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1. 发明授权

US09784890B2 Lens array sheet having glass base and nanoparticle-containing resin lens array layer without a resin planar layer therebetween 有权
公开(公告)号：US09784890B2
公开(公告)日：2017-10-10
申请号：US14112010
申请日：2012-04-04
申请人： Kazuhisa Ishii , Kenjiro Nakamoto , Atsushi Nakano
发明人： Kazuhisa Ishii , Kenjiro Nakamoto , Atsushi Nakano
IPC分类号： G02B3/00 , G02B27/22 , B82Y20/00 , B29D11/00
CPC分类号： G02B3/0012 , B29D11/00298 , B82Y20/00 , G02B3/005 , G02B27/2214 , G02B2207/101
摘要： A lens array sheet has a glass base and a resin lens array layer formed on the glass base, wherein the resin lens array layer includes a plurality of resin lenses and preferably includes a composite material having nanoparticles added to a matrix of the resin and the plurality of resin lenses are formed on the glass base substantially independently from each other.

2. 发明申请

US20140043681A1 LENS ARRAY SHEET 有权
标题翻译：镜头阵列
公开(公告)号：US20140043681A1
公开(公告)日：2014-02-13
申请号：US14112010
申请日：2012-04-04
申请人： Kazuhisa Ishii , Kenjiro Nakamoto , Atsushi Nakano
发明人： Kazuhisa Ishii , Kenjiro Nakamoto , Atsushi Nakano
IPC分类号： G02B27/22 , G02B3/00
CPC分类号： G02B3/0012 , B29D11/00298 , B82Y20/00 , G02B3/005 , G02B27/2214 , G02B2207/101
摘要： A lens array sheet has a glass base and a resin lens array layer formed on the glass base, wherein the resin lens array layer includes a plurality of resin lenses and preferably includes a composite material having nanoparticles added to a matrix of the resin and the plurality of resin lenses are formed on the glass base substantially independently from each other.
摘要翻译：透镜阵列片具有在玻璃基底上形成的玻璃基体和树脂透镜阵列层，其中树脂透镜阵列层包括多个树脂透镜，并且优选地包括具有添加到树脂的基体中的纳米颗粒的复合材料，并且多个的树脂透镜基本上彼此独立地形成在玻璃基底上。

3. 发明授权

US07361718B2 Alkali-soluble gap fill material forming composition for lithography 有权
标题翻译：用于光刻的碱溶性间隙填充材料形成组合物
公开(公告)号：US07361718B2
公开(公告)日：2008-04-22
申请号：US10540389
申请日：2003-12-25
申请人： Satoshi Takei , Kazuhisa Ishii , Shinya Arase
发明人： Satoshi Takei , Kazuhisa Ishii , Shinya Arase
IPC分类号： C08F212/02 , C08F20/06
CPC分类号： H01L21/02118 , G03F7/094 , G03F7/11 , H01L21/0274 , H01L21/31058 , H01L21/31133 , H01L21/31144 , H01L21/312 , H01L21/76224 , H01L21/76808
摘要： There is provided a gap fill material forming composition for lithography that is used in dual damascene process and contributes toward an improvement in production efficiency. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a method comprising coating a photoresist on a substrate having a hole with aspect ratio shown in height/diameter of 1 or more, and transferring an image to the substrate by use of lithography process, and that the composition is coated on the substrate prior to coating of the photoresist, and comprises a polymer having a hydroxy group or a carboxy group and a crosslinking agent. The gap fill material layer obtained from the gap fill material forming composition can be etched back with an alkaline aqueous solution.
摘要翻译：提供了用于光刻的间隙填充材料形成组合物，其用于双镶嵌工艺，并有助于提高生产效率。具体地说，它是间隙填充材料形成组合物，其特征在于该组合物用于制造半导体器件，方法包括在具有高度/直径为1或更大的长宽比的孔的基底上涂覆光致抗蚀剂，并且转移通过使用平版印刷方法将图像转印到基板上，并且在涂覆光致抗蚀剂之前将组合物涂覆在基材上，并且包含具有羟基或羧基的聚合物和交联剂。从间隙填充材料形成组合物获得的间隙填充材料层可以用碱性水溶液回蚀。

