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1. 发明申请

WO2011075386A3 COMPONENT PACKAGE FOR MAINTAINING SAFE OPERATING TEMPERATURE OF COMPONENTS 审中-公开
公开(公告)号：WO2011075386A3
公开(公告)日：2011-06-23
申请号：PCT/US2010/059670
申请日：2010-12-09
申请人： KLA-TENCOR CORPORATION , SUN, Mei , CHAMPAGNE, Pascal
发明人： SUN, Mei , CHAMPAGNE, Pascal
IPC分类号： H01M2/34 , H01M2/10
摘要： A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.

2. 发明申请

WO2010068178A8 GRID ARRAY ANTENNAS AND AN INTEGRATION STRUCTURE 审中-公开
标题翻译：网格阵列天线和一体化结构
公开(公告)号：WO2010068178A8
公开(公告)日：2010-09-02
申请号：PCT/SG2008000479
申请日：2008-12-12
申请人： UNIV NANYANG , ZHANG YUE PING , SUN MEI
发明人： ZHANG YUE PING , SUN MEI
IPC分类号： H01Q21/00 , H01Q11/00
CPC分类号： H01Q11/04 , H01Q21/24
摘要： A grid array antenna configured to operate with millimetre wavelength signals, the grid array antenna comprising a plurality of mesh elements and at least one radiation element; each mesh element comprising at least one long side and at least one short side operatively connected to the at least one long side; at least one of: the at least one radiating element, the at least one short side, and the at least one long side having compensation for improved antenna output for improved antenna radiation.
摘要翻译： 1.一种网格阵列天线，被配置为以毫米波长信号操作，所述网格阵列天线包括多个网格元件和至少一个辐射元件; 每个网格元件包括可操作地连接到所述至少一个长边的至少一个长边和至少一个短边; 所述至少一个辐射元件，所述至少一个短边和所述至少一个长边中的至少一个具有对用于改善的天线辐射的改进的天线输出的补偿。

3. 发明申请

WO2008042903A3 SYSTEMS FOR SENSING PRESSURE/SHEAR FORCE 审中-公开
标题翻译：感应压力/剪切力系统
公开(公告)号：WO2008042903A3
公开(公告)日：2008-08-07
申请号：PCT/US2007080197
申请日：2007-10-02
申请人： KLA TENCOR TECH CORP , RENKEN WAYNE G , SUN MEI H , MASON ARON ABRAMOWKSI , WIESE LYNN KARL
发明人： RENKEN WAYNE G , SUN MEI H , MASON ARON ABRAMOWKSI , WIESE LYNN KARL
IPC分类号： G01L5/00 , B24B37/04 , G01L1/14 , H01L21/00
CPC分类号： G01L5/0047 , B24B37/04 , B24B49/16 , G01L1/142 , G01L5/008 , H01L21/67253
摘要： At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel. For measuring shear force, at least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
摘要翻译：使用包含在结构中的至少一对电容耦合电极来感测用于测量施加在隔膜上的压力或力的压力或力传感器中的隔膜的偏转。优选地，结构具有与诸如半导体晶片或平板显示面板的实际基板的特性（例如尺寸，硬度，面积和柔性）相同的性质（诸如以下的一个或多个）。为了测量剪切力，当构件与抛光或平坦化表面接触并压靠在抛光或平坦化表面上时，使用至少一个剪切力传感器来测量构件上的剪切力，并且在两个表面之间施加横向力。优选地，结构和结构的表面具有与诸如半导体晶片或平板显示面板的实际基板基本上相同的性质（例如以下的一个或多个：尺寸和摩擦系数）。

4. 发明申请

WO2008042903A2 SYSTEMS FOR SENSING PRESSURE/SHEAR FORCE 审中-公开
标题翻译：检测压力/剪切力的系统
公开(公告)号：WO2008042903A2
公开(公告)日：2008-04-10
申请号：PCT/US2007/080197
申请日：2007-10-02
申请人： KLA-TENCOR TECHNOLOGIES CORPORATION , RENKEN, Wayne, G. , SUN, Mei, H. , MASON, Aron, Abramowksi , WIESE, Lynn, Karl
发明人： RENKEN, Wayne, G. , SUN, Mei, H. , MASON, Aron, Abramowksi , WIESE, Lynn, Karl
IPC分类号： B24B37/04
CPC分类号： G01L5/0047 , B24B37/04 , B24B49/16 , G01L1/142 , G01L5/008 , H01L21/67253
摘要： At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel. For measuring shear force, at least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
摘要翻译：包含在结构中的至少一对电容耦合电极用于感测压力或力传感器中的膜片的偏转，以测量施加在膜片上的压力或力。优选地，该结构具有与诸如半导体晶片或平板显示面板之类的真实基板的基本相同的性质（例如以下中的一个或多个：尺寸，硬度，面积和柔性）。为了测量剪切力，当构件接触并压靠抛光或平坦化表面并在两个表面之间施加横向力时，使用至少一个剪切力传感器来测量构件上的剪切力。优选地，结构和结构的表面具有与真实衬底（诸如半导体晶片或平板显示面板）的结构和表面基本相同的性质（例如以下中的一个或多个：尺寸和摩擦系数）。

