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1. 发明授权

US5162240A Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate 失效
标题翻译：在厚膜和薄膜混合多层布线基板上制作电路图案的方法和装置
公开(公告)号：US5162240A
公开(公告)日：1992-11-10
申请号：US537492
申请日：1990-06-12
申请人： Norio Saitou , Hideo Todokoro , Katsuhiro Kuroda , Satoru Fukuhara , Genya Matsuoka , Hideo Arima , Hitoshi Yokono , Takashi Inoue , Hidetaka Shigi
发明人： Norio Saitou , Hideo Todokoro , Katsuhiro Kuroda , Satoru Fukuhara , Genya Matsuoka , Hideo Arima , Hitoshi Yokono , Takashi Inoue , Hidetaka Shigi
IPC分类号： H01L21/48 , H01L23/538 , H01L23/544 , H05K1/02 , H05K1/03 , H05K1/09 , H05K3/46
CPC分类号： H05K3/4679 , H01L21/4857 , H01L23/5383 , H01L23/544 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/16235 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15174 , H05K1/0269 , H05K1/0306 , H05K1/092 , H05K2201/09781 , H05K2201/09918 , H05K3/4605 , H05K3/467
摘要： A thick and thin film hybrid multilayer wiring substrate includes an adjustment layer provided between a thick film circuit and a thin film circuit in order to adjust positions of the thick film circuit and the thin film circuit with high integration and large area of the thick and thin film hybrid substrate. The adjustment layer is formed using a direct printing process in accordance with dispersion of the shape of the thick film circuit substrate to absorb the dispersion of the substrate. Further, in order to absorb dispersion of contraction of the thick film substrate due to sintering, a position of a mark provided on the substrate is detected by an electron beam and thereafter a connection pattern is formed to be connected to a regular pattern.
摘要翻译：厚薄膜混合多层布线基板包括设置在厚膜电路和薄膜电路之间的调整层，以便调整厚膜电路和薄膜电路的位置，具有高集成度和大面积的厚薄薄膜混合基板。根据厚膜电路基板的形状的分散，使用直接印刷法形成调整层，以吸收基板的分散。此外，为了吸收由于烧结引起的厚膜基板的收缩分散，通过电子束检测设置在基板上的标记的位置，然后形成连接图案以连接到规则图案。

2. 发明授权

US5133403A Cooling arrangement for semiconductor devices and method of making the same 失效
标题翻译：用于半导体器件的冷却装置及其制造方法
公开(公告)号：US5133403A
公开(公告)日：1992-07-28
申请号：US423386
申请日：1989-10-19
申请人： Hitoshi Yokono , Takao Terabayashi , Nobuo Kayaba , Takahiro Daikoku , Shigekazu Kieda , Fumiyuki Kobayashi , Shizuo Zushi
发明人： Hitoshi Yokono , Takao Terabayashi , Nobuo Kayaba , Takahiro Daikoku , Shigekazu Kieda , Fumiyuki Kobayashi , Shizuo Zushi
IPC分类号： H01L23/373 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4338 , H01L23/3733 , F28F2255/18 , H01L2224/16225
摘要： A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.m, with a sintering aid being added and the powdery mixture being subjected to a hot press sintering whereby the sintered material is low in thermal conductivity in a direction parallel to an axis of a shaft of the hot press.
摘要翻译：一种用于通过从大型电子计算机中的诸如半导体集成芯片的半导体元件产生的热量来冷却半导体元件的冷却装置。该冷却装置由维氏硬度不高于AlN材料的五分之一的复合AlN-BN烧结材料制成，并且二维方向的热导率的各向异性特性比AlN的各向异性高各向同性的导热性。即使复合烧结体的形状和尺寸一致，冷却装置也可以批量生产，同时具有与每个半导体元件产生的热量匹配的高转印性能。复合烧结材料由平均粒径不小于1μm的六方晶BN粉末和平均粒径约2μm的AlN粉末的混合物形成，并加入烧结助剂。混合物进行热压烧结，由此烧结材料在与热压机的轴的轴线平行的方向上的导热性低。

