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1. 发明申请

US20050067712A1 Semiconductor apparatus and method of fabricating the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050067712A1
公开(公告)日：2005-03-31
申请号：US10951214
申请日：2004-09-27
申请人： Toshikazu Imaoka , Ryosuke Usui , Atsushi Nakano , Atsushi Kato
发明人： Toshikazu Imaoka , Ryosuke Usui , Atsushi Nakano , Atsushi Kato
IPC分类号： H01L23/12 , H01L23/498 , H01L23/48
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49833 , H01L24/48 , H01L2224/48237 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor apparatus includes a first conductive film and a second conductive film provided on respective sides of an insulating resin film. A circuit element is mounted on the second conductive film. The circuit element is electrically connected to the second conductive film. The second conductive film is provided to cover a via plug. The via plug is tapered with a progressively smaller diameter toward the second conductive film and away from the first conductive film.
摘要翻译：半导体装置包括设置在绝缘树脂膜的两侧的第一导电膜和第二导电膜。电路元件安装在第二导电膜上。电路元件电连接到第二导电膜。第二导电膜被设置成覆盖通孔塞。通孔塞逐渐变细，朝向第二导电膜逐渐变小，并远离第一导电膜。

2. 发明授权

US07019409B2 Circuit device 有权
标题翻译：电路设备
公开(公告)号：US07019409B2
公开(公告)日：2006-03-28
申请号：US10948066
申请日：2004-09-23
申请人： Atsushi Nakano , Atsushi Kato
发明人： Atsushi Nakano , Atsushi Kato
IPC分类号： H01L23/06 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/06 , H01L23/49838 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/27013 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/4912 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/8385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10161 , H01L2924/10162 , H01L2924/12042 , H01L2924/13055 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
摘要： Provided is a circuit device which achieves an increased stickiness between a circuit element and other constituent components. A circuit device comprises a conductive pattern, a covering resin covering the conductive pattern except for a first opening portion, and a semiconductor element electrically connected to the conductive pattern exposed from the first opening portion through a conductive paste. A size of the first opening portion is smaller than that of the semiconductor element, and the conductive paste comes into contact with both of the covering resin and the conductive pattern exposed from the first opening portion.
摘要翻译：提供了一种实现电路元件和其它构成部件之间增加的粘性的电路装置。电路装置包括导电图案，覆盖除了第一开口部分之外的导电图案的覆盖树脂，以及半导体元件，电连接到通过导电浆从第一开口部分露出的导电图案。第一开口部分的尺寸小于半导体元件的尺寸，并且导电浆料与从第一开口部分露出的覆盖树脂和导电图案两者接触。

3. 发明授权

US07563988B2 Circuit device 失效
标题翻译：电路设备
公开(公告)号：US07563988B2
公开(公告)日：2009-07-21
申请号：US10941181
申请日：2004-09-15
申请人： Atsushi Kato , Atsushi Nakano
发明人： Atsushi Kato , Atsushi Nakano
IPC分类号： H01R12/04
CPC分类号： H01L24/48 , H01L23/3107 , H01L23/49541 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05647 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Provided is a circuit device which has a wiring part for forming an electric circuit therein. A circuit device, in which a circuit element and conductive patterns, which form an electric circuit, are integrally resin-molded, includes: a conductive pattern through which an electric signal passes, the electric signal being inputted/outputted between the electric circuit and the outside; and a wiring part which branches off from the conductive pattern and through which an electric signal passes, the electric signal being inputted to another portion of the electric circuit. According to the circuit device of the present invention, an electric signal inputted/outputted between a built-in electric circuit and the outside can be inputted to another spot of the electric circuit through wiring formed inside the device. Therefore, a pattern structure of a mounting board can be simplified.
摘要翻译：提供一种具有用于在其中形成电路的布线部分的电路装置。其中形成电路的电路元件和导电图案被一体地树脂成型的电路装置包括：电信号通过的导电图案，电信号在电路和电路之间输入/输出外; 以及从导电图案分支并且电信号通过的布线部分，电信号被输入到电路的另一部分。根据本发明的电路装置，可以通过在装置内形成的布线将输入/输出的内置电路与外部的电信号输入到电路的另一个点。因此，可以简化安装板的图案结构。