5. 发明申请

WO2003097843A1 TUMOR SUPPRESSOR LOCUS IN PROSTATE CANCER 审中-公开
标题翻译：肿瘤抑制剂位于前列腺癌中
公开(公告)号：WO2003097843A1
公开(公告)日：2003-11-27
申请号：PCT/US2003/015208
申请日：2003-05-14
申请人： HENRY M. JACKSON FOUNDATION FOR THE ADVANCEMENT OF MILITARY MEDICINE , ZOU, Chiqiang , SUN, Mei , SRIVASTAVA, Shiv , MOUL, Judd, W.
发明人： ZOU, Chiqiang , SUN, Mei , SRIVASTAVA, Shiv , MOUL, Judd, W.
IPC分类号： C12N15/85
CPC分类号： C07K14/4703 , A61K48/00
摘要： The long arm of chromosome 6 is frequently deleted in diverse human neoplasm. Studies showed a minimum deletion region between markers D6S1056 and D6S300 on chromosome 6q in primary CaP (prostate cancer). Significant association of LOH (loss of heterozygosity) of 6q16 with aging CaP patients and patients with seminal vesicle invasion was shown using LCM (laser capture microdissection)-derived DNA samples from 48 CaP patients. A novel contig designated as 6qTSG1 was generated within a minimal 200 kb region centered around D6S1013. The 6qTSG1 exhibited complex multiple splicing variants with low or absent expression in CaP cells. However, none of the transcripts identified contained a significant open reading frame. Expression of 6qTSG1 was induced in LNCaP cells that were cultured in charcoal-stripped serum medium suggesting an up-regulation of 6qTSG1 by androgen ablation. Induction of 6qTSGl expression in response to androgen ablation was abrogated in androgen independent derivatives of LNCaP cells. The 6qTSG1 inhibited tumor cell growth after transfection into PC3 cells. A candidate CaP suppressor locus was identified on chromosome 6q16.1, of which alteration linked to CaP progression.
摘要翻译：染色体6的长臂在不同的人类肿瘤中经常被删除。研究显示原代CaP（前列腺癌）染色体6q上的标记D6S1056和D6S300之间的最小缺失区。使用来自48名CaP患者的LCM（激光捕获显微切割）衍生的DNA样品，显示6q16的LOH（杂合性的丧失）与老化的CaP患者和精囊浸润患者的显着关联。在以D6S1013为中心的最小200kb区域内产生了称为6qTSG1的新型重叠群体。 6qTSG1表现出在CaP细胞中具有低表达或缺失表达的复合多个剪接变体。然而，没有一个确认的成绩单包含一个重要的开放阅读框架。在用炭活化血清培养基培养的LNCaP细胞中诱导6qTSG1的表达，表明通过雄激素消融上调6qTSG1。在雄激素消融中诱导6qTSG1表达在雄激素非依赖性LNCaP细胞衍生物中被消除。转染PC3细胞后，6qTSG1抑制肿瘤细胞生长。在染色体6q16.1上鉴定出候选CaP抑制基因座，其与CaP进展有关。

6. 发明申请

WO2012154359A1 HEAT SHIELD MODULE FOR SUBSTRATE-LIKE METROLOGY DEVICE 审中-公开
标题翻译：用于基板式仪器的热屏蔽模块
公开(公告)号：WO2012154359A1
公开(公告)日：2012-11-15
申请号：PCT/US2012/032761
申请日：2012-04-09
申请人： KLA-TENCOR CORPORATION , VISHAL, Vaibhaw , SUN, Mei
发明人： VISHAL, Vaibhaw , SUN, Mei
IPC分类号： H01L21/02
CPC分类号： H01L21/67253 , H01L21/67115 , H01L21/67248 , H01L2924/0002 , Y10T428/249923 , H01L2924/00
摘要： A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.
摘要翻译：隔热罩模块包括由高热材料制成的顶部和底部。顶部和底部彼此附接并形成具有开口尺寸的开口的外壳，该开口的尺寸适于容纳电子部件封装，而在组件与顶部和底部之间没有中间绝缘材料。一个或多个腿安装到顶部或底部。腿构造成将外壳附接到基底并且在底部的底表面和基底的顶表面之间形成间隙。

