电材料，Mo化合物或Mo金属的量以Mo金属计为0.05〜10重量份的范围。该多层陶瓷基板能够实现足够的平坦度和高尺寸精度，同时防止在烧结之后在电极附近发生的缺陷。

6. 发明授权

US06741480B2 Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems 有权
标题翻译：集成电力输送，具有用于集成电路和系统的高密度电源电路的柔性电路互连
公开(公告)号：US06741480B2
公开(公告)日：2004-05-25
申请号：US10005024
申请日：2001-12-04
申请人： David H. Hartke , Joseph Ted DiBene, II
发明人： David H. Hartke , Joseph Ted DiBene, II
IPC分类号： H05K111
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L23/433 , H01L2924/0002 , H01L2924/01005 , H01L2924/01019 , H01L2924/01074 , H01L2924/15192 , H01L2924/3011 , H01R4/64 , H01R12/52 , H01R12/7088 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036 , H01L2924/00
摘要： A method and apparatus for electrically interconnecting a first circuit board having a power conditioning circuit and a second circuit board having a power dissipating component disposed therebelow along a z (vertical) axis is disclosed. In an illustrative embodiment, the apparatus comprises a first flexible circuit having a first set of raised conductive contacts, the first flexible circuit disposed on a first side of the second circuit board; and a second flexible circuit having a second set of raised conductive contacts, the second flexible circuit disposed on a second side of the second circuit board opposing the first side of the second circuit board. A power signal from the power conditioning circuit is provided to the second circuit board at least in part by one of the first set of raised conductive contacts on the flexible circuit and the second set of raised conductive contacts on the second flexible circuit and a ground return is provided to the second circuit board by the other of the first set of raised conductive contacts on the first flexible circuit and the second set of raised conductive contacts on the second flexible circuit.
摘要翻译：公开了一种用于将具有功率调节电路的第一电路板和具有沿z（垂直）轴设置在其下方的功率耗散部件的第二电路板电互连的方法和装置。在说明性实施例中，该装置包括具有第一组凸起的导电触点的第一柔性电路，第一柔性电路设置在第二电路板的第一侧上; 以及第二柔性电路，其具有第二组凸起的导电触头，所述第二柔性电路设置在所述第二电路板的与所述第二电路板的第一侧相对的第二侧上。来自功率调节电路的功率信号至少部分地由柔性电路上的第一组升高的导电触点之一和第二柔性电路上的第二组升高的导电触点和接地回路提供给第二电路板通过第一柔性电路上的第一组升高的导电触点中的另一个和第二柔性电路上的第二组升高的导电触点而提供给第二电路板。

7. 发明授权

US06738263B2 Stackable ball grid array package 有权
标题翻译：可堆叠球栅阵列封装
公开(公告)号：US06738263B2
公开(公告)日：2004-05-18
申请号：US10222243
申请日：2002-08-16
申请人： David J. Corisis , Jerry M. Brooks , Walter L. Moden
发明人： David J. Corisis , Jerry M. Brooks , Walter L. Moden
IPC分类号： H05K111
CPC分类号： H01L24/06 , H01L23/3107 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/06136 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/85399 , H01L2225/0651 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA. The conductive elements also are of sufficient size so that they extend beyond the bottom or top surface of the IC device, including the wiring interconnect and encapsulate material, as the conductive elements make contact with the FBGA positioned below or above to form a stack. The IC device, such as a memory chip, is mounted upon a first surface of a printed circuit board substrate forming part of the FBGA. Lead wires are used to attach the IC device to the printed board substrate and encapsulant is used to contain the IC device and wires within and below the matrix and profile of the conductive elements.
摘要翻译：可堆叠的FBGA封装被构造成使得导电元件沿着安装到FBGA的集成电路（IC）器件的外周放置。导电元件也具有足够的尺寸，使得它们延伸超过IC器件的底表面或顶表面，包括布线互连和封装材料，因为导电元件与位于或之下的FBGA接触以形成叠层。诸如存储器芯片的IC器件安装在形成FBGA的一部分的印刷电路板基板的第一表面上。引线用于将IC器件连接到印刷电路板基板，并且密封剂用于将IC器件和导线元件的基体内部和外部的电线包含在IC器件中。

