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    • 1. 发明授权
    • Self-aligned double-gate MOSFET by selective epitaxy and silicon wafer bonding techniques
    • 通过选择性外延和硅晶片结合技术的自对准双栅极MOSFET
    • US06759710B2
    • 2004-07-06
    • US10051562
    • 2002-01-18
    • Kevin K. ChanGuy M. CohenYuan TaurHon-Sum P. Wong
    • Kevin K. ChanGuy M. CohenYuan TaurHon-Sum P. Wong
    • H01L2976
    • H01L29/78654H01L21/76251H01L21/76264H01L21/76275H01L29/42384H01L29/42392H01L29/66772H01L29/78648H01L29/78684H01L29/78687H01L29/78696
    • A structure and a method of manufacturing a double-gate metal oxide semiconductor transistor includes forming a laminated structure having a single crystal silicon channel layer and insulating oxide and nitride layers on each side of the single crystal silicon channel, forming openings in the laminated structure, forming drain and source regions in the openings, doping the drain and source regions, forming a mask over the laminated structure, removing portions of the laminated structure not protected by the mask, removing the mask and the insulating oxide and nitride layers to leave the single crystal silicon channel layer suspended from the drain and source regions, forming an oxide layer to cover the drain and source regions and the channel layer, and forming a double-gate conductor over the oxide layer such that the double-gate conductor includes a first conductor on a first side of the single crystal silicon channel layer and a second conductor on a second side of the single crystal silicon channel layer.
    • 制造双栅极金属氧化物半导体晶体管的结构和方法包括在单晶硅沟道的每一侧上形成具有单晶硅沟道层和绝缘氧化物层和氮化物层的叠层结构,在层叠结构中形成开口, 在开口中形成漏极和源极区域,掺杂漏极和源极区域,在层压结构上形成掩模,去除未被掩模保护的层压结构的部分,去除掩模和绝缘氧化物和氮化物层以留下单个 从漏极和源极区域悬置的晶体硅沟道层,形成覆盖漏极和源极区域和沟道层的氧化物层,以及在氧化物层上形成双栅极导体,使得双栅极导体包括第一导体 在单晶硅沟道层的第一侧和在单晶的第二面上的第二导体 l硅通道层。
    • 2. 发明授权
    • Self-aligned double-gate MOSFET by selective epitaxy and silicon wafer bonding techniques
    • 通过选择性外延和硅晶片结合技术的自对准双栅极MOSFET
    • US06365465B1
    • 2002-04-02
    • US09272297
    • 1999-03-19
    • Kevin K. ChanGuy M. CohenYuan TaurHon-Sum P. Wong
    • Kevin K. ChanGuy M. CohenYuan TaurHon-Sum P. Wong
    • H01L21336
    • H01L29/78654H01L21/76251H01L21/76264H01L21/76275H01L29/42384H01L29/42392H01L29/66772H01L29/78648H01L29/78684H01L29/78687H01L29/78696
    • A structure and a method of manufacturing a double-gate metal oxide semiconductor transistor includes forming a laminated structure having a single crystal silicon channel layer and insulating oxide and nitride layers on each side of the single crystal silicon channel, forming openings in the laminated structure, forming drain and source regions in the openings, doping the drain and source regions, forming a mask over the laminated structure, removing portions of the laminated structure not protected by the mask, removing the mask and the insulating oxide and nitride layers to leave the single crystal silicon channel layer suspended from the drain and source regions, forming an oxide layer to cover the drain and source regions and the channel layer, and forming a double-gate conductor over the oxide layer such that the double-gate conductor includes a first conductor on a first side of the single crystal silicon channel layer and a second conductor on a second side of the single crystal silicon channel layer.
    • 制造双栅极金属氧化物半导体晶体管的结构和方法包括在单晶硅沟道的每一侧上形成具有单晶硅沟道层和绝缘氧化物层和氮化物层的叠层结构,在层叠结构中形成开口, 在开口中形成漏极和源极区域,掺杂漏极和源极区域,在层压结构上形成掩模,去除未被掩模保护的层压结构的部分,去除掩模和绝缘氧化物和氮化物层以留下单个 从漏极和源极区域悬置的晶体硅沟道层,形成覆盖漏极和源极区域和沟道层的氧化物层,以及在氧化物层上形成双栅极导体,使得双栅极导体包括第一导体 在单晶硅沟道层的第一侧和在单晶的第二面上的第二导体 l硅通道层。
    • 4. 发明授权
    • Self-aligned gate MOSFET with separate gates
    • 具有分离栅极的自对准栅极MOSFET
    • US06982460B1
    • 2006-01-03
    • US09612260
    • 2000-07-07
    • Guy M. CohenHon-Sum P. Wong
    • Guy M. CohenHon-Sum P. Wong
    • H01L29/76H01L27/01
    • H01L29/66772H01L29/78648
    • A structure and method of manufacturing a double-gate integrated circuit which includes forming a laminated structure having a channel layer and first insulating layers on each side of the channel layer, forming openings in the laminated structure, forming drain and source regions in the openings, removing portions of the laminated structure to leave a first portion of the channel layer exposed, forming a first gate dielectric layer on the channel layer, forming a first gate electrode on the first gate dielectric layer, removing portions of the laminated structure to leave a second portion of the channel layer exposed, forming a second gate dielectric layer on the channel layer, forming a second gate electrode on the second gate dielectric layer, doping the drain and source regions, using self-aligned ion implantation, wherein the first gate electrode and the second gate electrode are formed independent of each other.
