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    • 1. 发明申请
    • Electric field reducing thrust plate
    • 电场减压推力板
    • US20050284754A1
    • 2005-12-29
    • US10877137
    • 2004-06-24
    • Harald HerchenDmitry LubomirskyBo ZhengLily Pang
    • Harald HerchenDmitry LubomirskyBo ZhengLily Pang
    • C25D7/12C25D17/06H01L21/288
    • C25D7/12C25D17/06H01L21/2885
    • A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a substrate, a thrust plate movably positioned to engage a substrate positioned on the contact pins, and a lip seal member positioned to contact the thrust plate and the contact ring to prevent fluid flow therebetween. The lip seal includes a at least one bubble release channel formed therethrough. The method includes positioning an electric field barrier between a backside substrate engaging member and a frontside substrate supporting member to prevent electric field from traveling to the bevel and backside of the substrate. The electric field barrier including at least one bubble release channel formed therethrough.
    • 一种用于电化学处理电池的方法和装置,其被配置为最小化斜面和背面沉积。 该装置包括用于支撑基板的接触环组件,可移动地定位成接合位于接触销上的基板的止动板,以及定位成接触推力板和接触环以防止其间流体流动的唇形密封件。 唇形密封件包括通过其形成的至少一个气泡释放通道。 该方法包括在背面基板接合构件和前侧基板支撑构件之间定位电场屏障,以防止电场行进到基板的斜面和背面。 电场屏障包括至少一个通过其形成的气泡释放通道。
    • 8. 发明授权
    • Gas distribution system for a CVD processing chamber
    • 用于CVD处理室的气体分配系统
    • US06486081B1
    • 2002-11-26
    • US09449203
    • 1999-11-24
    • Tetsuya IshikawaPadmanabhan KrishnarajFeng GaoAlan W. CollinsLily Pang
    • Tetsuya IshikawaPadmanabhan KrishnarajFeng GaoAlan W. CollinsLily Pang
    • H01L2131
    • C23C16/45514C23C16/401C23C16/4411C23C16/455C23C16/45563C23C16/45578C23C16/507H01J37/3244H01L21/67069
    • The present invention provides an apparatus for depositing a film on a substrate comprising a processing chamber, a substrate support member disposed within the chamber, a first gas inlet, a second gas inlet, a plasma generator and a gas exhaust. The first gas inlet provides a first gas at a first distance from an interior surface of the chamber, and the second gas inlet provides a second gas at a second distance that is closer than the first distance from the interior surface of the chamber. Thus, the second gas creates a higher partial pressure adjacent the interior surface of the chamber to significantly reduce deposition from the first gas onto the interior surface. The present invention also provides a method for depositing a FSG film on a substrate comprising: introducing first gas through a first gas inlet at a first distance from an interior surface of the chamber, and introducing a second gas through a second gas inlet at a second distance from the interior surface of the chamber, wherein the second gas creates a higher partial pressure adjacent the interior surface of the chamber to prevent deposition from the first gas on the interior surface. Alternatively, the first gas is introduced at a different angle from the second gas with respect to a substrate surface.
    • 本发明提供一种用于在基板上沉积膜的装置,包括处理室,设置在室内的基板支撑件,第一气体入口,第二气体入口,等离子体发生器和排气。 第一气体入口从腔室的内表面提供第一距离的第一气体,并且第二气体入口提供第二距离离第二距离距离腔室内表面的第一距离。 因此,第二气体在室的内表面附近产生较高的分压,以显着地减少从第一气体到内表面的沉积。 本发明还提供了一种用于在衬底上沉积FSG膜的方法,包括:将第一气体通过第一距离腔室的内表面的第一气体入口引入,并将第二气体通过第二气体入口引入第二气体 距离室的内表面的距离,其中第二气体在室的内表面附近产生较高的分压,以防止内表面上的第一气体沉积。 或者,第一气体相对于衬底表面以与第二气体不同的角度被引入。