专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06607613B2 Solder ball with chemically and mechanically enhanced surface properties 失效
标题翻译：焊球具有化学和机械增强的表面性能
公开(公告)号：US06607613B2
公开(公告)日：2003-08-19
申请号：US09775747
申请日：2001-02-01
申请人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
发明人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
IPC分类号： C22C1106
CPC分类号： C23C8/00 , B23K1/206 , B23K35/0244 , B23K35/262 , B23K35/268 , B23K2101/40 , C23C26/00 , H05K3/3457 , H05K3/3489 , H05K2203/092 , H05K2203/095 , Y10T428/12 , Y10T428/12021 , Y10T428/12458 , Y10T428/12493 , Y10T428/12687
摘要： A metal alloy solder ball comprising a first metal and a second metal, the first metal having a sputtering yield greater than the second metal. The solder ball comprises a bulk portion having a bulk ratio of the first metal to the second metal, an outer surface, and a surface gradient having a depth and a gradient ratio of the first metal to the second metal that is less than the bulk ratio. The gradient ratio increases along the surface gradient depth from a minimum at the outer surface. The solder ball may be formed by the process of exposing the ball to energized ions of a sputtering gas for an effective amount of time to form the surface gradient.
摘要翻译：一种包含第一金属和第二金属的金属合金焊球，所述第一金属的溅射产率大于所述第二金属。焊球包括具有第一金属与第二金属的体积比的主体部分，外表面和具有小于体积比的第一金属与第二金属的深度和梯度比的表面梯度。梯度比沿着表面梯度深度从外表面的最小值增加。可以通过将球暴露于溅射气体的激发离子有效时间以形成表面梯度的过程来形成焊球。

2. 发明授权

US06210547B1 Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties 失效
标题翻译：增强的焊料表面和用于化学和机械增强焊料表面性能的工艺
公开(公告)号：US06210547B1
公开(公告)日：2001-04-03
申请号：US09382221
申请日：1999-08-24
申请人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
发明人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
IPC分类号： C23C800
CPC分类号： C23C26/00 , B23K35/262 , B23K35/268 , C23C8/00 , H05K3/3457 , H05K2203/092 , H05K2203/095 , Y10S148/901 , Y10S148/903 , Y10T428/12687 , Y10T428/12701 , Y10T428/12708 , Y10T428/12861 , Y10T428/12896
摘要： A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.
摘要翻译：一种用于改变包含第一金属和第二金属的金属合金焊料块的表面性质的方法。该方法包括将质量暴露于通电离子以优先溅射第一金属的原子，以形成小于体积比的第一金属与第二金属原子的表面层比。焊料可以位于衬底的表面上，其中该工艺可以进一步包括掩蔽衬底以屏蔽离开所述离子束的所有区域。溅射气体可以包括诸如氧的反应性气体，并且衬底可以是有机衬底。该方法可以进一步包括将有机底物同时暴露于活性气体的激发离子以粗糙化有机基底表面。

3. 发明授权

US6056831A Process for chemically and mechanically enhancing solder surface properties 失效
标题翻译：化学和机械增强焊料表面性能的工艺
公开(公告)号：US6056831A
公开(公告)日：2000-05-02
申请号：US113445
申请日：1998-07-10
申请人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
发明人： Frank D. Egitto , Edmond O. Fey , Luis J. Matienzo , David L. Questad , Rajinder S. Rai , Daniel C. Van Hart
IPC分类号： B23K35/14 , B23K35/26 , C23C8/00 , C23C26/00 , H05K3/34
CPC分类号： C23C26/00 , B23K35/262 , B23K35/268 , C23C8/00 , H05K3/3457 , H05K2203/092 , H05K2203/095 , Y10S148/901 , Y10S148/903 , Y10T428/12687 , Y10T428/12701 , Y10T428/12708 , Y10T428/12861 , Y10T428/12896
摘要： A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.
摘要翻译：一种用于改变包括第一金属和第二金属的金属合金焊料块的表面性质的方法。该方法包括将质量暴露于通电离子以优先溅射第一金属的原子，以形成小于体积比的第一金属与第二金属原子的表面层比。焊料可以位于衬底的表面上，其中该工艺可以进一步包括掩蔽衬底以屏蔽离开所述离子束的所有区域。溅射气体可以包括诸如氧的反应性气体，并且衬底可以是有机衬底。该方法可以进一步包括将有机底物同时暴露于活性气体的激发离子以粗糙化有机基底表面。

4. 发明授权

US06931722B2 Method of fabricating printed circuit board with mixed metallurgy pads 失效
标题翻译：用混合冶金垫制造印刷电路板的方法
公开(公告)号：US06931722B2
公开(公告)日：2005-08-23
申请号：US10395944
申请日：2003-03-24
申请人： Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
发明人： Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
IPC分类号： H05K3/24 , H05K3/28 , H05K3/34 , H05K3/42 , H05K3/02
CPC分类号： H05K3/243 , H05K3/28 , H05K3/3452 , H05K3/3473 , H05K3/42 , H05K2201/0391 , H05K2203/0315 , H05K2203/0574 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.
摘要翻译：公开了一种制造印刷电路器件的方法，该印刷电路器件包括电绝缘衬底以及形成在衬底顶表面上的第一组，第二组和第三组导体。该方法包括在第二导体组上形成氧化物层; 在氧化物层上形成焊料掩模; 在第一组导体上形成复合层; 以及在所述第三组导体的至少一部分上形成焊料层。

