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1. 发明专利

JP2005346677A Haiku(seventeen-syllabled poem) meeting operation method using wireless lan apparatus 审中-公开
标题翻译：使用无线局域网设备的HAIKU（SEVENTEEN-SYLLABLED POEM）会议操作方法
公开(公告)号：JP2005346677A
公开(公告)日：2005-12-15
申请号：JP2004188991
申请日：2004-05-31
申请人： Atsushi Nakano , 敦之中野
发明人： NAKANO ATSUSHI
IPC分类号： G06Q50/10 , G06Q50/00 , G06F17/60
摘要： PROBLEM TO BE SOLVED: To provide a haiku meeting operation method which drastically saves the time and labor of manual work in a haiku meeting and can cope with even a large haiku meeting of hundreds of poets. SOLUTION: A manual work part in a haiku meeting is automatically performed by wireless LAN apparatus, namely, one master unit and a plurality of slave units. Each wireless LAN apparatus has a compendium of seasonal words, kojien (standard Japanese dictionary), how to historically use kana (Japanese syllabary), and a storing function therein, and each slave unit which is made portable in the shape can be used as a haiku notebook. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种ai会会议运作方式，大大节省了h会会议手工工作的时间和劳动力，能够应付数百名诗人的大型h会。解决方案：无线局域网装置，即一个主单元和多个从单元，自动执行ai会会议中的手动工作部分。每个无线局域网装置具有季节性词汇，日本语（日语字典），历史上使用假名（日语音节）以及其中的存储功能的简要说明，并且可将形状为便携式的每个从属单元用作帅哥笔记本。版权所有（C）2006，JPO＆NCIPI

2. 发明授权

US09227184B2 Method and apparatus of manufacturing exhaust gas-purifying catalyst and nozzle used therefor 有权
标题翻译：制造废气净化催化剂及其喷嘴的方法和装置
公开(公告)号：US09227184B2
公开(公告)日：2016-01-05
申请号：US13251761
申请日：2011-10-03
申请人： Atsushi Nakano , Shigeki Mizuno , Shigeji Matsumoto , Hiroshi Sekine , Suguru Matsui
发明人： Atsushi Nakano , Shigeki Mizuno , Shigeji Matsumoto , Hiroshi Sekine , Suguru Matsui
IPC分类号： B01J37/02 , B05C5/02 , B05C7/02 , B05D7/22
CPC分类号： B05B1/14 , B01J35/04 , B01J37/0215 , B05B12/02 , B05C5/0241 , B05C7/02 , B05D7/22
摘要： A nozzle is configured to discharge a fluid containing a raw material of a catalytic layer to a substrate having first and second end faces and provided with holes each extending from the first end face to the second end face. The nozzle is provided with discharge ports each discharging the fluid toward the first end face of the substrate.
摘要翻译：喷嘴构造成将含有催化剂层的原料的流体排出到具有第一和第二端面的基板，并且设置有从第一端面延伸到第二端面的孔。喷嘴设置有排出口，每个排出口朝向基板的第一端面排出流体。

3. 发明申请

US20140043681A1 LENS ARRAY SHEET 有权
标题翻译：镜头阵列
公开(公告)号：US20140043681A1
公开(公告)日：2014-02-13
申请号：US14112010
申请日：2012-04-04
申请人： Kazuhisa Ishii , Kenjiro Nakamoto , Atsushi Nakano
发明人： Kazuhisa Ishii , Kenjiro Nakamoto , Atsushi Nakano
IPC分类号： G02B27/22 , G02B3/00
CPC分类号： G02B3/0012 , B29D11/00298 , B82Y20/00 , G02B3/005 , G02B27/2214 , G02B2207/101
摘要： A lens array sheet has a glass base and a resin lens array layer formed on the glass base, wherein the resin lens array layer includes a plurality of resin lenses and preferably includes a composite material having nanoparticles added to a matrix of the resin and the plurality of resin lenses are formed on the glass base substantially independently from each other.
摘要翻译：透镜阵列片具有在玻璃基底上形成的玻璃基体和树脂透镜阵列层，其中树脂透镜阵列层包括多个树脂透镜，并且优选地包括具有添加到树脂的基体中的纳米颗粒的复合材料，并且多个的树脂透镜基本上彼此独立地形成在玻璃基底上。