7. 发明申请

WO2012106147A3 PROCESS CONDITION MEASURING DEVICE (PCMD) AND METHOD FOR MEASURING PROCESS CONDITIONS IN A WORKPI ECE PROCESSING TOOL CONFIGURED TO PROCESS PRODUCTION WORKPIECES 审中-公开
标题翻译：工艺条件测量装置（PCMD）和用于测量工艺过程条件的方法用于处理生产工作的工程师ECE加工工具
公开(公告)号：WO2012106147A3
公开(公告)日：2012-11-08
申请号：PCT/US2012022352
申请日：2012-01-24
申请人： KLA TENCOR CORP , SUN MEI , QULI FARHAT , JENSEN EARL , ARLEO PAUL , VISHAL VAIBHAW
发明人： SUN MEI , QULI FARHAT , JENSEN EARL , ARLEO PAUL , VISHAL VAIBHAW
IPC分类号： H01L21/02 , G01K7/16
CPC分类号： G01K17/00 , H01L21/67248
摘要： A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.
摘要翻译：工艺条件测量装置（PCMD）可以包括第一和第二衬底部件。一个或多个温度传感器嵌入每个基板部件内。将第一和第二基板部件夹在一起，使得第二基板部件中的每个温度传感器与位于第一基板部件中的对应的温度传感器串联对准。或者，第一和第二温度传感器可以在同一衬底中平行定位。当PCMD在工件处理工具中经受工艺条件时，可以在成对的相应温度传感器之间测量温差。工具中的工艺条件可以根据温差计算。

8. 发明申请

WO2009009793A3 INHIBITORS OF AKT/PKB WITH ANTI-TUMOR ACTIVITY 审中-公开
公开(公告)号：WO2009009793A3
公开(公告)日：2009-01-15
申请号：PCT/US2008/069974
申请日：2008-07-14
申请人： UNIVERSITY OF SOUTH FLORIDA , CHENG, Jin, Q. , SUN, Mei , SEBTI, Said, M.
发明人： CHENG, Jin, Q. , SUN, Mei , SEBTI, Said, M.
IPC分类号： A61K31/517 , A61K31/53 , A61K31/136 , C07D211/00 , C07D239/70
摘要： The subject invention concerns materials and methods for inhibiting the Akt/PKB pathway. In one embodiment, a compound of the invention inhibits kinase activity and/or phosphorylation levels of Akt proteins. The subject invention also concerns methods for inhibiting or killing a cancer cell or other cell in which expression of an Akt protein is elevated or constitutively active, comprising contacting the cell with an effective amount of a compound of formula I. The subject invention also concerns methods for treating cancer or a tumor in a person or animal comprising administering an effective amount of a compound of formula I to the person or animal.

9. 发明申请

WO2009009793A2 INHIBITORS OF AKT/PKB WITH ANTI-TUMOR ACTIVITY 审中-公开
标题翻译： AKT / PKB抑制剂具有抗肿瘤活性
公开(公告)号：WO2009009793A2
公开(公告)日：2009-01-15
申请号：PCT/US2008069974
申请日：2008-07-14
申请人： UNIV SOUTH FLORIDA , CHENG JIN Q , SUN MEI , SEBTI SAID M
发明人： CHENG JIN Q , SUN MEI , SEBTI SAID M
IPC分类号： A61K31/517 , A61K31/13 , A61K31/53
CPC分类号： C07D471/04 , C07H19/23
摘要： The subject invention concerns materials and methods for inhibiting the Akt/PKB pathway. In one embodiment, a compound of the invention inhibits kinase activity and/or phosphorylation levels of Akt proteins. The subject invention also concerns methods for inhibiting or killing a cancer cell or other cell in which expression of an Akt protein is elevated or constitutively active, comprising contacting the cell with an effective amount of a compound of formula I. The subject invention also concerns methods for treating cancer or a tumor in a person or animal comprising administering an effective amount of a compound of formula I to the person or animal.
摘要翻译：本发明涉及用于抑制Akt / PKB途径的材料和方法。在一个实施方案中，本发明化合物抑制Akt蛋白的激酶活性和/或磷酸化水平。本发明还涉及用于抑制或杀死其中Akt蛋白的表达升高或组成性活性的癌细胞或其他细胞的方法，包括使细胞与有效量的式I化合物接触。本发明还涉及方法用于治疗人或动物中的癌症或肿瘤，所述方法包括给予人或动物有效量的式I化合物。

10. 发明申请

WO2008103700A3 PROCESS CONDITION MEASURING DEVICE 审中-公开
公开(公告)号：WO2008103700A3
公开(公告)日：2008-08-28
申请号：PCT/US2008/054369
申请日：2008-02-20
申请人： KLA-TENCOR CORPORATION , SUN, Mei , WILTSE, Mark , RENKEN, Wayne G. , REID, Zachary , DIBIASE, Tony
发明人： SUN, Mei , WILTSE, Mark , RENKEN, Wayne G. , REID, Zachary , DIBIASE, Tony
IPC分类号： G01R31/28
摘要： An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.

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