5. 发明授权

US06586683B2 Printed circuit board with mixed metallurgy pads and method of fabrication 有权
公开(公告)号：US06586683B2
公开(公告)日：2003-07-01
申请号：US09844814
申请日：2001-04-27
申请人： Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A. Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
发明人： Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A. Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
IPC分类号： H05K103
CPC分类号： H05K3/243 , H05K3/28 , H05K3/3452 , H05K3/3473 , H05K3/42 , H05K2201/0391 , H05K2203/0315 , H05K2203/0574 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

6. 发明授权

US5311660A Methyl chloroform-free desmear process in additive circuitization 失效
标题翻译：甲基无氯化除垢工艺的加成电路
公开(公告)号：US5311660A
公开(公告)日：1994-05-17
申请号：US15742
申请日：1993-02-10
申请人： Warren A. Alpaugh , Anilkumar C. Bhatt , Michael J. Canestaro , Robert J. Day , Edmond O. Fey , John E. Larrabee
发明人： Warren A. Alpaugh , Anilkumar C. Bhatt , Michael J. Canestaro , Robert J. Day , Edmond O. Fey , John E. Larrabee
IPC分类号： H05K3/26 , H05K3/00 , H05K3/42 , H01K3/10
CPC分类号： H05K3/0055 , H05K2203/0783 , H05K2203/0789 , H05K2203/0796 , H05K2203/081 , H05K2203/088 , Y10T29/49165
摘要： Disclosed is a method of drilling, desmearing, and additively circuitizing a printed circuit board. The printed circuit board is drilled under conditions which produce glass and polymer smeared vias and through holes. The particulate debris is removed by vapor blasting the drilled printed circuit board. Next the printed circuit board is soaked in a solvent to swell the drill smear on the circuit interplanes of the printed circuit board. This solvent is then removed by entrainment in a gas, and a stream of an aqueous, acidic, oxidizing solution is passed through the printed circuit board holes to remove swollen smear in the thru holes and produce an etchback of conductors. After a water rinse an aqueous reducing solution is passed through the printed circuit board to reduce and remove aqueous acidic oxidizing solution, e.g., residual aqueous acid oxidizing solution. The printed circuit board is rinsed to remove the aqueous reducing solution. The surface of the printed circuit board is then seeded, the intended circuitization is photolithographically defined on the printed circuit board, and the circuitization, including the surface circuitization and the plated through hole circuitization, is additively plated.
摘要翻译：公开了一种对印刷电路板进行钻孔，去除和附加电路化的方法。印刷电路板在产生玻璃和聚合物涂抹通孔和通孔的条件下钻孔。通过对钻孔的印刷电路板进行蒸气喷射除去颗粒物。接下来，将印刷电路板浸泡在溶剂中以使印刷电路板的电路插板上的钻头污迹膨胀。然后通过夹带在气体中除去该溶剂，并且将水性，酸性氧化溶液流通过印刷电路板孔，以除去通孔中的溶胀污迹并产生导体回蚀。在水冲洗之后，将水性还原溶液通过印刷电路板以减少并除去酸性氧化性水溶液，例如残留的酸性水溶液。漂洗印刷电路板以除去还原水溶液。然后将印刷电路板的表面接种，将预期的电路光刻地定义在印刷电路板上，并且包括表面电路化和电镀通孔电路的电路被附加电镀。

7. 发明授权

US4967690A Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means 失效
标题翻译：化学镀具有双层控制溶解氧，具有化学维护方式的具体位置
公开(公告)号：US4967690A
公开(公告)日：1990-11-06
申请号：US508510
申请日：1990-04-12
申请人： Edmond O. Fey , Peter Haselbauer , Dae Y. Jung , Ronald A. Kaschak , Hans-Dieter Kilthau , Roy H. Magnuson , Robert J. Wagner
发明人： Edmond O. Fey , Peter Haselbauer , Dae Y. Jung , Ronald A. Kaschak , Hans-Dieter Kilthau , Roy H. Magnuson , Robert J. Wagner
IPC分类号： C23C18/16 , C23C18/40 , H05K3/18
CPC分类号： C23C18/40 , C23C18/1619 , C23C18/1682 , C23C18/1683 , H05K3/187
摘要： Nodule formation in a continuous electroless copper plating system is minimized by independently controlling the dissolved oxygen contents on the plating solution in the bath and in the associated external piping. The level of dissolved oxygen in the plating tank is maintained at a value such that satisfactory plating takes place. At the point where the plating solution leaves the tank, additional oxygen gas is introducted into the solution so that the level of dissolved oxygen in the plating solution in the external piping is high enough to prevent any plating from taking place in the external piping and so that in the external piping the copper is etched or dissolved back into solution. At the end of the external piping, the dissolved oxygen level is reduced so that the dissolved oxygen level of the plating solution in the tank is maintained at the level where plating will take place.
摘要翻译：通过独立地控制浴中的镀液和相关的外部管道中的溶解氧含量，使连续化学镀铜系统中的结节形成最小化。电镀槽中的溶解氧水平保持在这样的值，使得发生令人满意的电镀。在电镀液离开槽的地方，另外的氧气被引入到溶液中，使得外部管道中的电镀溶液中的溶解氧水平足够高，以防止在外部管道中发生任何电镀在外部管道中，铜被蚀刻或溶解回溶液中。在外部管道的末端，溶解氧水平降低，使得罐中的电镀液的溶解氧水平保持在电镀的水平。