4. 发明授权

US08110929B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US08110929B2
公开(公告)日：2012-02-07
申请号：US12602462
申请日：2008-05-27
申请人： Toshikazu Imaoka , Tetsuro Sawai , Kenichi Kobayashi , Atsushi Nakano
发明人： Toshikazu Imaoka , Tetsuro Sawai , Kenichi Kobayashi , Atsushi Nakano
IPC分类号： H01L23/48
CPC分类号： H05K1/141 , H01L24/73 , H01L25/0657 , H01L2223/6638 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2225/06517 , H01L2225/06527 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H01L2924/15182 , H01L2924/15184 , H01L2924/15311 , H01L2924/3011 , H01L2924/3511 , H05K1/181 , H05K1/182 , H05K3/3436 , H05K2201/09136 , H05K2201/09418 , H05K2201/10545 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor module includes: a substrate having a wiring layer; a first rectangular-shaped semiconductor device mounted on one surface of the substrate; a second rectangular-shaped semiconductor device mounted on the other surface of the substrate. The first semiconductor device is arranged such that each side thereof is not parallel to that of the second semiconductor device, and that the first semiconductor device is superimposed on the second semiconductor device, when seen from the direction perpendicular to the surface of the substrate.
摘要翻译：半导体模块包括：具有布线层的基板; 安装在所述基板的一个表面上的第一矩形半导体器件; 安装在所述基板的另一表面上的第二矩形半导体器件。第一半导体器件布置成使得其每侧不与第二半导体器件的平行平行，并且当从垂直于衬底的表面的方向看时，第一半导体器件重叠在第二半导体器件上。

5. 发明授权

US07688582B2 Electrical device cooling structure in vehicle 失效
标题翻译：车辆电气设备冷却结构
公开(公告)号：US07688582B2
公开(公告)日：2010-03-30
申请号：US11851631
申请日：2007-09-07
申请人： Tomohiro Fukazu , Takeo Nishibori , Kentaro Shibuya , Masao Kawata , Hiroo Yamaguchi , Junya Fujisawa , Atsushi Nakano , Hiroshi Kosaka
发明人： Tomohiro Fukazu , Takeo Nishibori , Kentaro Shibuya , Masao Kawata , Hiroo Yamaguchi , Junya Fujisawa , Atsushi Nakano , Hiroshi Kosaka
IPC分类号： H05K7/20 , A47C7/72 , B60N2/02 , H05K5/00 , B60K11/00
CPC分类号： H01M2/1077 , B60K1/04 , B60K2001/005 , B60K2001/0416 , B60L1/003 , B60L11/1874 , B60L11/1877 , B60L11/1879 , B60L2210/12 , B60L2210/40 , B60L2240/525 , B60L2270/147 , H01M6/5038 , H01M10/613 , H01M10/625 , H01M10/643 , H01M10/6563 , H01M10/6566 , H05K7/20909 , Y02T10/7005 , Y02T10/705 , Y02T10/7233 , Y02T10/7241 , Y10S903/903
摘要： In a power supply unit disposed below a floor behind a seat, battery modules are disposed in a lower position, and a DC/DC converter and a motor driving inverter are disposed side by side in a vehicle width direction above the battery modules. Thus, cooling air flowing from the front side to the rear side of a vehicle body is divided into upper and lower portions to cool in parallel the DC/DC converter and the motor driving inverter on the upper side and the battery modules on the lower side. Thus, it is possible to simplify a passage of the cooling air to reduce the size of the entire power supply unit, and improve mountability of the power supply unit on the vehicle body. Also, it is possible to apply low temperature cooling air, before heat exchange, to the battery module, the DC/DC converter, and the motor driving inverter.
摘要翻译：在设置在座椅后面的地板下方的电源单元中，电池模块设置在较低位置，并且DC / DC转换器和电动机驱动逆变器并排设置在电池模块上方的车辆宽度方向上。因此，从车身的前侧向后方流动的冷却空气被分成上下部分，并联在DC / DC转换器和上侧的电机驱动逆变器和下侧的电池模块。因此，可以简化冷却空气的通过，以减小整个电源单元的尺寸，并且提高电源单元在车身上的安装性。此外，可以在热交换之前将低温冷却空气施加到电池模块，DC / DC转换器和电动机驱动逆变器。