3. 发明授权

US4715673A Optical switch 失效
标题翻译：光开关
公开(公告)号：US4715673A
公开(公告)日：1987-12-29
申请号：US857957
申请日：1986-05-01
申请人： Takanobu Noro , Yasumasa Koakutsu , Tamio Takeuchi , Masao Yano , Seiichi Onoda , Hideo Arima , Hitoshi Yokono , Hirayoshi Tanei
发明人： Takanobu Noro , Yasumasa Koakutsu , Tamio Takeuchi , Masao Yano , Seiichi Onoda , Hideo Arima , Hitoshi Yokono , Hirayoshi Tanei
IPC分类号： G02B6/35 , G02B6/36
CPC分类号： G02B6/35 , G02B6/3598 , G02B6/3542 , G02B6/3572 , G02B6/3582 , G02B6/3586
摘要： An optical switch having a small number of optical connections includes a substrate in which are provided a first light path for conducting optical signals and a second light path consisting of a photosensitive element and light emitting element in pairs. An optical fiber cable is interrupted by the substrate, and optical signals in the fiber cable are transmitted through the first light path or intervened by an electrical system through the second light path in response to the switching movement of the substrate.
摘要翻译：具有少量光学连接的光学开关包括其中设置有用于传导光学信号的第一光路和由感光元件和发光元件成对组成的第二光路的基板。光纤电缆被基板中断，并且光纤电缆中的光信号响应于基板的切换运动而通过第一光路传输或通过第二光路被电气系统干涉。

4. 发明授权

US4554237A Photosensitive resin composition and method for forming fine patterns with said composition 失效
标题翻译：光敏树脂组合物和用所述组合物形成精细图案的方法
公开(公告)号：US4554237A
公开(公告)日：1985-11-19
申请号：US452198
申请日：1982-12-22
申请人： Fumio Kataoka , Fusaji Shoji , Hitoshi Yokono , Daisuke Makino , Shigeru Koibuchi , Asao Isobe
发明人： Fumio Kataoka , Fusaji Shoji , Hitoshi Yokono , Daisuke Makino , Shigeru Koibuchi , Asao Isobe
IPC分类号： G03C1/72 , G03F7/008 , G03C1/52 , G03C1/60 , G03C5/16
CPC分类号： G03F7/008 , Y10S430/128
摘要： Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition.Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.3 is hydrogen, a lower alkyl group or --CH.sub.2 CH.sub.2 O).sub.n R.sup.9 wherein n is an integer of 3 or less and R.sup.9 is hydrogen or a lower alkyl group)].
摘要翻译：公开了用于在半导体器件上形成精细图案的光敏树脂组合物，具有高度敏感性和显影性优异的并且没有问题，例如显影后的叠氮化合物和剩余的叠氮化物颗粒的沉淀，以及方法用于用所述组合物形成精细图案。所述光敏树脂组合物包含（a）至少一种选自酚醛清漆树脂和聚羟基苯乙烯树脂的聚合物化合物和（b）由通式（1）表示的叠氮化合物：其中 X是-N3或-SO2N3，Y是低级亚烷基，例如-CH2CH2-，-CH2CH2CH2-或-CH2CH2OCH2CH2CH2-，羟基亚烷基或氨基亚烷基，例如

5. 发明授权

US4513132A Heat-resistant silicone block polymer 失效
标题翻译：耐热硅胶聚合物
公开(公告)号：US4513132A
公开(公告)日：1985-04-23
申请号：US480789
申请日：1983-03-31
申请人： Fusaji Shoji , Issei Takemoto , Fumio Kataoka , Hitoshi Yokono , Tokio Isogai
发明人： Fusaji Shoji , Issei Takemoto , Fumio Kataoka , Hitoshi Yokono , Tokio Isogai
IPC分类号： C08G77/00 , C08G77/42 , C08G77/44 , C08G77/52 , C08G77/06
CPC分类号： C08G77/52 , C08G77/44
摘要： Heat-resistant silicone block polymer with a good flexibility obtained by reaction of an organosilsesquioxane with a silicone compound or organosiloxane in the presence of a basic catalyst in an organic solvent.
摘要翻译：通过有机倍半硅氧烷与有机硅化合物或有机硅氧烷在碱性催化剂存在下在有机溶剂中反应而获得的具有良好柔软性的耐热硅氧烷嵌段聚合物。