    • 一种制造双栅极集成电路的结构和方法,包括在沟道层的每一侧上形成具有沟道层和第一绝缘层的层叠结构,在层叠结构中形成开口,在开口中形成漏极和源极区域, 去除所述层叠结构的部分以使所述沟道层的第一部分暴露,在所述沟道层上形成第一栅极电介质层,在所述第一栅极介电层上形成第一栅电极,去除所述层叠结构的部分以留下第二栅极电介质层 在所述沟道层上形成第二栅极电介质层,在所述第二栅极电介质层上形成第二栅极电极,使用自对准离子注入来掺杂所述漏极和源极区域,其中所述第一栅电极和 第二栅电极彼此独立地形成。
    • 7. 发明授权
    • Self-aligned double gate mosfet with separate gates
    • 自对准双门mosfet与分离的门
    • US07101762B2
    • 2006-09-05
    • US11050366
    • 2005-02-03
    • Guy M. CohenHon-Sum P. Wong
    • Guy M. CohenHon-Sum P. Wong
    • H01L21/336H01L29/76
    • H01L29/66772H01L29/78648
    • A structure and method of manufacturing a double-gate integrated circuit which includes forming a laminated structure having a channel layer and first insulating layers on each side of the channel layer, forming openings in the laminated structure, forming drain and source regions in the openings, removing portions of the laminated structure to leave a first portion of the channel layer exposed, forming a first gate dielectric layer on the channel layer, forming a first gate electrode on the first gate dielectric layer, removing portions of the laminated structure to leave a second portion of the channel layer exposed, forming a second gate dielectric layer on the channel layer, forming a second gate electrode on the second gate dielectric layer, doping the drain and source regions, using self-aligned ion implantation, wherein the first gate electrode and the second gate electrode are formed independent of each other.
    • 一种制造双栅极集成电路的结构和方法,包括在沟道层的每一侧上形成具有沟道层和第一绝缘层的层叠结构,在层叠结构中形成开口,在开口中形成漏极和源极区域, 去除所述层叠结构的部分以使所述沟道层的第一部分暴露,在所述沟道层上形成第一栅极电介质层,在所述第一栅极介电层上形成第一栅电极,去除所述层叠结构的部分以留下第二栅极电介质层 在所述沟道层上形成第二栅极电介质层,在所述第二栅极电介质层上形成第二栅极电极,使用自对准离子注入来掺杂所述漏极和源极区域,其中所述第一栅电极和 第二栅电极彼此独立地形成。
    • 9. 发明授权
    • Sidewall charge-coupled device with trench isolation
    • 侧壁电荷耦合器件具有沟槽隔离
    • US5334868A
    • 1994-08-02
    • US57425
    • 1993-05-05
    • Hon-Sum P. Wong
    • Hon-Sum P. Wong
    • H01L21/763H01L27/148H01L29/78H01L27/14H01L31/00
    • H01L27/14856H01L21/763H01L27/14812H01L27/14831
    • A charge-coupled imaging device comprising a plurality of trenches in the surface of the silicon substrate which separate adjacent columns in the CCD device. A plurality of surface electrodes are provided on the surface of the charge-coupled device extending perpendicular to the isolation trenches, which electrodes provide for clocked transfer of charges between adjacent cells within each column of the charge-coupled device. The CCD cells are formed on the silicon ridges delineated between the isolation trenches, and this structure maximizes the three dimensional surface area of the CCD cells and facilitates transport of charges along the CCD cell sidewalls. The sidewall CCD with trench isolation provides a CCD cell layout size the same as that of a conventional two dimensional CCD cell, but with an increased charge capacity per CCD cell because of the larger three dimensional areas of the CCD cells. The increase in charge capacity means a larger signal-to-noise ratio and consequently a larger dynamic range. In one embodiment, a plurality of shallow electrodes are defined under the surface electrodes to increase the charge carrying surface area and provide better gate control.
    • 一种电荷耦合成像装置,其在所述硅基板的表面中包括在所述CCD器件中分离相邻列的多个沟槽。 多个表面电极设置在垂直于隔离沟槽延伸的电荷耦合器件的表面上,这些电极提供电荷耦合器件的每列内的相邻单元之间的电荷时钟传输。 CCD单元形成在描绘在隔离沟槽之间的硅脊上,并且该结构使CCD单元的三维表面积最大化并且有助于电荷沿着CCD单元侧壁的传输。 具有沟槽隔离的侧壁CCD提供与常规二维CCD单元相同的CCD单元布局尺寸,但是由于CCD单元的较大的三维区域,每个CCD单元具有增加的电荷容量。 充电容量的增加意味着较大的信噪比,因此具有较大的动态范围。 在一个实施例中,多个浅电极被限定在表面电极下面,以增加电荷承载表面积并提供更好的栅极控制。