6. 外观设计

USD591753S1 Wireless communication card 有权
标题翻译：无线通信卡
公开(公告)号：USD591753S1
公开(公告)日：2009-05-05
申请号：US29318988
申请日：2008-06-02
申请人： Atsushi Nakano , Masaki Hayashi
设计人： Atsushi Nakano , Masaki Hayashi

7. 发明申请

US20080062622A1 ELECTRICAL DEVICE COOLING STRUCTURE IN VEHICLE 失效
标题翻译：车辆中的电气设备冷却结构
公开(公告)号：US20080062622A1
公开(公告)日：2008-03-13
申请号：US11851631
申请日：2007-09-07
申请人： Tomohiro FUKAZU , Takeo NISHIBORI , Kentaro SHIBUYA , Masao KAWATA , Hiroo YAMAGUCHI , Junya FUJISAWA , Atsushi NAKANO , Hiroshi KOSAKA
发明人： Tomohiro FUKAZU , Takeo NISHIBORI , Kentaro SHIBUYA , Masao KAWATA , Hiroo YAMAGUCHI , Junya FUJISAWA , Atsushi NAKANO , Hiroshi KOSAKA
IPC分类号： H05K7/20
CPC分类号： H01M2/1077 , B60K1/04 , B60K2001/005 , B60K2001/0416 , B60L1/003 , B60L11/1874 , B60L11/1877 , B60L11/1879 , B60L2210/12 , B60L2210/40 , B60L2240/525 , B60L2270/147 , H01M6/5038 , H01M10/613 , H01M10/625 , H01M10/643 , H01M10/6563 , H01M10/6566 , H05K7/20909 , Y02T10/7005 , Y02T10/705 , Y02T10/7233 , Y02T10/7241 , Y10S903/903
摘要： In a power supply unit disposed below a floor behind a seat, battery modules are disposed in a lower position, and a DC/DC converter and a motor driving inverter are disposed side by side in a vehicle width direction above the battery modules. Thus, cooling air flowing from the front side to the rear side of a vehicle body is divided into upper and lower portions to cool in parallel the DC/DC converter 41 and the motor driving inverter on the upper side and the battery modules on the lower side. Thus, it is possible to simplify a passage of the cooling air to reduce the size of the entire power supply unit, and improve mountability of the power supply unit on the vehicle body. Also, it is possible to apply cooling air at low temperature before heat exchange to all the battery module, the DC/DC converter, and the motor driving inverter, thereby enhancing cooling effect.
摘要翻译：在设置在座椅后面的地板下方的电源单元中，电池模块设置在较低位置，并且DC / DC转换器和电动机驱动逆变器并排设置在电池模块上方的车辆宽度方向上。因此，从车身的前侧向后方流动的冷却空气被分成上下部分，并联在DC / DC转换器41和上侧的电动机驱动逆变器和下侧的电池模块侧。因此，可以简化冷却空气的通过，以减小整个电源单元的尺寸，并且提高电源单元在车身上的安装性。此外，可以在所有电池模块，DC / DC转换器和电动机驱动逆变器进行热交换之前，在低温下应用冷却空气，从而提高冷却效果。

