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1. 发明申请

WO2005040726A2 SENSOR POSITIONING SYSTEMS AND METHODS 审中-公开
标题翻译：传感器定位系统和方法
公开(公告)号：WO2005040726A2
公开(公告)日：2005-05-06
申请号：PCT/US2004/032927
申请日：2004-10-05
申请人： SENSARRAY CORPORATION , SUN, Mei H. , SCHWANINGER, Richard , RENKEN, Wayne G.
发明人： SUN, Mei H. , SCHWANINGER, Richard , RENKEN, Wayne G.
IPC分类号： G01D
CPC分类号： G01D11/30
摘要： Multiple sensors may be attached to a substrate to measure conditions at different points. Positioning the sensors accurately may be achieved using a template to establish sensor position. A pre-fabricated kit including a template, sensors and a cable assembly may be easily transported so that sensors may be attached in the field.
摘要翻译：可以将多个传感器附着到基底以测量不同点处的状况。准确定位传感器可以使用模板来建立传感器位置。包括模板，传感器和电缆组件的预制套件可以很容易地运输，以便传感器可以在现场安装。

2. 发明申请

WO2008042903A3 SYSTEMS FOR SENSING PRESSURE/SHEAR FORCE 审中-公开
标题翻译：感应压力/剪切力系统
公开(公告)号：WO2008042903A3
公开(公告)日：2008-08-07
申请号：PCT/US2007080197
申请日：2007-10-02
申请人： KLA TENCOR TECH CORP , RENKEN WAYNE G , SUN MEI H , MASON ARON ABRAMOWKSI , WIESE LYNN KARL
发明人： RENKEN WAYNE G , SUN MEI H , MASON ARON ABRAMOWKSI , WIESE LYNN KARL
IPC分类号： G01L5/00 , B24B37/04 , G01L1/14 , H01L21/00
CPC分类号： G01L5/0047 , B24B37/04 , B24B49/16 , G01L1/142 , G01L5/008 , H01L21/67253
摘要： At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel. For measuring shear force, at least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
摘要翻译：使用包含在结构中的至少一对电容耦合电极来感测用于测量施加在隔膜上的压力或力的压力或力传感器中的隔膜的偏转。优选地，结构具有与诸如半导体晶片或平板显示面板的实际基板的特性（例如尺寸，硬度，面积和柔性）相同的性质（诸如以下的一个或多个）。为了测量剪切力，当构件与抛光或平坦化表面接触并压靠在抛光或平坦化表面上时，使用至少一个剪切力传感器来测量构件上的剪切力，并且在两个表面之间施加横向力。优选地，结构和结构的表面具有与诸如半导体晶片或平板显示面板的实际基板基本上相同的性质（例如以下的一个或多个：尺寸和摩擦系数）。

3. 发明申请

WO2008042903A2 SYSTEMS FOR SENSING PRESSURE/SHEAR FORCE 审中-公开
标题翻译：检测压力/剪切力的系统
公开(公告)号：WO2008042903A2
公开(公告)日：2008-04-10
申请号：PCT/US2007/080197
申请日：2007-10-02
申请人： KLA-TENCOR TECHNOLOGIES CORPORATION , RENKEN, Wayne, G. , SUN, Mei, H. , MASON, Aron, Abramowksi , WIESE, Lynn, Karl
发明人： RENKEN, Wayne, G. , SUN, Mei, H. , MASON, Aron, Abramowksi , WIESE, Lynn, Karl
IPC分类号： B24B37/04
CPC分类号： G01L5/0047 , B24B37/04 , B24B49/16 , G01L1/142 , G01L5/008 , H01L21/67253
摘要： At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel. For measuring shear force, at least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
摘要翻译：包含在结构中的至少一对电容耦合电极用于感测压力或力传感器中的膜片的偏转，以测量施加在膜片上的压力或力。优选地，该结构具有与诸如半导体晶片或平板显示面板之类的真实基板的基本相同的性质（例如以下中的一个或多个：尺寸，硬度，面积和柔性）。为了测量剪切力，当构件接触并压靠抛光或平坦化表面并在两个表面之间施加横向力时，使用至少一个剪切力传感器来测量构件上的剪切力。优选地，结构和结构的表面具有与真实衬底（诸如半导体晶片或平板显示面板）的结构和表面基本相同的性质（例如以下中的一个或多个：尺寸和摩擦系数）。

