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1. 发明申请

WO2012106147A2 PROCESS CONDITION MEASURING DEVICE (PCMD) AND METHOD FOR MEASURING PROCESS CONDITIONS IN A WORKPI ECE PROCESSING TOOL CONFIGURED TO PROCESS PRODUCTION WORKPIECES 审中-公开
标题翻译：工艺条件测量设备（PCMD）以及用于测量配置成处理生产工件的工作设备工艺工具中的工艺条件的方法
公开(公告)号：WO2012106147A2
公开(公告)日：2012-08-09
申请号：PCT/US2012/022352
申请日：2012-01-24
申请人： KLA-TENCOR CORPORATION , SUN, Mei , QULI, Farhat , JENSEN, Earl , ARLEO, Paul , VISHAL, Vaibhaw
发明人： SUN, Mei , QULI, Farhat , JENSEN, Earl , ARLEO, Paul , VISHAL, Vaibhaw
IPC分类号： H01L21/02 , G01K7/16
CPC分类号： G01K17/00 , H01L21/67248
摘要： A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.
摘要翻译：工艺条件测量装置（PCMD）可以包括第一和第二基底部件。一个或多个温度传感器嵌入每个基板组件内。第一和第二衬底组件被夹在一起，使得第二衬底组件中的每个温度传感器与位于第一衬底组件中的相应温度传感器串联排列。或者，第一和第二温度传感器可以平行地放置在相同的衬底中。当PCMD受到工件加工工具中的工艺条件时，可以在成对的相应温度传感器之间测量温度差异。工具中的工艺条件可以通过温差来计算。

2. 发明申请

WO2012154359A1 HEAT SHIELD MODULE FOR SUBSTRATE-LIKE METROLOGY DEVICE 审中-公开
标题翻译：用于基板式仪器的热屏蔽模块
公开(公告)号：WO2012154359A1
公开(公告)日：2012-11-15
申请号：PCT/US2012/032761
申请日：2012-04-09
申请人： KLA-TENCOR CORPORATION , VISHAL, Vaibhaw , SUN, Mei
发明人： VISHAL, Vaibhaw , SUN, Mei
IPC分类号： H01L21/02
CPC分类号： H01L21/67253 , H01L21/67115 , H01L21/67248 , H01L2924/0002 , Y10T428/249923 , H01L2924/00
摘要： A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.
摘要翻译：隔热罩模块包括由高热材料制成的顶部和底部。顶部和底部彼此附接并形成具有开口尺寸的开口的外壳，该开口的尺寸适于容纳电子部件封装，而在组件与顶部和底部之间没有中间绝缘材料。一个或多个腿安装到顶部或底部。腿构造成将外壳附接到基底并且在底部的底表面和基底的顶表面之间形成间隙。

3. 发明申请

WO2017136282A1 INSTRUMENTED SUBSTRATE APPARATUS FOR ACQUIRING MEASUREMENT PARAMETERS IN HIGH TEMPERATURE PROCESS APPLICATIONS 审中-公开
标题翻译：用于在高温处理应用中获取测量参数的仪器化基底装置
公开(公告)号：WO2017136282A1
公开(公告)日：2017-08-10
申请号：PCT/US2017/015648
申请日：2017-01-30
申请人： KLA-TENCOR CORPORATION
发明人： SUN, Mei , VISHAL, Vaibhaw
IPC分类号： H01L21/66 , H01L21/67
CPC分类号： G01K1/20 , G01K1/026 , G01K7/02 , G01K7/16 , G01K13/00 , G01L9/025 , G01T1/16 , G01T7/00
摘要： An apparatus includes a substrate, a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses at least the electronic assembly. An insulating medium is disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure and the system includes a sensor assembly communicatively coupled to the electronic assembly. The sensor assembly includes one or more sensors that are configured to acquire one or more measurement parameters at one or more locations of the substrate. The electronic assembly is configured to receive the one or more measurement parameters from the one or more sensors.
摘要翻译：一种设备包括基板，包括外壳和内壳的嵌套外壳组件，其中外壳包围内壳并且内壳至少包围电子组件。绝缘介质设置在内壳的外表面和外壳的内表面之间的空腔内，并且该系统包括通信地耦合到电子组件的传感器组件。传感器组件包括一个或多个传感器，其被配置为在基板的一个或多个位置获取一个或多个测量参数。电子组件被配置为从一个或多个传感器接收一个或多个测量参数。

