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11. 发明专利

JP2006339665A Apparatus for manufacturing semiconductor substrate 审中-公开
标题翻译：制造半导体基板的装置
公开(公告)号：JP2006339665A
公开(公告)日：2006-12-14
申请号：JP2006169432
申请日：2006-06-19
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： KIMURA NORIO , MISHIMA KOJI , KUNISAWA JUNJI , MAKINO NATSUKI , TSUJIMURA MANABU , MATSUDA TETSURO , KANEKO HISAFUMI , OKUMURA KATSUYA
IPC分类号： H01L21/288 , C25D7/12 , C25D19/00 , H01L21/304 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor substrate suitable for a small-scaled manufacturing line, which can produce various products in small amounts, cope with a large change of the number of products, produce products having a short product life, and is capable of changing the function flexibly or updating the apparatus. SOLUTION: The apparatus for manufacturing the semiconductor substrate is equipped with a loader/unloader 120, a plurality of treatment units such as a plating film-forming film unit 113, and a transfer mechanism (robots 131-134) which transfers the semiconductor substrate between the units. The mounting portion of each unit has a guide. Each unit can be loaded to the apparatus for manufacturing the semiconductor substrate, or removed from the apparatus for manufacturing the semiconductor substrate, and exchanged for other units, by moving along the guide. The apparatus for manufacturing the semiconductor substrate is comprised by freely combining the units needed in the semiconductor manufacturing processes. And the units performing distinct treatments in the apparatus for manufacturing the semiconductor substrate can be exchanged each other. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供适合于能够少量生产各种产品的适合于小规模生产线的半导体基板的设备，可以应对产品数量的大量变化，生产具有产品寿命短，并且能够灵活地改变功能或更新设备。解决方案：用于制造半导体衬底的装置装备有装载器/卸载器120，多个处理单元如镀膜形成膜单元113和转移机构（机器人131-134）半导体衬底之间的单元。每个单元的安装部分都有一个导轨。每个单元可以被加载到用于制造半导体衬底的装置中，或者从用于制造半导体衬底的装置中移除，并且通过沿导向件移动而被交换到其它单元。用于制造半导体衬底的装置包括通过自由组合半导体制造工艺中所需的单元。并且在用于制造半导体衬底的装置中执行不同处理的单元可以彼此交换。版权所有（C）2007，JPO＆INPIT

12. 发明专利

JP2004035926A Plating apparatus and plating method 有权
公开(公告)号：JP2004035926A
公开(公告)日：2004-02-05
申请号：JP2002192535
申请日：2002-07-01
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： MISHIMA KOJI , IDE KUNIHITO , CHIKAMORI YUSUKE , NOMURA KAZUFUMI , KATSUOKA SEIJI , KUNISAWA JUNJI , MUKOYAMA YOSHITAKA , MAKINO NATSUKI , MATSUDA TETSURO , KANEKO HISAFUMI
IPC分类号： C25D7/12 , C25D5/08 , C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus which does not require to monitor a liquid composition and accessory equipment therefor, and reduces the cost, and to provide a plating method.
SOLUTION: The electrolytic plating apparatus 10 has a substrate treatment region 20 for contacting the surface to be plated of a substrate with a plating solution, and plating it therein. The substrate treatment region 20 is provided with an inflow part 100 for receiving a plating liquid to be used for plating therethrough, and an outflow part 120 for draining the plating liquid used for the plating process therethrough. The apparatus has such a structure as not to return the plating liquid drained from the outflow part 100 to the substrate treatment region 20. Then, the apparatus does not require to monitor the liquid composition, because of having such a structure so as not to use a plating liquid once used at all.
COPYRIGHT: (C)2004,JPO

13. 发明专利

JP2002097594A EQUIPMENT AND METHOD FOR PLATING SUBSTRATE 失效
公开(公告)号：JP2002097594A
公开(公告)日：2002-04-02
申请号：JP2000285522
申请日：2000-09-20
申请人： EBARA CORP , TOSHIBA CORP
发明人： KIMURA NORIO , MISHIMA KOJI , KUNISAWA JUNJI , INOUE HIROAKI , MAKINO NATSUKI , MATSUDA TETSURO , KANEKO HISAFUMI
IPC分类号： H01L21/28 , C25D5/02 , C25D7/12 , C25D17/12 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide equipment and a method for plating a substrate, which can form a plated film on a restricted part on an already plated part of the substrate and can form a uniform metal-plated film. SOLUTION: The equipment for plating a metal for circuit wiring on a substrate 1 comprises, an anodic electrode member 2-2 which is arranged in the opposite side of a surface to be plated 1a of the substrate 1 and has an approximately same area as a desired range to be plated, which is smaller than the surface to be plated 1a of the substrate 1, a porous body member 2-3 which contacts with the anodic electrode member 2-2, a plating liquid supply and exhaust opening 2-6 for introducing the plating liquid into a space 2-7 formed between a surface to be plated 1a of the substrate 1 and the porous body member 2-3, a plating cell 2 provided with a cathode electrode member 2-4 for providing a power supply to the surface to be plated 1a, and a substrate holding part for holding the substrate.

