专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06369493B1 Microwave plasma applicator having a thermal transfer medium between a plasma containing tube and a cooling jacket 失效
标题翻译：微波等离子体施加器具有在等离子体容纳管和冷却套之间的热转印介质
公开(公告)号：US06369493B1
公开(公告)日：2002-04-09
申请号：US09300182
申请日：1999-04-27
申请人： Dmitry Lubomirsky , Harald Herchen , Simon Yavelberg , David Palagashvili , Donald J. Olgado
发明人： Dmitry Lubomirsky , Harald Herchen , Simon Yavelberg , David Palagashvili , Donald J. Olgado
IPC分类号： H01J1726
CPC分类号： G03F7/70016 , H01J37/32192 , H01J37/32522
摘要： A plasma applicator having a tube that is surrounded by a cooling jacket such that a volume is defined proximate the tube. The volume is filled with a thermal transfer medium to couple heat from the tube to the cooling jacket. The cooling jacket contains an aperture through which energy is transmitted to a process gas contained in the tube. As such, the process gas is infused with energy and a plasma is formed in the tube.
摘要翻译：一种等离子体施加器，其具有由冷却套包围的管，使得容积限定在管附近。体积填充有热传递介质，以将热量从管耦合到冷却套管。冷却套包含孔，通过该孔将能量传递到管中包含的处理气体。因此，工艺气体注入能量，并且在管中形成等离子体。

2. 发明授权

US06444040B1 Gas distribution plate 有权
标题翻译：气体分布板
公开(公告)号：US06444040B1
公开(公告)日：2002-09-03
申请号：US09565150
申请日：2000-05-05
申请人： Harald Herchen , David Palagashvili , Dmitry Lubomirsky , Alex Schreiber
发明人： Harald Herchen , David Palagashvili , Dmitry Lubomirsky , Alex Schreiber
IPC分类号： C23C1600
CPC分类号： C23C16/45565 , C23C16/455 , H01L21/67017
摘要： An apparatus for use in a substrate processing system. The apparatus is generally a fluid distribution plate comprising an inner disk and an outer ring. The fluid distribution plate has a plurality of openings for fluid distribution and at least one slot defined therein.
摘要翻译：一种用于基板处理系统的装置。该装置通常是包括内盘和外圈的流体分配板。流体分配板具有用于流体分配的多个开口和限定在其中的至少一个狭槽。

3. 发明授权

US06824612B2 Electroless plating system 有权
标题翻译：无电镀系统
公开(公告)号：US06824612B2
公开(公告)日：2004-11-30
申请号：US10036321
申请日：2001-12-26
申请人： Joseph J. Stevens , Dmitry Lubomirsky , Ian Pancham , Donald J. Olgado , Howard E. Grunes , Yeuk-Fai Edwin Mok , Girish Dixit
发明人： Joseph J. Stevens , Dmitry Lubomirsky , Ian Pancham , Donald J. Olgado , Howard E. Grunes , Yeuk-Fai Edwin Mok , Girish Dixit
IPC分类号： B05C502
CPC分类号： H01L21/67167 , C23C18/1632 , C23C18/1692 , H01L21/6723
摘要： A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.
摘要翻译：一种用于电镀基板的方法和装置，其中所述装置包括具有至少一个基板传送机器人的中央基板传送外壳。提供与中心基板传送外壳连通的基板激活室，并且可由至少一个基板传送机器人访问。提供与中心基板传送外壳连通的基板电镀室，并且可由至少一个基板传送机器人访问。提供与中央基板传送外壳连通的基板旋转漂洗干燥室，并且可由至少一个基板传送机器人访问，并且提供与中央基板传送外壳连通的退火室，并且可由至少一个基板传送机器人。还提供了至少一个与基板传送室连通并且可由至少一个基板传送机器人访问的基板盒装载器。

4. 发明授权

US06326597B1 Temperature control system for process chamber 有权
标题翻译：处理室温度控制系统
公开(公告)号：US06326597B1
公开(公告)日：2001-12-04
申请号：US09292726
申请日：1999-04-15
申请人： Dmitry Lubomirsky , Allen I. D'ambra , Edward L Floyd , Qiwei Liang , Daniel J Hoffman , Victor H Fuentes , Simon Yavelberg , Jerry C Chen
发明人： Dmitry Lubomirsky , Allen I. D'ambra , Edward L Floyd , Qiwei Liang , Daniel J Hoffman , Victor H Fuentes , Simon Yavelberg , Jerry C Chen
IPC分类号： B23K1000
CPC分类号： H01L21/67248
摘要： Temperature control of a process chamber 25 is achieved by directing a flow of gas at an external surface 100 of the chamber 25. In one aspect, gas directed at the chamber 25 passes through a gas flow amplifier 115 that increases the gas flow. Gas for the temperature control can be drawn in from the ambient air and, after passing over the process chamber 25, the gas can flow out through an outlet 150. Data is presented demonstrating superior temperature control performance over a conventional system.
摘要翻译：通过在室25的外表面100处引导气体流来实现处理室25的温度控制。在一个方面，指向室25的气体通过增加气体流量的气流放大器115。用于温度控制的气体可以从环境空气中吸入，并且在通过处理室25之后，气体可以通过出口150流出。提供数据表明比常规系统具有优异的温度控制性能。