8. 发明授权

US4444626A Electrochromic printing 失效
标题翻译：电致变色印刷
公开(公告)号：US4444626A
公开(公告)日：1984-04-24
申请号：US459929
申请日：1983-01-21
申请人： William E. Bernier , Francis Emmi , Edmond O. Fey , Paul L. Gendler , Robert J. Twieg
发明人： William E. Bernier , Francis Emmi , Edmond O. Fey , Paul L. Gendler , Robert J. Twieg
IPC分类号： B41M5/20 , G01D15/06
CPC分类号： B41M5/20
摘要： An electrochromic printable medium which includes a substrate coated with certain organic compounds and with the reduced form of an oxidizing agent; and use thereof for electrochromic printing.
摘要翻译：一种电致变色可印刷介质，其包括涂覆有某些有机化合物和还原形式的氧化剂的基材; 并用于电致变色印刷。

9. 发明授权

US4358479A Treatment of copper and use thereof 失效
标题翻译：铜的处理及其用途
公开(公告)号：US4358479A
公开(公告)日：1982-11-09
申请号：US211998
申请日：1980-12-01
申请人： Michael J. Canestaro , Edmond O. Fey
发明人： Michael J. Canestaro , Edmond O. Fey
IPC分类号： C23C22/63 , C23F1/34 , H05K3/38 , B05D5/12 , C23F1/00
CPC分类号： C23C22/63 , H05K3/381 , H05K3/385 , H05K2203/0307 , H05K2203/0315 , H05K2203/0723 , H05K2203/1152
摘要： A method for modifying the surface characteristics of copper foil by contacting a surface thereof with an oxidizing composition; and use of the treated copper foil in the preparation of printed circuits.
摘要翻译：一种通过使其表面与氧化组合物接触来改变铜箔的表面特性的方法; 并使用经处理的铜箔制备印刷电路。

10. 发明授权

US06843929B1 Accelerated etching of chromium 失效
标题翻译：加速蚀刻铬
公开(公告)号：US06843929B1
公开(公告)日：2005-01-18
申请号：US09514526
申请日：2000-02-28
申请人： Donald S. Farquhar , Edmond O. Fey , Elizabeth Foster , Michael J. Klodowski , Paul G. Rickerl
发明人： Donald S. Farquhar , Edmond O. Fey , Elizabeth Foster , Michael J. Klodowski , Paul G. Rickerl
IPC分类号： C23F1/26 , H01L21/3213 , B44C1/22
CPC分类号： H01L21/32134 , C23F1/26
摘要： A method and associated structure for increasing the rate at which a chromium volume is etched when the chromium body is contacted by an acid solution such as hydrochloric acid. The etch rate is increased by a metallic or steel body in continuous electrical contact with the chromium volume, both of which are in continuous contact with the acid solution. At a temperature between about 21° C. and about 52° C., and a hydrochloric acid concentration (molarity) between about 1.2 M and about 2.4 M, the etch rate is at least a factor of about two greater than an etch rate that would occur in an absence of the steel body. In one embodiment, the chromium volume is a chromium layer that rests upon a conductive layer that includes a metal such as copper, wherein the acid solution is not in contact with the conductive layer. In another embodiment, the chromium volume is a chromium layer located under a conductive layer that includes a metal such as copper, wherein the steel body and the acid solution both contact the chromium layer through an opening in the conductive layer such that the opening exposes the chromium layer.
摘要翻译：一种用于提高当铬体与诸如盐酸的酸溶液接触时铬体积被蚀刻的速率的方法和相关结构。蚀刻速率由与铬体积连续电接触的金属或钢体增加，两者都与酸溶液连续接触。在约21℃至约52℃的温度和约1.2M至约2.4M之间的盐酸浓度（摩尔浓度）之间，蚀刻速率至少比蚀刻速率大约两倍，将在没有钢体的情况下发生。在一个实施方案中，铬体积是沉积在包括诸如铜的金属的导电层上的铬层，其中酸溶液不与导电层接触。在另一个实施方案中，铬体积是位于导电层下方的铬层，该层包括诸如铜的金属，其中钢体和酸溶液都通过导电层中的开口接触铬层，使得开口暴露于铬层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式