8. 发明申请

US20050233641A1 Shield structure of electronic device 审中-公开
标题翻译：电子设备屏蔽结构
公开(公告)号：US20050233641A1
公开(公告)日：2005-10-20
申请号：US11050855
申请日：2005-01-27
申请人： Atsushi Nakano , Hayato Shibano
发明人： Atsushi Nakano , Hayato Shibano
IPC分类号： H05K9/00 , H01R13/648 , H05K7/14
CPC分类号： H05K9/0039
摘要： The present invention relates to shield structure of electronic device in which a base board on which high-frequency circuit blocks are mounted is housed in a conductive case thereby to be shielded. A notch is provided for the base board, and a cut-down piece is provided for the conductive case correspondingly to the notch. Hereby, erroneous insertion in which the insertion direction of the base board is wrong can be eliminated. Further, the insertion working of the base board can be readily performed, and productivity can be improved. By removing the useless space of the base board, high-density mounting can be realized, and the whole of the base board has the sufficient shield effect.
摘要翻译：本发明涉及电子装置的屏蔽结构，其中安装有高频电路块的基板被容纳在导电壳体中，从而被屏蔽。为基板提供凹口，并且相应于凹口设置用于导电壳体的切割件。因此，可以消除基板的插入方向错误的错误插入。此外，可以容易地进行基板的插入加工，并且可以提高生产率。通过去除基板的无用空间，可以实现高密度安装，整个基板具有足够的屏蔽效果。

9. 发明申请

US20050088806A1 Circuit device 失效
标题翻译：电路设备
公开(公告)号：US20050088806A1
公开(公告)日：2005-04-28
申请号：US10941181
申请日：2004-09-15
申请人： Atsushi Kato , Atsushi Nakano
发明人： Atsushi Kato , Atsushi Nakano
IPC分类号： H01L23/50 , H01L23/31 , H01L23/48 , H01L23/495 , H02B1/00
CPC分类号： H01L24/48 , H01L23/3107 , H01L23/49541 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05647 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Provided is a circuit device which has a wiring part for forming an electric circuit therein. A circuit device, in which a circuit element and conductive patterns, which form an electric circuit, are integrally resin-molded, includes: a conductive pattern through which an electric signal passes, the electric signal being inputted/outputted between the electric circuit and the outside; and a wiring part which branches off from the conductive pattern and through which an electric signal passes, the electric signal being inputted to another portion of the electric circuit. According to the circuit device of the present invention, an electric signal inputted/outputted between a built-in electric circuit and the outside can be inputted to another spot of the electric circuit through wiring formed inside the device. Therefore, a pattern structure of a mounting board can be simplified.
摘要翻译：提供一种具有用于在其中形成电路的布线部分的电路装置。其中形成电路的电路元件和导电图案被一体地树脂成型的电路装置包括：电信号通过的导电图案，电信号在电路和电路之间输入/输出外; 以及从导电图案分支并且电信号通过的布线部分，电信号被输入到电路的另一部分。根据本发明的电路装置，可以通过在装置内形成的布线将输入/输出的内置电路与外部的电信号输入到电路的另一个点。因此，可以简化安装板的图案结构。

10. 发明申请

US20050087857A1 Circuit device 有权
标题翻译：电路设备
公开(公告)号：US20050087857A1
公开(公告)日：2005-04-28
申请号：US10948066
申请日：2004-09-23
申请人： Atsushi Nakano , Atsushi Kato
发明人： Atsushi Nakano , Atsushi Kato
IPC分类号： H05K3/28 , H01L21/52 , H01L21/56 , H01L21/58 , H01L23/12 , H01L23/498 , H05K1/18 , H01L23/48
CPC分类号： H01L24/06 , H01L23/49838 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/27013 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/4912 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/8385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10161 , H01L2924/10162 , H01L2924/12042 , H01L2924/13055 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
摘要： Provided is a circuit device which achieves an increased stickiness between a circuit element and other constituent components. A circuit device comprises a conductive pattern, a covering resin covering the conductive pattern except for a first opening portion, and a semiconductor element electrically connected to the conductive pattern exposed from the first opening portion through a conductive paste. A size of the first opening portion is smaller than that of the semiconductor element, and the conductive paste comes into contact with both of the covering resin and the conductive pattern exposed from the first opening portion.
摘要翻译：提供了一种实现电路元件和其它构成部件之间增加的粘性的电路装置。电路装置包括导电图案，覆盖除了第一开口部分之外的导电图案的覆盖树脂，以及半导体元件，电连接到通过导电浆从第一开口部分露出的导电图案。第一开口部分的尺寸小于半导体元件的尺寸，并且导电浆料与从第一开口部分露出的覆盖树脂和导电图案两者接触。

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