5. 发明申请

US20050284754A1 Electric field reducing thrust plate 失效
标题翻译：电场减压推力板
公开(公告)号：US20050284754A1
公开(公告)日：2005-12-29
申请号：US10877137
申请日：2004-06-24
申请人： Harald Herchen , Dmitry Lubomirsky , Bo Zheng , Lily Pang
发明人： Harald Herchen , Dmitry Lubomirsky , Bo Zheng , Lily Pang
IPC分类号： C25D7/12 , C25D17/06 , H01L21/288
CPC分类号： C25D7/12 , C25D17/06 , H01L21/2885
摘要： A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a substrate, a thrust plate movably positioned to engage a substrate positioned on the contact pins, and a lip seal member positioned to contact the thrust plate and the contact ring to prevent fluid flow therebetween. The lip seal includes a at least one bubble release channel formed therethrough. The method includes positioning an electric field barrier between a backside substrate engaging member and a frontside substrate supporting member to prevent electric field from traveling to the bevel and backside of the substrate. The electric field barrier including at least one bubble release channel formed therethrough.
摘要翻译：一种用于电化学处理电池的方法和装置，其被配置为最小化斜面和背面沉积。该装置包括用于支撑基板的接触环组件，可移动地定位成接合位于接触销上的基板的止动板，以及定位成接触推力板和接触环以防止其间流体流动的唇形密封件。唇形密封件包括通过其形成的至少一个气泡释放通道。该方法包括在背面基板接合构件和前侧基板支撑构件之间定位电场屏障，以防止电场行进到基板的斜面和背面。电场屏障包括至少一个通过其形成的气泡释放通道。

6. 发明授权

US07285195B2 Electric field reducing thrust plate 失效
标题翻译：电场减压推力板
公开(公告)号：US07285195B2
公开(公告)日：2007-10-23
申请号：US10877137
申请日：2004-06-24
申请人： Harald Herchen , Dmitry Lubomirsky , Bo Zheng , Lily L. Pang
发明人： Harald Herchen , Dmitry Lubomirsky , Bo Zheng , Lily L. Pang
IPC分类号： C25D17/00 , C25D5/00 , C25D17/10
CPC分类号： C25D7/12 , C25D17/06 , H01L21/2885
摘要： A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a substrate, a thrust plate movably positioned to engage a substrate positioned on the contact pins, and a lip seal member positioned to contact the thrust plate and the contact ring to prevent fluid flow therebetween. The lip seal includes at least one bubble release channel formed therethrough. The method includes positioning an electric field barrier between a backside substrate engaging member and a frontside substrate supporting member to prevent electric field from traveling to the bevel and backside of the substrate. The electric field barrier including at least one bubble release channel formed therethrough.
摘要翻译：一种用于电化学处理电池的方法和装置，其被配置为最小化斜面和背面沉积。该装置包括用于支撑基板的接触环组件，可移动地定位成接合位于接触销上的基板的止动板，以及定位成接触推力板和接触环以防止其间流体流动的唇形密封构件。唇形密封件包括至少一个通过其形成的气泡释放通道。该方法包括在背面基板接合构件和前侧基板支撑构件之间定位电场屏障，以防止电场行进到基板的斜面和背面。电场屏障包括至少一个通过其形成的气泡释放通道。

7. 发明授权

US06869516B2 Method for removing electrolyte from electrical contacts and wafer touching areas 失效
标题翻译：从电触点和晶片接触区域去除电解质的方法
公开(公告)号：US06869516B2
公开(公告)日：2005-03-22
申请号：US10273539
申请日：2002-10-18
申请人： Dmitry Lubomirsky , Michael X. Yang , Girish A. Dixit , Vincent E. Burkhart , Allen L. D'Ambra , Yeuk-Fai Edwin Mok , Harald Herchen
发明人： Dmitry Lubomirsky , Michael X. Yang , Girish A. Dixit , Vincent E. Burkhart , Allen L. D'Ambra , Yeuk-Fai Edwin Mok , Harald Herchen
IPC分类号： C25D7/12 , C25D21/00 , H01L21/288 , C25D5/48
CPC分类号： C25D7/12 , C25D21/00 , H01L21/2885
摘要： A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal layer on at least a portion of a surface of the substrate, removing the processed substrate from the support member, and cleaning the one or more electrical contacts with a vapor mixture comprising an alcohol. In another aspect, the method includes spraying the vapor mixture on the electrical contacts while rotating the substrate support member.
摘要翻译：提供了一种用于清洁电化学电镀接触环的电接触区域或衬底接触区域的方法。该方法的实施例包括将基板定位在具有一个或多个电触点的基板支撑构件上，在基板表面的至少一部分上化学镀覆金属层，从处理基板移除经处理的基板，并清洁该基板或更多的与包含醇的蒸汽混合物的电接触。在另一方面，该方法包括在旋转衬底支撑构件的同时将蒸气混合物喷射到电触点上。