6. 发明授权

US4420500A Composition and process for preparing transparent conducting film 失效
标题翻译：制备透明导电薄膜的组成和工艺
公开(公告)号：US4420500A
公开(公告)日：1983-12-13
申请号：US344973
申请日：1982-02-02
申请人： Mitsuo Nakatani , Mitsuo Yamazaki , Masaaki Okunaka , Ryoichi Sudo , Kenji Tochigi , Hitoshi Yokono
发明人： Mitsuo Nakatani , Mitsuo Yamazaki , Masaaki Okunaka , Ryoichi Sudo , Kenji Tochigi , Hitoshi Yokono
IPC分类号： B01J19/12 , C03C17/25 , C07F5/00 , C07F7/22 , G02F1/1343 , H01B13/00 , H01L31/18 , B05D3/02 , B05D3/06 , H01B1/06
CPC分类号： G02F1/13439 , C03C17/253 , C07F5/003 , C07F7/2204 , H01L31/1884 , C03C2217/231 , C03C2218/11 , Y02E10/50
摘要： A transparent conducting film is prepared from a composition comprising an indium compound, a tin compound, and a solvent as essential components, the tin compound being a compound represented by the following general formula:(R).sub.a Sn(NO.sub.3).sub.b (X).sub.4-a-b (1)wherein R is an alkyl group having 1 to 4 carbon atoms, X is a hydroxyl group, a halogen atom, or a carboxyl group, and a and b are integers of 1.about.3, and a+b.ltoreq.4 by coating a substrate with the said composition, subjecting the coated substrate to ultraviolet irradiation at a substrate temperature of 200.degree. C. or higher, and heating the substrate at 400.degree. C. or higher. The composition has a long pot life and the film has a low resistance and distinguished mechanical strength, chemical resistance and etching susceptibility.
摘要翻译：由含有铟化合物，锡化合物和溶剂作为必要成分的组合物制备透明导电膜，该锡化合物是由以下通式表示的化合物：（R）aSn（NO 3）b（X）4 -ab（1）其中R是具有1至4个碳原子的烷基，X是羟基，卤素原子或羧基，a和b是1的整数3和a + b < = 4，通过用所述组合物涂布基材，在200℃或更高的基板温度下对涂覆的基材进行紫外线照射，并在400℃或更高温度下加热基材。该组合物具有长的适用期，该膜具有低电阻和显着的机械强度，耐化学性和蚀刻敏感性。

7. 发明授权

US4342842A Process for producing rigid polyurethane foam 失效
标题翻译：硬质聚氨酯泡沫的生产工艺
公开(公告)号：US4342842A
公开(公告)日：1982-08-03
申请号：US280210
申请日：1981-07-06
申请人： Yasuo Hira , Susumu Tsuzuku , Masao Gotoh , Hitoshi Yokono , Hiroshi Kaneko , Yoshihisa Hosoe
发明人： Yasuo Hira , Susumu Tsuzuku , Masao Gotoh , Hitoshi Yokono , Hiroshi Kaneko , Yoshihisa Hosoe
IPC分类号： C08G18/00 , B29C39/00 , B29C39/02 , B29C39/24 , B29C39/26 , B29D1/00 , C08G18/48 , C08G18/50 , C08J9/02 , C08G18/14
CPC分类号： C08G18/482 , C08G18/5033 , C08G2101/0025 , C08G2101/0066
摘要： Rigid polyurethane foams having excellent heat resistance and impact resistance can be produced with good workability due to good flow properties by using a composition comprising a polyol, a polyisocyanate, a blowing agent and a reaction accelerator as essential component, characterized by using as the polyol, a mixture of (a) an alkylene oxide adduct of 4,4'-diaminodiphenylmethane having OH value of 280-600 mg KOH/g, (b) an aliphatic polyether having a hdyroxyl value of 450-800 mg KOH/g and 3 or 4 hydroxyl groups in the molecule, and (c) a polyether having a hydroxyl value of 30 to 100 mg KOH/g and 2 or 3 hydroxyl groups in the molecule, in limited amounts.
摘要翻译：通过使用包含多元醇，多异氰酸酯，发泡剂和反应促进剂作为必要成分的组合物，由于良好的流动性，可以制造具有优异的耐热性和耐冲击性的刚性聚氨酯泡沫，其特征在于使用多元醇，（a）OH值为280-600mg KOH / g的4,4'-二氨基二苯基甲烷的烯化氧加成物的混合物，（b）羟值为450-800mg KOH / g的脂族聚醚和3或分子中的4个羟基，和（c）分子中羟基值为30至100mg KOH / g和2或3个羟基的聚醚，其数量有限。

8. 发明授权

US4138372A Resin compositions containing polyepoxides and uretdiones 失效
标题翻译：含有聚环氧化物和脲二酮的树脂组合物
公开(公告)号：US4138372A
公开(公告)日：1979-02-06
申请号：US650066
申请日：1976-01-19
申请人： Akio Nishikawa , Hitoshi Yokono , Ryuichi Simizu , Junji Mukai
发明人： Akio Nishikawa , Hitoshi Yokono , Ryuichi Simizu , Junji Mukai
IPC分类号： C08G18/00 , C08G18/58 , C08G59/40 , C08G59/68 , H01B3/30 , H01B3/40 , H02K15/12
CPC分类号： C08G59/686 , C08G18/003 , C08G59/4028
摘要： A polymerizable, curable resin composition suitable for molding materials, prepreg, powdery paint materials or the like, which comprises a polyepoxide, a uretdione and a tetraphenyl borate-amine complex. This composition has long pot life and good curability by virtue of latent catalytic characteristics of the complex.
摘要翻译：一种适用于模塑材料，预浸料，粉末涂料等的可聚合的可固化树脂组合物，其包含聚环氧化物，脲二酮和四苯基硼酸盐 - 胺络合物。该组合物由于络合物的潜在催化特性而具有长的使用期和良好的固化性。

