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1. 发明申请

WO2012106147A2 PROCESS CONDITION MEASURING DEVICE (PCMD) AND METHOD FOR MEASURING PROCESS CONDITIONS IN A WORKPI ECE PROCESSING TOOL CONFIGURED TO PROCESS PRODUCTION WORKPIECES 审中-公开
标题翻译：工艺条件测量设备（PCMD）以及用于测量配置成处理生产工件的工作设备工艺工具中的工艺条件的方法
公开(公告)号：WO2012106147A2
公开(公告)日：2012-08-09
申请号：PCT/US2012/022352
申请日：2012-01-24
申请人： KLA-TENCOR CORPORATION , SUN, Mei , QULI, Farhat , JENSEN, Earl , ARLEO, Paul , VISHAL, Vaibhaw
发明人： SUN, Mei , QULI, Farhat , JENSEN, Earl , ARLEO, Paul , VISHAL, Vaibhaw
IPC分类号： H01L21/02 , G01K7/16
CPC分类号： G01K17/00 , H01L21/67248
摘要： A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.
摘要翻译：工艺条件测量装置（PCMD）可以包括第一和第二基底部件。一个或多个温度传感器嵌入每个基板组件内。第一和第二衬底组件被夹在一起，使得第二衬底组件中的每个温度传感器与位于第一衬底组件中的相应温度传感器串联排列。或者，第一和第二温度传感器可以平行地放置在相同的衬底中。当PCMD受到工件加工工具中的工艺条件时，可以在成对的相应温度传感器之间测量温度差异。工具中的工艺条件可以通过温差来计算。

2. 发明申请

WO2012154359A1 HEAT SHIELD MODULE FOR SUBSTRATE-LIKE METROLOGY DEVICE 审中-公开
标题翻译：用于基板式仪器的热屏蔽模块
公开(公告)号：WO2012154359A1
公开(公告)日：2012-11-15
申请号：PCT/US2012/032761
申请日：2012-04-09
申请人： KLA-TENCOR CORPORATION , VISHAL, Vaibhaw , SUN, Mei
发明人： VISHAL, Vaibhaw , SUN, Mei
IPC分类号： H01L21/02
CPC分类号： H01L21/67253 , H01L21/67115 , H01L21/67248 , H01L2924/0002 , Y10T428/249923 , H01L2924/00
摘要： A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.
摘要翻译：隔热罩模块包括由高热材料制成的顶部和底部。顶部和底部彼此附接并形成具有开口尺寸的开口的外壳，该开口的尺寸适于容纳电子部件封装，而在组件与顶部和底部之间没有中间绝缘材料。一个或多个腿安装到顶部或底部。腿构造成将外壳附接到基底并且在底部的底表面和基底的顶表面之间形成间隙。

3. 发明申请

WO2008103700A3 PROCESS CONDITION MEASURING DEVICE 审中-公开
公开(公告)号：WO2008103700A3
公开(公告)日：2008-08-28
申请号：PCT/US2008/054369
申请日：2008-02-20
申请人： KLA-TENCOR CORPORATION , SUN, Mei , WILTSE, Mark , RENKEN, Wayne G. , REID, Zachary , DIBIASE, Tony
发明人： SUN, Mei , WILTSE, Mark , RENKEN, Wayne G. , REID, Zachary , DIBIASE, Tony
IPC分类号： G01R31/28
摘要： An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.

4. 发明申请

WO2011075386A3 COMPONENT PACKAGE FOR MAINTAINING SAFE OPERATING TEMPERATURE OF COMPONENTS 审中-公开
公开(公告)号：WO2011075386A3
公开(公告)日：2011-06-23
申请号：PCT/US2010/059670
申请日：2010-12-09
申请人： KLA-TENCOR CORPORATION , SUN, Mei , CHAMPAGNE, Pascal
发明人： SUN, Mei , CHAMPAGNE, Pascal
IPC分类号： H01M2/34 , H01M2/10
摘要： A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.