8. 发明申请

US20170250060A1 PLASMA PROCESSING SYSTEM WORKPIECE CARRIER WITH THERMALLY ISOLATED HEATER PLATE BLOCKS 审中-公开
公开(公告)号：US20170250060A1
公开(公告)日：2017-08-31
申请号：US15594297
申请日：2017-05-12
申请人： Dmitry Lubomirsky , Son T. Nguyen , Anh N. Nguyen , David Palagashvili
发明人： Dmitry Lubomirsky , Son T. Nguyen , Anh N. Nguyen , David Palagashvili
IPC分类号： H01J37/32 , H01L21/687 , H01L21/67
CPC分类号： H01J37/32724 , H01J37/32082 , H01J37/3244 , H01J37/32715 , H01J2237/334 , H01L21/67069 , H01L21/67103 , H01L21/67109 , H01L21/67248 , H01L21/68785
摘要： A workpiece carrier is described for a plasma processing chamber that has isolated heater plate blocks. In one example, a plasma processing system has a plasma chamber, a plasma source electrically coupled with a showerhead included within the plasma chamber, a workpiece holder in a processing region of the plasma chamber having a puck to carry a workpiece, wherein the workpiece holder includes a heater plate having a plurality of thermally isolated blocks each thermally coupled to the puck, wherein each block includes a heater to heat a respective block of the heater plate, and wherein the workpiece holder includes a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate defining a cooling channel configured to distribute a heat transfer fluid to transfer heat from the cooling plate, and a temperature controller to independently control each heater.

9. 发明授权

US10283321B2 Semiconductor processing system and methods using capacitively coupled plasma 有权
公开(公告)号：US10283321B2
公开(公告)日：2019-05-07
申请号：US13251714
申请日：2011-10-03
申请人： Jang-Gyoo Yang , Matthew L. Miller , Xinglong Chen , Kien N. Chuc , Qiwei Liang , Shankar Venkataraman , Dmitry Lubomirsky
发明人： Jang-Gyoo Yang , Matthew L. Miller , Xinglong Chen , Kien N. Chuc , Qiwei Liang , Shankar Venkataraman , Dmitry Lubomirsky
IPC分类号： H01J37/32
摘要： Substrate processing systems are described that have a capacitively coupled plasma (CCP) unit positioned inside a process chamber. The CCP unit may include a plasma excitation region formed between a first electrode and a second electrode. The first electrode may include a first plurality of openings to permit a first gas to enter the plasma excitation region, and the second electrode may include a second plurality of openings to permit an activated gas to exit the plasma excitation region. The system may further include a gas inlet for supplying the first gas to the first electrode of the CCP unit, and a pedestal that is operable to support a substrate. The pedestal is positioned below a gas reaction region into which the activated gas travels from the CCP unit.

10. 发明申请

US20160035544A1 WAFER CARRIER WITH INDEPENDENT ISOLATED HEATER ZONES 审中-公开
标题翻译：带独立隔离加热器区域的拖车
公开(公告)号：US20160035544A1
公开(公告)日：2016-02-04
申请号：US14614199
申请日：2015-02-04
申请人： Dmitry Lubomirsky , Son T. Nguyen , Anh N. Nguyen , David Palagashvill
发明人： Dmitry Lubomirsky , Son T. Nguyen , Anh N. Nguyen , David Palagashvill
IPC分类号： H01J37/32 , H01L21/687 , C23C16/52 , H01L21/67 , C23C16/458 , C23C16/46
CPC分类号： H01J37/32724 , H01J37/32082 , H01J37/3244 , H01J37/32715 , H01J2237/334 , H01L21/67069 , H01L21/67103 , H01L21/67109 , H01L21/67248 , H01L21/68785
摘要： A wafer carrier is described with independent isolated heater zones. In one example, the carrier has a puck to carry a workpiece for fabrication processes, a heater plate having a plurality of thermally isolated blocks each thermally coupled to the puck, and each having a heater to heat a respective block of the heater plate, and a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate.
摘要翻译：用独立的隔离加热器区域描述晶片载体。在一个示例中，载体具有用于承载用于制造工艺的工件的圆盘，具有多个热耦合到圆盘的热隔离块的加热器板，并且每个具有用于加热加热器板的相应块的加热器，冷却板固定并加热耦合到加热板，冷却板具有一个冷却通道，用于承载传热流体以从冷却板传递热量。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式