9. 发明授权

US4070416A Novel thermosetting resin and a process for producing same 失效
标题翻译：新型热固性树脂及其制备方法
公开(公告)号：US4070416A
公开(公告)日：1978-01-24
申请号：US605324
申请日：1975-08-18
申请人： Toshikazu Narahara , Katuo Sugawara , Yoshiharu Karasawa , Hitoshi Yokono , Junji Mukai , Tadashi Muroi
发明人： Toshikazu Narahara , Katuo Sugawara , Yoshiharu Karasawa , Hitoshi Yokono , Junji Mukai , Tadashi Muroi
IPC分类号： C08G18/00 , C08G18/79 , C08G59/40 , C08G69/06 , C08L63/00
CPC分类号： C08G18/791 , C08G18/003 , C08G59/4028 , C08G69/06 , C08G2105/02
摘要： A novel thermosetting resin can be obtained by mixing 1 equivalent or more of a polyfunctional isocyanate per 1 equivalent of a polyfunctional epoxide and then carrying out a polymerization reaction of the mixture in the presence of the catalyst which forms isocyanurate rings and oxazolidone rings so as to enable the mixture to form 2 or more isocyanurate rings directly connected with oxazolidone rings through an isocyanate residues.The resulting thermosetting resin has excellent electrical, chemical and impact resistances and excellent self-extinguishing properties. Said resin is used as an electric insulating material.
摘要翻译：可以通过将1当量或更多个多官能异氰酸酯/ 1当量多官能环氧化物混合，然后在形成异氰脲酸酯环和恶唑烷酮环的催化剂存在下进行混合物的聚合反应，得到新的热固性树脂，以便使得混合物通过异氰酸酯残基形成与恶唑烷酮环直接连接的2个或更多个异氰脲酸酯环。

10. 发明授权

US3984376A Thermosetting resin compositions prepared from isocyanates and epoxyphenols 失效
标题翻译：由异氰酸酯和环氧苯酚制备的热固性树脂组合物
公开(公告)号：US3984376A
公开(公告)日：1976-10-05
申请号：US483044
申请日：1974-06-25
申请人： Hitoshi Yokono , Shunichi Numata , Kazuo Goto , Masahiko Sakai , Toshikazu Narahara , Junji Mukai
发明人： Hitoshi Yokono , Shunichi Numata , Kazuo Goto , Masahiko Sakai , Toshikazu Narahara , Junji Mukai
IPC分类号： C08G18/18 , C08G18/28 , C08G18/58 , C08G18/06
CPC分类号： C08G18/2815 , C08G18/18 , C08G18/2845 , C08G18/58
摘要： Thermosetting resin compositions are obtained by mixing a resinous addition product produced by reacting an isocyanate compound having a molecular weight of 100 to 2000 and containing at least two isocyanate groups in its molecule with an epoxyphenol compound represented by the formula, ##EQU1## wherein R is a bi- or more valent group containing phenyl, R.sub.1 is hydrogen, methyl or ethyl, m and n each are an integer of 1-8, and optionally an ordinary thermosetting epoxy resin, and 0.01 to 10 % by weight of a basic heterocycle forming catalyst based on the weight of said resinous addition product, said isocyanate compound and said epoxyphenol compound being blended so that said OH group may be present in an amount of 1/3 to 1 equivalent per equivalent of said isocyanate group and said epoxy group may be present in an amount of one-fifth to two-thirds equivalent per equivalent of said isocyanate group. The said addition product can be converted into a stable B-stage and is particularly useful as a varnish for prepreg.
摘要翻译：通过将分子量为100〜2000的异氰酸酯化合物与分子中至少含有2个异氰酸酯基的异氰酸酯化合物与由式O ANGLE（HO）nR表示的环氧苯酚化合物反应而得到的树脂添加物混合，得到热固性树脂组合物， - （CH 2 -C-CH 2）m | R 1其中R是含有苯基的二价或更多价基团，R 1是氢，甲基或乙基，m和n各自是1-8的整数，并且任选地是普通的热固性环氧树脂和基于所述树脂加成产物的重量的0.01至10重量％的碱性杂环形成催化剂，所述异氰酸酯化合物和所述环氧苯酚化合物混合，使得所述OH基团可以以1/3的量存在至每当量所述异氰酸酯基团为1当量，并且所述环氧基团可以以每当量所述异氰酸酯基团的五分之一至三分之二当量的量存在。所述加成产物可以转化成稳定的B阶段，并且特别可用作预浸料的清漆。

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