14. 发明专利

JP2002004091A ELECTROLYTIC TREATING DEVICE AND ELECTRIC FIELD STATE CONTROL METHOD 失效
公开(公告)号：JP2002004091A
公开(公告)日：2002-01-09
申请号：JP2000131879
申请日：2000-04-28
申请人： EBARA CORP , TOSHIBA CORP
发明人： MAKINO NATSUKI , MISHIMA KOJI , KUNISAWA JUNJI , INOUE HIROAKI , KIMURA NORIO , ODAGAKI MITSUKO , TSUJIMURA MANABU , MATSUDA TETSURO , KANEKO HISAFUMI , MORITA TOSHIYUKI , OKUMURA KATSUYA
IPC分类号： C25D17/00 , C25D17/10 , C25F7/00 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic treating device which makes it possible to obtain the in-surface distribution of a desired plating film thickness by positively controlling the electric field state of the surface of a substrate to be treated and an electric field state control method for the same. SOLUTION: A plating liquid 10 is filled between an anode 38 and the substrate W to be treated and a high-resistance structure 4 having the electrical conductivity lower than the electrical conductivity of the plating liquid 10 is installed between the anode 38 and the substrate W to be treated. A band-like insulative member 50 is mounted at the outer periphery of the high-resistance structure 4 in order to lower the current density of the segment near the outer periphery on the surface of the substrate W to be treated when current is passed between the anode 38 and the substrate W to be treated.

15. 发明专利

JP2001335992A ELECTROPLATING METHOD AND APPARATUS 失效
公开(公告)号：JP2001335992A
公开(公告)日：2001-12-07
申请号：JP2000150253
申请日：2000-05-22
申请人： TOSHIBA CORP , EBARA CORP
发明人： MATSUDA TETSURO , KANEKO HISAFUMI , MISHIMA KOJI , MAKINO NATSUKI , KUNISAWA JUNJI
IPC分类号： C25D5/06 , C25D7/12 , C25D17/10 , C25D17/14 , C25D21/12 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To suppress the change of properties of a black film formed on an anode. SOLUTION: An upwardly directed wafer 101 is placed on a support base 102. The wafer 101 is formed by successively depositing a Ta film and a Cu film on a Si substrate. A cathode contact 103 to give the cathodic electric potential is connected to the surface of the wafer 101. An impregnated sponge 106 containing electrolyte and a flat phosphor-containing copper anode 105 with the impregnated sponge 106 adhered thereto are arranged facing the surface of the wafer 101. The anode is connected to a power source 111. The anode 105 and the impregnated sponge 106 are movable by the motion of an arm 107, and the anode 105 and the impregnated sponge 106 can be retracted to a retracting position B separate from a plating position A. A container 108 filled with the electrolyte 110 is installed at the retracting position B. In addition, a metal pseudo cathode 109 is installed in the container 108.

16. 发明专利

DE60141186D1 未知
公开(公告)号：DE60141186D1
公开(公告)日：2010-03-11
申请号：DE60141186
申请日：2001-05-28
申请人： EBARA CORP
发明人： MISHIMA KOJI , KUNISAWA JUNJI , MAKINO NATSUKI , KIMURA NORIO , INOUE HIROAKI , NAKAMURA KENJI , MATSUMOTO MORIJI , NANJO TAKAHIRO , ODAGAKI MITSUKO
IPC分类号： H01L21/00 , H01L21/677 , H01L21/68
摘要： A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to load and unload a substrate, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.