4. 发明申请

US20050092508A1 Circuit device 审中-公开
标题翻译：电路设备
公开(公告)号：US20050092508A1
公开(公告)日：2005-05-05
申请号：US10947652
申请日：2004-09-22
申请人： Atsushi Kato , Atsushi Nakano
发明人： Atsushi Kato , Atsushi Nakano
IPC分类号： H05K1/02 , H01L21/60 , H01L23/12 , H01L23/48 , H01L23/495 , H01L23/66 , H05K1/00 , H05K1/18 , H05K5/06
CPC分类号： H01L23/66 , H01L23/49517 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/6622 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10161 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3011 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2924/00015
摘要： Provided is a circuit device having a structure for suppressing a leakage current between patterns. A circuit device of the embodiments has a constitution in which a circuit element and desired conductive patterns are integrally resin-molded. Furthermore, the circuit device includes: a first conductive pattern connected to a high impedance input terminal of the circuit element; a second conductive pattern provided close to the first conductive pattern; and a guard conductive pattern extended between the first and second conductive patterns. Accordingly, the circuit device is constituted to prevent a leakage current between the first and second conductive patterns.
摘要翻译：提供了具有抑制图案之间的漏电流的结构的电路装置。实施例的电路装置具有其中电路元件和期望的导电图案被一体地树脂模制的构造。此外，电路装置包括：连接到电路元件的高阻抗输入端的第一导电图案; 设置在第一导电图案附近的第二导电图案; 以及在第一和第二导电图案之间延伸的保护导电图案。因此，电路装置被构造成防止第一和第二导电图案之间的漏电流。

5. 发明申请

US20050088806A1 Circuit device 失效
标题翻译：电路设备
公开(公告)号：US20050088806A1
公开(公告)日：2005-04-28
申请号：US10941181
申请日：2004-09-15
申请人： Atsushi Kato , Atsushi Nakano
发明人： Atsushi Kato , Atsushi Nakano
IPC分类号： H01L23/50 , H01L23/31 , H01L23/48 , H01L23/495 , H02B1/00
CPC分类号： H01L24/48 , H01L23/3107 , H01L23/49541 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05647 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Provided is a circuit device which has a wiring part for forming an electric circuit therein. A circuit device, in which a circuit element and conductive patterns, which form an electric circuit, are integrally resin-molded, includes: a conductive pattern through which an electric signal passes, the electric signal being inputted/outputted between the electric circuit and the outside; and a wiring part which branches off from the conductive pattern and through which an electric signal passes, the electric signal being inputted to another portion of the electric circuit. According to the circuit device of the present invention, an electric signal inputted/outputted between a built-in electric circuit and the outside can be inputted to another spot of the electric circuit through wiring formed inside the device. Therefore, a pattern structure of a mounting board can be simplified.
摘要翻译：提供一种具有用于在其中形成电路的布线部分的电路装置。其中形成电路的电路元件和导电图案被一体地树脂成型的电路装置包括：电信号通过的导电图案，电信号在电路和电路之间输入/输出外; 以及从导电图案分支并且电信号通过的布线部分，电信号被输入到电路的另一部分。根据本发明的电路装置，可以通过在装置内形成的布线将输入/输出的内置电路与外部的电信号输入到电路的另一个点。因此，可以简化安装板的图案结构。

6. 发明申请

US20050087857A1 Circuit device 有权
标题翻译：电路设备
公开(公告)号：US20050087857A1
公开(公告)日：2005-04-28
申请号：US10948066
申请日：2004-09-23
申请人： Atsushi Nakano , Atsushi Kato
发明人： Atsushi Nakano , Atsushi Kato
IPC分类号： H05K3/28 , H01L21/52 , H01L21/56 , H01L21/58 , H01L23/12 , H01L23/498 , H05K1/18 , H01L23/48
CPC分类号： H01L24/06 , H01L23/49838 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/27013 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/4912 , H01L2224/49171 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/8385 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10161 , H01L2924/10162 , H01L2924/12042 , H01L2924/13055 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
摘要： Provided is a circuit device which achieves an increased stickiness between a circuit element and other constituent components. A circuit device comprises a conductive pattern, a covering resin covering the conductive pattern except for a first opening portion, and a semiconductor element electrically connected to the conductive pattern exposed from the first opening portion through a conductive paste. A size of the first opening portion is smaller than that of the semiconductor element, and the conductive paste comes into contact with both of the covering resin and the conductive pattern exposed from the first opening portion.
摘要翻译：提供了一种实现电路元件和其它构成部件之间增加的粘性的电路装置。电路装置包括导电图案，覆盖除了第一开口部分之外的导电图案的覆盖树脂，以及半导体元件，电连接到通过导电浆从第一开口部分露出的导电图案。第一开口部分的尺寸小于半导体元件的尺寸，并且导电浆料与从第一开口部分露出的覆盖树脂和导电图案两者接触。