8. 发明授权

US06734374B2 Micro-coaxial cable assembly and method for making the same 失效
标题翻译：微同轴电缆组件及其制造方法
公开(公告)号：US06734374B2
公开(公告)日：2004-05-11
申请号：US10161464
申请日：2002-05-30
申请人： Chiu Yu Tang
发明人： Chiu Yu Tang
IPC分类号： H05K111
CPC分类号： H01R9/0515 , H01R4/027 , H01R43/01
摘要： A method for soldering braiding layers of wires of a micro-coaxial cable to a substrate, wherein each wire includes a core conductor, an inner insulator, a braiding layer, and an outer insulator, comprises the steps of: exposing the braiding layers of the wires; providing a substrate having a thick layer of fusible element thereon; and arranging the braiding layers to the thick layer of the substrate while providing enough energy such that molten fusible element is substantially filled in interstitial space between the braiding layers of adjacent individual wires. An electrical cable assembly made by the above method is also disclosed.
摘要翻译：一种用于将微同轴电缆的编织层焊接到基板的方法，其中每根导线包括芯导体，内绝缘体，编织层和外绝缘体，包括以下步骤：将所述编织层电线提供其上具有厚的可熔元件层的衬底; 并且在提供足够的能量的同时将编织层布置到基底的厚层上，使得熔融的可熔元件基本上填充在相邻的单根线的编织层之间的间隙空间中。还公开了通过上述方法制造的电缆组件。

9. 发明授权

US06728113B1 Method and apparatus for non-conductively interconnecting integrated circuits 失效
标题翻译：用于非导电互连集成电路的方法和装置
公开(公告)号：US06728113B1
公开(公告)日：2004-04-27
申请号：US08082328
申请日：1993-06-24
申请人： Thomas F. Knight , David B. Salzman
发明人： Thomas F. Knight , David B. Salzman
IPC分类号： H05K111
CPC分类号： H01L24/73 , G01R31/3025 , G01R31/312 , G01R31/318513 , H01L23/48 , H01L23/5385 , H01L23/642 , H01L2224/16 , H01L2224/45144 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01092 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/10329 , H01L2924/12036 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , Y10S257/924 , H01L2924/00
摘要： Apparatus is described for capacitively signalling between different semiconductor chips and modules without the use of connectors, solder bumps, wire-bond interconnections or the like. Preferably, pairs of half-capacitor plates, one half located on each chip, module or substrate are used to capacitively couple signals from one chip, module or substrate to another. The use of plates relaxes the need for high precision alignment as well as reduces the area needed to effect signalling, and reduces or eliminates the requirements for exotic metallurgy.
摘要翻译：描述了用于在不使用连接器，焊料凸块，引线接合互连等的不同半导体芯片和模块之间进行电容性信令的装置。优选地，使用位于每个芯片，模块或衬底上的一半半对电容器板对将信号从一个芯片，模块或衬底电容耦合到另一个芯片。板的使用放松了对高精度对准的需要，并且减少了实现信号传递所需的面积，并且减少或消除了异乎寻常的冶金的要求。

10. 发明授权

US06713687B2 Printed wiring board and method for manufacturing printed wiring board 有权
标题翻译：印刷电路板及制造印刷线路板的方法
公开(公告)号：US06713687B2
公开(公告)日：2004-03-30
申请号：US10022222
申请日：2001-12-20
申请人： Yoshitarou Yazaki , Tomohiro Yokochi , Koji Kondo , Toshikazu Harada , Yoshihiko Shiraishi
发明人： Yoshitarou Yazaki , Tomohiro Yokochi , Koji Kondo , Toshikazu Harada , Yoshihiko Shiraishi
IPC分类号： H05K111
CPC分类号： H05K3/4632 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0272 , H05K2201/0305 , H05K2201/0355 , H05K2201/0394 , H05K2201/09827 , H05K2201/09863 , H05K2203/0425 , H05K2203/1131 , Y10T29/49126 , Y10T29/49144 , Y10T29/49165 , Y10T428/24917
摘要： Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.
摘要翻译：含有锡颗粒和银颗粒的导电糊料被包装在形成在热塑性树脂膜中的大致圆柱形的通孔中，该热塑性树脂膜介于导体图案之间并且从两侧被热压。当包含在导电浆料中的金属颗粒被烧结以形成统一的导电化合物时，导电浆料的体积收缩。同时，通孔周围的树脂膜突出到通孔中。因此，导电性化合物的横截面上的侧壁的形状形成拱形，并且与导体图案接触的导电性化合物的接合部分相邻的侧壁形成倾斜。因此，可以防止由于板的变形引起的应力集中。

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