5. 发明申请

WO2012173999A2 WAFER LEVEL SPECTROMETER 审中-公开
公开(公告)号：WO2012173999A2
公开(公告)日：2012-12-20
申请号：PCT/US2012/042065
申请日：2012-06-12
申请人： KLA-TENCOR CORPORATION , JENSEN, Earl , SUN, Mei , O'BRIEN, Kevin
发明人： JENSEN, Earl , SUN, Mei , O'BRIEN, Kevin
IPC分类号： G01J3/02
CPC分类号： G01J3/0259 , G01J1/58 , G01J3/0205 , G01J3/021 , G01J3/0256 , G01J3/0262 , G01J3/36 , G01J2003/1213
摘要： A sensor apparatus for measuring characteristics of optical radiation has a substrate and a low profile spectrally selective detection system located within the substrate at one or more spatially separated locations. The spectrally selective detection system includes a generally laminar array of wavelength selectors optically coupled to a corresponding array of optical detectors. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：用于测量光辐射特性的传感器装置具有位于一个或多个空间分离位置的衬底内的衬底和低剖面光谱选择性检测系统。光谱选择性检测系统包括光学耦合到相应阵列的光学检测器的波长选择器的大体层流阵列。要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

6. 发明申请

WO2012047428A2 ETCH-RESISTANT COATING ON SENSOR WAFERS FOR IN-SITU MEASUREMENT 审中-公开
标题翻译：用于原位测量的传感器晶片上的耐蚀涂层
公开(公告)号：WO2012047428A2
公开(公告)日：2012-04-12
申请号：PCT/US2011/050272
申请日：2011-09-01
申请人： KLA-TENCOR CORPORATION , NGUYEN, Andrew , QULI, Farhat , SUN, Mei , VENKATESAN, Vasudev
发明人： NGUYEN, Andrew , QULI, Farhat , SUN, Mei , VENKATESAN, Vasudev
IPC分类号： H01L21/66
CPC分类号： H01L21/67253 , G01J5/045 , H01J37/32935 , H01L23/28
摘要： A sensor wafer may be configured for in-situ measurements of parameters during an etch process. The sensor wafer may include a substrate, a cover, and one or more components positioned between the substrate and the cover. An etch-resistant coating is formed on one or more surfaces of the cover and/or substrate. The coating is configured to resist etch processes that etch the cover and/or substrate for a longer period than standard thin film materials of the same or greater thickness than the protective coating.
摘要翻译：可以将传感器晶片配置为在蚀刻过程期间对参数进行原位测量。传感器晶片可以包括衬底，盖以及位于衬底和盖之间的一个或多个部件。在覆盖层和/或基底的一个或多个表面上形成耐蚀刻涂层。涂层被配置为抵抗刻蚀工艺，刻蚀工艺比标准薄膜材料更长时间地刻蚀盖和/或基底，其厚度与保护涂层相同或更大。

7. 发明申请

WO2011090850A3 PROCESS CONDITION SENSING DEVICE FOR PLASMA CHAMBER 审中-公开
公开(公告)号：WO2011090850A3
公开(公告)日：2011-07-28
申请号：PCT/US2011/020872
申请日：2011-01-11
申请人： KLA-TENCOR CORPORATION , JENSEN, Earl , SUN, Mei
发明人： JENSEN, Earl , SUN, Mei
IPC分类号： H05H1/46 , G01N27/60 , H01L21/205
摘要： A sensing device for measuring a plasma process parameter in a plasma chamber for processing workpieces may include a substrate with one or more sensor embedded in the substrate. The substrate can have a surface made of substantially the same material as workpieces that are plasma processed in the plasma chamber. Each sensor can include a collector portion made of substantially the same material as the substrate surface. The collector portion includes a surface that is level with the surface of the substrate. Sensor electronics are embedded into the substrate and coupled to the collector portion. When the substrate surface is exposed to a plasma one or more signals resulting from the plasma can be measured with the sensor(s).