4. 发明申请

US20060076323A1 Method and apparatus for laser drilling 审中-公开
标题翻译：激光钻孔的方法和装置
公开(公告)号：US20060076323A1
公开(公告)日：2006-04-13
申请号：US11243998
申请日：2005-10-06
申请人： Kunio Arai , Kazuhisa Ishii
发明人： Kunio Arai , Kazuhisa Ishii
IPC分类号： B23K26/38
CPC分类号： B23K26/0846 , B23K26/18 , B23K26/382 , B23K26/40 , B23K2101/35 , B23K2103/12 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H05K1/0393 , H05K3/0038 , H05K2201/0394 , H05K2203/0156 , H05K2203/1545 , Y10T156/1158 , Y10T156/19
摘要： There is provided a laser drilling method that prevents hanging, expansion, or crinkles of copper foil caused when an ultraviolet laser beam that requires no surface roughening is used for a thin double-sided copper-clad film. The drilling method of the copper-clad film comprises the steps of: using an ultraviolet laser as a laser beam; drilling after bonding a resin film to the backside of the film which is the opposite side to the laser-beam-incidence; and delaminating the resin film on the backside after drilling. The resin film bonded to the backside prevents the copper foil from hanging, thus allowing the laser beam to be efficiently applied to the copper foil, and allowing the copper foil to be completely removed by ablation. In the case of a blind hole, the resin film bonded to the backside prevents expansion of the copper foil. Crinkles can be also prevented.
摘要翻译：提供了一种激光打孔方法，当不需要表面粗糙化的紫外线激光束用于薄的双面覆铜膜时，防止铜箔的悬挂，膨胀或皱缩。铜包膜的钻孔方法包括以下步骤：使用紫外线激光器作为激光束; 在将树脂膜粘合到与激光束入射的相反侧的膜的背面之后进行钻孔; 并在钻孔后在背面剥离树脂膜。结合到背面的树脂膜防止铜箔悬垂，从而允许激光束有效地施加到铜箔上，并且通过烧蚀使铜箔完全去除。在盲孔的情况下，结合到背面的树脂膜防止铜箔膨胀。也可以防止皱纹。

5. 发明授权

US06520670B2 Light radiating device with large beam spot size and spatial optical communication device 有权
公开(公告)号：US06520670B2
公开(公告)日：2003-02-18
申请号：US09938324
申请日：2001-08-23
申请人： Ji Hao Liang , Kazuhisa Ishii , Tsuyoshi Maruyama
发明人： Ji Hao Liang , Kazuhisa Ishii , Tsuyoshi Maruyama
IPC分类号： H01L2331
CPC分类号： H01L33/58 , F21V5/002 , H01L2933/0091 , Y10S362/80
摘要： A light diffusion sheet receives light fluxes radiated from a light radiating element at a first plane of the light diffusion sheet and scatters or diffracts the received light fluxes, and radiates the scattered or diffracted light from an opposite second plane. A light distributing member distributes the light radiated from the second plane of the light diffusion sheet along some direction. A light radiating device is provided which has a relatively large light beam spot.

6. 发明授权

US08007979B2 Acrylic polymer-containing gap fill material forming composition for lithography 有权
标题翻译：含丙烯酸聚合物的间隙填充材料形成组合物用于光刻
公开(公告)号：US08007979B2
公开(公告)日：2011-08-30
申请号：US10544129
申请日：2004-02-20
申请人： Satoshi Takei , Kazuhisa Ishii , Takahiro Kishioka , Yasushi Sakaida
发明人： Satoshi Takei , Kazuhisa Ishii , Takahiro Kishioka , Yasushi Sakaida
IPC分类号： G03F7/004 , G03F7/032 , G03F7/033 , G03F7/26
CPC分类号： G03F7/094 , G03F7/038 , Y10S430/109 , Y10S430/128
摘要： There is provided a gap fill material forming composition for lithography that is used in dual damascene process and is excellent in flattening property and fill property. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a method comprising coating a photoresist on a semiconductor substrate having a hole with aspect ratio shown in height/diameter of 1 or more, and transferring an image to the semiconductor substrate by use of lithography process, and that comprises a polymer, a crosslinking agent and a solvent.
摘要翻译：提供了一种用于光刻的间隙填充材料形成组合物，其用于双镶嵌工艺，并且具有优异的压平性能和填充性能。具体地说，它是一种间隙填充材料形成组合物，其特征在于该组合物用于制造半导体器件，方法包括在具有高度/直径为1或更大的高宽比的孔的半导体衬底上涂覆光致抗蚀剂，以及通过使用光刻工艺将图像转印到半导体衬底，并且包括聚合物，交联剂和溶剂。