7. 发明授权

US08613606B2 Bellows pump 有权
标题翻译：波纹管泵
公开(公告)号：US08613606B2
公开(公告)日：2013-12-24
申请号：US13201039
申请日：2010-02-02
申请人： Masayoshi Katsura , Atsushi Nakano , Tomohiro Adachi
发明人： Masayoshi Katsura , Atsushi Nakano , Tomohiro Adachi
IPC分类号： F04B43/00 , F01B19/00 , F16J3/04
CPC分类号： F04B43/084 , F04B43/0072 , F04B43/086 , F04B45/02 , F04B45/022
摘要： A bellows pump having a pump body including a suction path and a discharge path for a fluid and a bellows which is placed in a state where a basal end flange is airtightly fixed to the pump body to form a pump chamber with respect to the pump body. The bellows pump further comprises an actuation plate which is attached to a head portion of the bellows so as to cause the bellows to expand and contract with respect to the pump body. The bellows is further configured so that an airtight space is formed with between the actuation plate and a cup shape section formed in the head portion, such that a pressure rise can be absorbed and relaxed by contraction of the space portion caused by elastic film deformation of the thin head portion which faces the space portion.
摘要翻译：一种波纹管泵，其具有包括吸入路径和用于流体和波纹管的排出路径的泵体，所述波纹管被放置在基端凸缘气密地固定到泵体的状态，以形成相对于泵体的泵室。波纹管泵还包括致动板，该致动板附接到波纹管的头部，以使波纹管相对于泵体膨胀和收缩。波纹管进一步构造成使得在致动板和形成在头部部分中的杯形部分之间形成气密空间，使得可以通过弹性膜变形引起的空间部分的收缩而吸收和释放压力上升薄的头部面向空间部分。

8. 外观设计

USD521953S1 Transmitting unit 失效
标题翻译：传输单元
公开(公告)号：USD521953S1
公开(公告)日：2006-05-30
申请号：US29211849
申请日：2004-08-24
申请人： Atsushi Nakano , Hayato Shibano
设计人： Atsushi Nakano , Hayato Shibano

9. 发明申请

US20100165282A1 Pillar spacer formation for tenacious LCDs 审中-公开
标题翻译：用于坚固液晶显示器的支柱间隔物
公开(公告)号：US20100165282A1
公开(公告)日：2010-07-01
申请号：US12318607
申请日：2008-12-31
申请人： Akihiro Mochizuki , Atsushi Nakano , Shinichi Kuroda , Takuya Hirano
发明人： Akihiro Mochizuki , Atsushi Nakano , Shinichi Kuroda , Takuya Hirano
IPC分类号： G02F1/1339
CPC分类号： G02F1/13394 , G02F1/1341 , G02F2202/00
摘要： A liquid crystal display panel embedded with pillar type of spacers comprising a photo reactive material, wherein the mechanical durability of the pillar type of spacers has at least 15.9 MPs of mechanical strength to the external pressing force.
摘要翻译：一种嵌有支柱型间隔物的液晶显示面板，其包括光反应性材料，其中柱型隔离物的机械耐久性对外部按压力具有至少15.9MPs的机械强度。

10. 发明授权

US5200283A Information recording medium 失效
标题翻译：信息记录介质
公开(公告)号：US5200283A
公开(公告)日：1993-04-06
申请号：US828663
申请日：1992-02-06
申请人： Atsushi Nakano , Dai Imanishi , Tadayuki Shimada , Shigeo Shimizu
发明人： Atsushi Nakano , Dai Imanishi , Tadayuki Shimada , Shigeo Shimizu
IPC分类号： G02F1/1333 , G02F1/1334 , G02F1/135 , G11B7/0045 , G11B7/005
CPC分类号： G11B7/005 , G02F1/1354 , G11B7/0045 , G02F1/1334 , Y10S430/146
摘要： An information recording medium includes a first transparent electrode, and a carrier transport layer formed on the first transparent electrode for generating an electric current on the basis of fed carriers. A carrier generation layer formed on the carrier transport layer serves to generate carriers corresponding to a distribution of an intensity of incident information-writing light containing information, and serves to feed the generated carriers to the carrier transport layer. An electric power supply electrically connected to the first transparent electrode serves to generate an electric field corresponding to the distribution of the intensity of the incident information-writing light in cooperation with the carrier transport layer and the carrier generation layer. A photo-modulation layer formed on the carrier generation layer serves to record the information in the incident information-writing light in response to an application of the electric field generated by the electric power supply, and serves to modulate applied information-reading light in accordance with the recorded information. The photo-modulation layer is made of a complex member of high-molecule material and liquid crystal. A second transparent electrode is formed on the photo-modulation layer, and is electrically connected to the electric power supply. The carrier generation layer is made of inorganic material. The carrier generation layer may be made of organic material. In this case, a separating layer is provided between the photo-modulation layer and the carrier generation layer.
摘要翻译：信息记录介质包括第一透明电极和形成在第一透明电极上的载流子传输层，用于基于馈送载体产生电流。形成在载体传输层上的载波产生层用于产生对应于包含信息的入射信息写入光强度的分布的载波，并且用于将产生的载波馈送到载波传输层。电连接到第一透明电极的电源用于与载流子传输层和载体生成层协作，产生与入射信息写入光的强度分布相对应的电场。形成在载体产生层上的光调制层用于响应于由电源产生的电场的应用而在入射信息写入光中记录信息，并且用于调制应用的信息读取光与记录的信息。光调制层由高分子材料和液晶的复合构件制成。第二透明电极形成在光电转换层上，并与电源电连接。载体生成层由无机材料制成。载体产生层可以由有机材料制成。在这种情况下，在光调制层和载体生成层之间设置分离层。

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