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    • 57. 发明授权
    • Self-aligned double gate mosfet with separate gates
    • 自对准双门mosfet与分离的门
    • US07101762B2
    • 2006-09-05
    • US11050366
    • 2005-02-03
    • Guy M. CohenHon-Sum P. Wong
    • Guy M. CohenHon-Sum P. Wong
    • H01L21/336H01L29/76
    • H01L29/66772H01L29/78648
    • A structure and method of manufacturing a double-gate integrated circuit which includes forming a laminated structure having a channel layer and first insulating layers on each side of the channel layer, forming openings in the laminated structure, forming drain and source regions in the openings, removing portions of the laminated structure to leave a first portion of the channel layer exposed, forming a first gate dielectric layer on the channel layer, forming a first gate electrode on the first gate dielectric layer, removing portions of the laminated structure to leave a second portion of the channel layer exposed, forming a second gate dielectric layer on the channel layer, forming a second gate electrode on the second gate dielectric layer, doping the drain and source regions, using self-aligned ion implantation, wherein the first gate electrode and the second gate electrode are formed independent of each other.
    • 一种制造双栅极集成电路的结构和方法,包括在沟道层的每一侧上形成具有沟道层和第一绝缘层的层叠结构,在层叠结构中形成开口,在开口中形成漏极和源极区域, 去除所述层叠结构的部分以使所述沟道层的第一部分暴露,在所述沟道层上形成第一栅极电介质层,在所述第一栅极介电层上形成第一栅电极,去除所述层叠结构的部分以留下第二栅极电介质层 在所述沟道层上形成第二栅极电介质层,在所述第二栅极电介质层上形成第二栅极电极,使用自对准离子注入来掺杂所述漏极和源极区域,其中所述第一栅电极和 第二栅电极彼此独立地形成。
    • 58. 发明授权
    • Self-aligned double-gate MOSFET by selective epitaxy and silicon wafer bonding techniques
    • 通过选择性外延和硅晶片结合技术的自对准双栅极MOSFET
    • US06365465B1
    • 2002-04-02
    • US09272297
    • 1999-03-19
    • Kevin K. ChanGuy M. CohenYuan TaurHon-Sum P. Wong
    • Kevin K. ChanGuy M. CohenYuan TaurHon-Sum P. Wong
    • H01L21336
    • H01L29/78654H01L21/76251H01L21/76264H01L21/76275H01L29/42384H01L29/42392H01L29/66772H01L29/78648H01L29/78684H01L29/78687H01L29/78696
    • A structure and a method of manufacturing a double-gate metal oxide semiconductor transistor includes forming a laminated structure having a single crystal silicon channel layer and insulating oxide and nitride layers on each side of the single crystal silicon channel, forming openings in the laminated structure, forming drain and source regions in the openings, doping the drain and source regions, forming a mask over the laminated structure, removing portions of the laminated structure not protected by the mask, removing the mask and the insulating oxide and nitride layers to leave the single crystal silicon channel layer suspended from the drain and source regions, forming an oxide layer to cover the drain and source regions and the channel layer, and forming a double-gate conductor over the oxide layer such that the double-gate conductor includes a first conductor on a first side of the single crystal silicon channel layer and a second conductor on a second side of the single crystal silicon channel layer.
    • 制造双栅极金属氧化物半导体晶体管的结构和方法包括在单晶硅沟道的每一侧上形成具有单晶硅沟道层和绝缘氧化物层和氮化物层的叠层结构,在层叠结构中形成开口, 在开口中形成漏极和源极区域,掺杂漏极和源极区域,在层压结构上形成掩模,去除未被掩模保护的层压结构的部分,去除掩模和绝缘氧化物和氮化物层以留下单个 从漏极和源极区域悬置的晶体硅沟道层,形成覆盖漏极和源极区域和沟道层的氧化物层,以及在氧化物层上形成双栅极导体,使得双栅极导体包括第一导体 在单晶硅沟道层的第一侧和在单晶的第二面上的第二导体 l硅通道层。