17. 发明公开

EP1179617A4 APPARATUS FOR PLATING SUBSTRATE, METHOD FOR PLATING SUBSTRATE, ELECTROLYTIC PROCESSING METHOD, AND APPARATUS THEREOF 审中-公开
标题翻译：装置和方法电镀的基材，电解处理方法及装置
公开(公告)号：EP1179617A4
公开(公告)日：2007-01-24
申请号：EP00985856
申请日：2000-12-25
申请人： EBARA CORP , TOSHIBA KK
发明人： KUNISAWA JUNJI , ODAGAKI MITSUKO , MAKINO NATSUKI , MISHIMA KOJI , NAKAMURA KENJI , INOUE HIROAKI , KIMURA NORIO , MATSUDA TETSUO , KANEKO HISASHI , HAYASAKA NOBUO , OKUMURA KATSUYA , TSUJIMURA MANABU , MORITA TOSHIYUKI
IPC分类号： C23C18/16 , C25D7/12 , C25D17/12 , C25D17/14 , H01L21/00 , H01L21/288 , H01L21/768 , H05K3/42
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , C25D17/12 , C25D17/14 , H01L21/2885 , H01L21/67046 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/6723 , H01L21/76877 , H01L21/76879 , H01L2924/0002 , H05K3/423 , H01L2924/00
摘要： An apparatus for plating a substrate by filling a fine interconnection pattern (recess) formed in a semiconductor substrate with a metal such as copper (Cu) comprises a substrate holding section (36) for horizontally holding and rotating a substrate so oriented that the surface to be plate faces up, a sealer (90) that comes into contact with the periphery of the surface to be plated of the held substrate to seal the periphery water-tightly, and a cathode (88) that comes into contact with the substrate to supply current thereto, and further comprises a cathode section (38) rotatable with the substrate holding section (36), an electrode arm section (30) provided horizontally and vertically movably above the cathode section (38) and having an anode (98) oriented down, and plating solution injecting means for injecting a plating solution into the space between the surface to be plated of the held substrate and the anode of the electrode arm section (30) brought near to the surface to be plated. Therefore, the processings including the plating and its collateral processings are carried out by means of a single unit. A method for plating a substrate is also disclosed.

19. 发明专利

JP2008019495A Method for cleaning porous body, and cleaning device therefor 审中-公开
标题翻译：清洁多孔体的方法及其清洁装置
公开(公告)号：JP2008019495A
公开(公告)日：2008-01-31
申请号：JP2006194361
申请日：2006-07-14
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KANDA HIROYUKI , MAKINO NATSUKI , NOMURA KAZUFUMI
IPC分类号： C25D17/00 , B08B3/08 , B08B3/10
CPC分类号： B08B3/12 , B08B7/00
摘要： PROBLEM TO BE SOLVED: To efficiently clean the inside of even such a porous body as to have a small pore diameter, high density and a large volume. SOLUTION: This cleaning method comprises the steps of: arranging the porous body 110 in an enclosed space; cleaning the inner part of the porous body 110 by passing a pressurized cleaning liquid 124 through the inner part of the porous body 110; then arranging the porous body 110 in the above enclosed space or another enclosed space; and supplying pressurized pure water to the porous body 110 so that the water can pass through the inner part of the porous body 110. COPYRIGHT: (C)2008,JPO&INPIT

20. 发明专利

JP2005136225A Substrate processing device and method 审中-公开
标题翻译：基板处理装置和方法
公开(公告)号：JP2005136225A
公开(公告)日：2005-05-26
申请号：JP2003371159
申请日：2003-10-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KUNISAWA JUNJI , MORISAWA SHINYA , KATSUOKA SEIJI , MAKINO NATSUKI , FUKUNAGA YUKIO , MISHIMA KOJI , KANDA HIROYUKI
IPC分类号： C25D7/12 , C25D17/06 , C25D17/08 , C25F7/00 , H01L21/306 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To perform respective kinds of processing such as electroplating by precisely positioning and holding a substrate at a substrate stage without regard to a difference of the outer diameter of the substrate. SOLUTION: The device is provided with a substrate stage 12 which attachably and detachably holds the substrate W in the state of supporting it horizontally in a vertically movable state, and a positioning guide 54 arranged so as to surround the substrate stage. The positioning guide 54 has a tapered surface 54a which positions the substrate W with respect to the substrate stage 12 in contact with the outer peripheral end face of the substrate W lowered or raised supported horizontally by the substrate stage 12. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过在基板台上精确地定位和保持基板而进行各种处理，例如电镀，而不考虑基板的外径的差异。解决方案：该装置设置有基板台12，该基板台12以可垂直移动的状态水平地支撑基板W并且以包围基板台的方式布置的定位引导件54可拆卸地保持基板W. 定位引导件54具有锥形表面54a，该表面54a使衬底W相对于衬底台12与衬底台12水平支撑的衬底W的外周端面相接触。版权所有（ C）2005，JPO＆NCIPI

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