4. 发明申请

WO2008118780A1 TEMPERATURE EFFECTS ON OVERLAY ACCURACY 审中-公开
标题翻译：温度对覆盖精度的影响
公开(公告)号：WO2008118780A1
公开(公告)日：2008-10-02
申请号：PCT/US2008/057833
申请日：2008-03-21
申请人： KLA-TENCOR CORPORATION , DIBIASE, Tony , SUN, Mei, H. , WILTSE, Mark
发明人： DIBIASE, Tony , SUN, Mei, H. , WILTSE, Mark
IPC分类号： H01L21/66
CPC分类号： G03F7/70875 , G03F7/70633
摘要： This invention claims benefit of prior pending provisional application serial number 60/891,360, filed 2007.02.23. This invention relates to the field of integrated circuit fabrication. More particularly, this invention relates to measuring the temperature at the substrate plane during photoresist exposure of the substrate, and correlating temperature with overlay accuracy.
摘要翻译：本发明要求2007.02.23提交的先前待决临时申请序列号60 / 891,360的权益。本发明涉及集成电路制造领域。更具体地说，本发明涉及在基板的光致抗蚀剂曝光期间测量基板平面处的温度，并且将温度与覆盖精度相关联。

5. 发明申请

WO2005109474A1 INTEGRATED PROCESS CONDITION SENSING WAFER AND DATA ANALYSIS SYSTEM 审中-公开
标题翻译：综合过程感知波形和数据分析系统
公开(公告)号：WO2005109474A1
公开(公告)日：2005-11-17
申请号：PCT/US2005/014832
申请日：2005-04-29
申请人： SENSARRAY CORPORATION , RENKEN, Wayne Glenn , JENSEN, Earl M. , GORDON, Roy , PAQUETTE, Brian , SUN, Mei H.
发明人： RENKEN, Wayne Glenn , JENSEN, Earl M. , GORDON, Roy , PAQUETTE, Brian , SUN, Mei H.
IPC分类号： H01L21/00
CPC分类号： H01L21/67253 , H01L21/6732 , H01L21/681 , H01L2224/48091 , H01L2224/48227 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/12041 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/16152 , H01L2924/16153 , H01L2924/16195 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.
摘要翻译：处理条件测量装置和处理系统可以与生产环境高度集成，其中处理条件测量装置的尺寸接近制造基板的尺寸，并且处理系统类似于用于生产基板的基板载体。可以对生产环境几乎没有干扰地测量工艺条件。数据可以从过程状态测量设备传送到用户很少或没有人为干预。

6. 发明申请

WO2005040726A3 SENSOR POSITIONING SYSTEMS AND METHODS 审中-公开
标题翻译：传感器定位系统和方法
公开(公告)号：WO2005040726A3
公开(公告)日：2005-09-09
申请号：PCT/US2004032927
申请日：2004-10-05
申请人： SENSARRAY CORP , SUN MEI H , SCHWANINGER RICHARD , RENKEN WAYNE G
发明人： SUN MEI H , SCHWANINGER RICHARD , RENKEN WAYNE G
IPC分类号： G01D20060101 , G01D11/30 , G01D21/00
CPC分类号： G01D11/30
摘要： Multiple sensors may be attached to a substrate to measure conditions at different points. Positioning the sensors accurately may be achieved using a template to establish sensor position. A pre-fabricated kit including a template, sensors and a cable assembly may be easily transported so that sensors may be attached in the field.
摘要翻译：可以将多个传感器连接到基底以测量不同点处的状况。使用模板可以精确定位传感器来建立传感器位置。可以容易地输送包括模板，传感器和电缆组件的预制套件，使得传感器可以附接在现场。

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