7. 发明申请

US20060041078A1 Alkali-soluble gap filling material forming composition for lithography 有权
标题翻译：用于光刻的碱溶性间隙填充材料形成组合物
公开(公告)号：US20060041078A1
公开(公告)日：2006-02-23
申请号：US10540389
申请日：2003-12-25
申请人： Satoshi Takei , Kazuhisa Ishii , Shinya Arase
发明人： Satoshi Takei , Kazuhisa Ishii , Shinya Arase
IPC分类号： C08F120/62
CPC分类号： H01L21/02118 , G03F7/094 , G03F7/11 , H01L21/0274 , H01L21/31058 , H01L21/31133 , H01L21/31144 , H01L21/312 , H01L21/76224 , H01L21/76808
摘要： There is provided a gap fill material forming composition for lithography that is used in dual damascene process and contributes toward an improvement in production efficiency. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a method comprising coating a photoresist on a substrate having a hole with aspect ratio shown in height/diameter of 1 or more, and transferring an image to the substrate by use of lithography process, and that the composition is coated on the substrate prior to coating of the photoresist, and comprises a polymer having a hydroxy group or a carboxy group and a crosslinking agent. The gap fill material layer obtained from the gap fill material forming composition can be etched back with an alkaline aqueous solution.
摘要翻译：提供了用于光刻的间隙填充材料形成组合物，其用于双镶嵌工艺，并有助于提高生产效率。具体地说，它是间隙填充材料形成组合物，其特征在于该组合物用于制造半导体器件，方法包括在具有高度/直径为1或更大的长宽比的孔的基底上涂覆光致抗蚀剂，并且转移通过使用平版印刷方法将图像转印到基板上，并且在涂覆光致抗蚀剂之前将组合物涂覆在基材上，并且包含具有羟基或羧基的聚合物和交联剂。从间隙填充材料形成组合物获得的间隙填充材料层可以用碱性水溶液回蚀。

8. 发明授权

US06371233B2 Lighted storage compartment for snowmobile 失效
标题翻译：照明的雪车储存室
公开(公告)号：US06371233B2
公开(公告)日：2002-04-16
申请号：US09746214
申请日：2000-12-22
申请人： Kazuhisa Ishii
发明人： Kazuhisa Ishii
IPC分类号： B62M2702
CPC分类号： B62K19/46 , B60Q3/30 , B62M27/02
摘要： A snowmobile comprises a seat having a soft cushion layer, a more firm boundary layer, and a rigid support structure. Passages are provided between the soft cushion layer and a chamber such that air can be exchanged from within the seat and the chamber depending upon whether the operator is seated on the seat or standing above the seat. When an operator sits on the seat, air is forced out of the seat cushion material and into the chamber. When the operator stands and the seat cushion rebounds, air is provided to the seat from the chamber. The snowmobile also includes a lit trunk. The trunk is lit by a light bulb used for a rear tail light assembly. The light bulb is secured in a mounting plate that is formed of a translucent material that provides a window into the trunk. The light bulb can have an integrally formed socket, which can be translucent as well, to increase the amount of light transmitted into the trunk. The trunk preferably is not the chamber that communicates with the seat.
摘要翻译：雪地车包括具有软垫层，更坚固的边界层和刚性支撑结构的座椅。在软垫层和室之间提供通道，使得空气可以根据操作者是坐在座椅上还是站在座椅上方而从座椅和室内更换。当操作者坐在座椅上时，空气被迫离开座垫材料并进入腔室。当操作员站立并且座垫反弹时，从腔室向座椅提供空气。雪地摩托车还包括一个点燃的树干。后备灯组件的灯泡用于灯管的后备灯。灯泡固定在由半透明材料形成的安装板中，该半透明材料将窗口提供到树干中。灯泡可以具有一体形成的插座，其也可以是半透明的，以增加传输到树干中的光量。树干优选地不是与座椅连通的室。

