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    • 5. 发明授权
    • Exposure processing method and exposure system for the same
    • 曝光处理方法和曝光系统相同
    • US06721940B2
    • 2004-04-13
    • US10107934
    • 2002-03-26
    • Toshiharu MiwaYasuhiro YoshitakeTetsuya Yamazaki
    • Toshiharu MiwaYasuhiro YoshitakeTetsuya Yamazaki
    • G06F1750
    • G03F7/705G03F7/70525G03F7/70558G03F7/706G03F7/70641
    • In lithographic (exposure) processing for semiconductor device fabrication, the task of extracting exposure parameters is performed by calculating exposure energy and focus offset using a test wafer for each exposure device, because fluctuations due to differences between exposure devices are large. For the fabrication of semiconductor devices in multiple-product small-lot production, the number of times the task of extracting exposure parameters has to be performed increases, so that the operation ratio of the exposure devices decreases, and the TAT of the semiconductor device fabrication increases. Moreover, as the miniaturization of semiconductor devices advances, differences between the exposure devices cause defects due to the exposure processing, and the yield of the semiconductor device fabrication decreases. In an improved method of exposure processing for semiconductor devices, the exposure energy and focus offset according to the illumination parameters for an exposure device and optical projection system, using information regarding the projection lens aberrations of a plurality of exposure devices, the photoresist parameters, and the circuit pattern information, as determined beforehand, are calculated using an optical development simulator, and the exposure processing is carried out using an exposure device, selected from a plurality of exposure devices, in which the process window is within a certain tolerance value.
    • 在用于半导体器件制造的光刻(曝光)处理中,由于曝光装置之间的差异引起的波动,所以通过使用每个曝光装置的测试晶片计算曝光能量和聚焦偏移来执行提取曝光参数的任务。 对于多产品小批量生产中的半导体器件的制造,必须执行提取曝光参数的任务的次数增加,使得曝光装置的操作比降低,并且半导体器件制造的TAT 增加 此外,随着半导体器件的小型化的发展,曝光装置之间的差异导致由于曝光处理而引起的缺陷,并且半导体器件制造的成品率降低。 在半导体器件的曝光处理的改进方法中,使用关于多个曝光装置的投影透镜像差的信息,光致抗蚀剂参数以及与多个曝光装置的投影透镜像差有关的信息,根据曝光装置和光学投影系统的照明参数的曝光能量和聚焦偏移 使用光学显影模拟器计算预先确定的电路图案信息,并且使用从多个曝光装置中选择的曝光装置进行曝光处理,其中处理窗口在某一公差值内。
    • 10. 发明授权
    • Plastic case for photographic film cassette
    • 摄影胶片盒胶盒
    • US5720389A
    • 1998-02-24
    • US628345
    • 1996-04-05
    • Tetsuya YamazakiMorio Fujiwara
    • Tetsuya YamazakiMorio Fujiwara
    • B65D25/10B65D41/18G03C3/00B65D85/38
    • G03C3/00B65D25/10B65D41/18
    • A plastic case for a photographic film cassette consisting of a case body having a closed bottom and an open top, and a lid to be fitted to the open top of the case body, characterized by comprising a supporting device formed integrally on an internal bottom surface of the case body. The supporting device is upwardly tapered and deformable by the photographic film cassette when the lid is fitted to the case body and depresses the photographic film cassette into the case body. The supporting device is constituted of a pair of supporting ribs whose upper ends have a thickness of 0.12 to 0.35 mm. The ribs are disposed apart from each other, and the upper ends are inclined in opposite directions to each other relative to the internal bottom surface of the case body.
    • 一种用于摄影胶片盒的塑料外壳,其由具有封闭底部和敞开顶部的壳体构成,以及盖装配到壳体的开口顶部,其特征在于,包括一个支撑装置,整体地形成在内部底部表面上 的尸体。 当盖子装配到壳体并将照相胶片暗盒压入盒体时,支撑装置向上渐缩并由照相胶片盒可变形。 支撑装置由一对支撑肋构成,其上端的厚度为0.12至0.35mm。 肋彼此分离设置,并且上端相对于壳体的内底面彼此相反的方向倾斜。