4. 发明申请

WO2018209160A1 FLOATING WAFER CHUCK 审中-公开
公开(公告)号：WO2018209160A1
公开(公告)日：2018-11-15
申请号：PCT/US2018/032175
申请日：2018-05-11
申请人： KLA-TENCOR CORPORATION
发明人： BALAN, Aviv , VISHAL, Vaibhaw
IPC分类号： H01L21/687
CPC分类号： H01L21/68721 , H01L21/67017 , H01L21/6838 , H01L21/68728 , H01L21/68735 , H01L21/68757
摘要： Edge grippers are disposed around an outer edge of a chuck. Each of the edge grippers includes a finger configured to pivot around a point; a contact pad configured to contact the wafer; and a flexure disposed between the contact pad and the finger. The flexure is configured to flex toward and away from the chuck. The chuck can use a matrix of vacuum and pressure nozzles designed to keep a wafer floating above the chuck. The edge grippers can hold the wafer at the edge while minimizing deformation of the wafer or without affecting z-jitter of the wafer.

5. 发明申请

WO2014116925A1 METHODS OF ATTACHING A MODULE ON WAFER SUBSTRATE 审中-公开
标题翻译：连接晶片上的模块的方法
公开(公告)号：WO2014116925A1
公开(公告)日：2014-07-31
申请号：PCT/US2014/012910
申请日：2014-01-24
申请人： KLA-TENCOR CORPORATION
发明人： VISHAL, Vaibhaw , NGUYEN, Andrew , HEARN, Kris , SUN, Mei
IPC分类号： H01L23/50
CPC分类号： H01L21/67248 , Y10T29/53
摘要： Aspects of the present disclosure describe an attachment device for mounting a module to a substrate comprises a module leg with two ends and a module foot. One end of the module leg is configured to be attached to a bottom surface of the module and the other end of the module leg is configured to be attached to the module foot. At least a portion of the module foot is configured to be attached to the substrate. Also a portion of a surface area of the module foot is configured to be exposed outside of an area covered by the module. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：本公开的方面描述了用于将模块安装到基板的附接装置，包括具有两端的模块腿和模块脚。模块腿的一端构造成附接到模块的底表面，并且模块腿的另一端构造成附接到模块脚。模块脚的至少一部分被配置成附接到基底。模块脚的表面区域的一部分也被配置为暴露在由模块覆盖的区域的外部。要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

6. 发明公开

EP2707895A1 HEAT SHIELD MODULE FOR SUBSTRATE-LIKE METROLOGY DEVICE 审中-公开
标题翻译：热屏蔽模块用于作基底测量设备
公开(公告)号：EP2707895A1
公开(公告)日：2014-03-19
申请号：EP12782219.5
申请日：2012-04-09
申请人： Kla-Tencor Corporation
发明人： VISHAL, Vaibhaw , SUN, Mei
IPC分类号： H01L21/02
CPC分类号： H01L21/67253 , H01L21/67115 , H01L21/67248 , H01L2924/0002 , Y10T428/249923 , H01L2924/00
摘要： A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.

7. 发明授权

EP2671246B1 PROCESS CONDITION MEASURING DEVICE (PCMD) AND METHOD FOR MEASURING PROCESS CONDITIONS IN A WORKPI ECE PROCESSING TOOL CONFIGURED TO PROCESS PRODUCTION WORKPIECES 有权
公开(公告)号：EP2671246B1
公开(公告)日：2020-03-04
申请号：EP12742613.8
申请日：2012-01-24
申请人： Kla-Tencor Corporation
发明人： SUN, Mei , QULI, Farhat , JENSEN, Earl , ARLEO, Paul , VISHAL, Vaibhaw
IPC分类号： H01L21/67 , G01K17/00

8. 发明公开

EP2671246A2 PROCESS CONDITION MEASURING DEVICE (PCMD) AND METHOD FOR MEASURING PROCESS CONDITIONS IN A WORKPI ECE PROCESSING TOOL CONFIGURED TO PROCESS PRODUCTION WORKPIECES 有权
标题翻译：用于测量过程的条件和程序测量工艺条件生产加工之WORKPIECES CONFIGURED工具
公开(公告)号：EP2671246A2
公开(公告)日：2013-12-11
申请号：EP12742613.8
申请日：2012-01-24
申请人： Kla-Tencor Corporation
发明人： SUN, Mei , QULI, Farhat , JENSEN, Earl , ARLEO, Paul , VISHAL, Vaibhaw
IPC分类号： H01L21/02 , G01K7/16
CPC分类号： G01K17/00 , H01L21/67248
摘要： A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.

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