9. 发明申请

US20120031147A1 Method and Apparatus for Machining Thin-Film Layer of Workpiece 审中-公开
标题翻译：加工薄膜薄膜层的方法与装置
公开(公告)号：US20120031147A1
公开(公告)日：2012-02-09
申请号：US13254155
申请日：2010-02-24
申请人： Kunio Arai , Yasuhiko Kanaya , Kazuhisa Ishii , Hiroshi Honda
发明人： Kunio Arai , Yasuhiko Kanaya , Kazuhisa Ishii , Hiroshi Honda
IPC分类号： C03B35/24 , C03B23/02
CPC分类号： B23K37/0408 , B23K26/0006 , B23K26/0853 , B23K26/146 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2103/16 , B23K2103/172 , B65G49/064 , B65G2249/045 , H01L21/6838 , H01L31/18
摘要： An apparatus for machining a thin-film layer of a workpiece, which is a transparent glass on which a thin-film layer is disposed on a top surface thereof, includes a workpiece-underside support mechanism for supporting the workpiece in a vertical direction by an air floatation mechanism and a suction mechanism, a clamp device for gripping the workpiece so as to follow the movement in the vertical direction of the workpiece, and a machining head for machining the thin-film layer with a laser beam. The machining head machines the thin-film layer on the top surface of the workpiece by irradiating the workpiece with a laser beam entering through the underside of the workpiece. Further including nozzles, the thin-film layer is machined while the cooling medium is delivered from the nozzles disposed by the thin-film layer side.
摘要翻译：作为在其上表面设置有薄膜层的透明玻璃的工件的薄膜层的加工装置包括：工件下侧支撑机构，用于将工件沿垂直方向支撑，空气浮起机构和抽吸机构，用于夹持工件以沿着工件的垂直方向移动的夹紧装置，以及用激光束加工薄膜层的加工头。加工头通过用通过工件下侧进入的激光束照射工件来在工件的顶表面上加工薄膜层。进一步包括喷嘴，在从由薄膜层侧设置的喷嘴输送冷却介质的同时加工薄膜层。

10. 发明申请

US20060068526A1 Acrylic polymer-containing gap filler forming composition for lithography 有权
标题翻译：用于光刻的含丙烯酸聚合物的间隙填料形成组合物
公开(公告)号：US20060068526A1
公开(公告)日：2006-03-30
申请号：US10544129
申请日：2004-02-20
申请人： Satoshi Takei , Kazuhisa Ishii , Takahiro Kishioka , Yasushi Sakaida
发明人： Satoshi Takei , Kazuhisa Ishii , Takahiro Kishioka , Yasushi Sakaida
IPC分类号： H01L21/48 , C08K5/06
CPC分类号： G03F7/094 , G03F7/038 , Y10S430/109 , Y10S430/128
摘要： There is provided a gap fill material forming composition for lithography that is used in dual damascene process and is excellent in flattening property and fill property. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a method comprising coating a photoresist on a semiconductor substrate having a hole with aspect ratio shown in height/diameter of 1 or more, and transferring an image to the semiconductor substrate by use of lithography process, and that comprises a polymer, a crosslinking agent and a solvent.
摘要翻译：提供了一种用于光刻的间隙填充材料形成组合物，其用于双镶嵌工艺，并且具有优异的压平性能和填充性能。具体地说，它是一种间隙填充材料形成组合物，其特征在于该组合物用于制造半导体器件，方法包括在具有高度/直径为1或更大的高宽比的孔的半导体衬底上涂覆光致抗蚀剂，以及通过使用光刻工艺将图像转印到半导体衬底，并且包括聚合物，交联剂和溶剂。

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