8. 发明申请

WO2014107665A1 HIGH TEMPERATURE SENSOR WAFER FOR IN-SITU MEASUREMENTS IN ACTIVE PLASMA 审中-公开
标题翻译：高温传感器用于现场等离子体测量
公开(公告)号：WO2014107665A1
公开(公告)日：2014-07-10
申请号：PCT/US2014/010349
申请日：2014-01-06
申请人： KLA-TENCOR CORPORATION
发明人： SUN, Mei , JENSEN, Earl , QULI, Farhat , SHARRATT, Stephen
IPC分类号： H01L21/02
CPC分类号： G01K1/14 , G01K1/12 , G01K2215/00
摘要： Aspects of the present disclosure disclose a component module in a process condition measuring device comprises a support for supporting a component, one or more legs configured to suspend the support in a spaced-apart relationship with respect to a substrate. An electrically conductive or low-resistivity semiconductor enclosure is configured to enclose the component, the support and the legs between the substrate and the enclosure. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：本公开的方面公开了一种处理状态测量装置中的部件模块，包括用于支撑部件的支撑件，一个或多个腿部，其被配置为以相对于基板间隔开的关系悬挂支撑件。导电或低电阻率半导体外壳被配置为将部件，支撑件和支脚封闭在基板和外壳之间。要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

9. 发明申请

WO2017136282A1 INSTRUMENTED SUBSTRATE APPARATUS FOR ACQUIRING MEASUREMENT PARAMETERS IN HIGH TEMPERATURE PROCESS APPLICATIONS 审中-公开
标题翻译：用于在高温处理应用中获取测量参数的仪器化基底装置
公开(公告)号：WO2017136282A1
公开(公告)日：2017-08-10
申请号：PCT/US2017/015648
申请日：2017-01-30
申请人： KLA-TENCOR CORPORATION
发明人： SUN, Mei , VISHAL, Vaibhaw
IPC分类号： H01L21/66 , H01L21/67
CPC分类号： G01K1/20 , G01K1/026 , G01K7/02 , G01K7/16 , G01K13/00 , G01L9/025 , G01T1/16 , G01T7/00
摘要： An apparatus includes a substrate, a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses at least the electronic assembly. An insulating medium is disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure and the system includes a sensor assembly communicatively coupled to the electronic assembly. The sensor assembly includes one or more sensors that are configured to acquire one or more measurement parameters at one or more locations of the substrate. The electronic assembly is configured to receive the one or more measurement parameters from the one or more sensors.
摘要翻译：一种设备包括基板，包括外壳和内壳的嵌套外壳组件，其中外壳包围内壳并且内壳至少包围电子组件。绝缘介质设置在内壳的外表面和外壳的内表面之间的空腔内，并且该系统包括通信地耦合到电子组件的传感器组件。传感器组件包括一个或多个传感器，其被配置为在基板的一个或多个位置获取一个或多个测量参数。电子组件被配置为从一个或多个传感器接收一个或多个测量参数。

10. 发明申请

WO2017218701A1 ENCAPSULATED INSTRUMENTED SUBSTRATE APPARATUS FOR ACQUIRING MEASUREMENT PARAMETERS IN HIGH TEMPERATURE PROCESS APPLICATIONS 审中-公开
标题翻译：在高温工艺应用中用于获取测量参数的封装仪器化基底装置
公开(公告)号：WO2017218701A1
公开(公告)日：2017-12-21
申请号：PCT/US2017/037548
申请日：2017-06-14
申请人： KLA-TENCOR CORPORATION
发明人： SUN, Mei , JENSEN, Earl , ZHOU, Jing , LIU, Ran
IPC分类号： H01L21/66 , H01L21/67
摘要： An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
摘要翻译：装置包括仪器化衬底装置，包括机械耦合的底部和顶部衬底的衬底组件，电子组件，包括外部和内部封装的嵌套封装组件，其中外部封装围绕内部封装内壳包围电子组件。内壳和外壳之间的绝缘介质以及通信地耦合到电子组件的传感器组件，该传感器组件包括设置在基板组件内的一个或多个位置处的一个或多个传感器，其中电子组件被配置为从一个或多个位置接收一个或多个测量参数或更多传感器。

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