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1. 发明专利

JP2005029820A Plating method, method of producing semiconductor device, and plating device 审中-公开
标题翻译：电镀方法，制造半导体器件的方法和镀层器件
公开(公告)号：JP2005029820A
公开(公告)日：2005-02-03
申请号：JP2003194254
申请日：2003-07-09
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： YAHIRO KAZUYUKI , KANEKO HISAFUMI , MATSUDA TETSURO , TOYODA HIROSHI , MORITA TOSHIYUKI , MISHIMA SHIRO , NAGAMATSU TAKAHITO , SAITO AKIKO , MISHIMA KOJI , SUZUKI HIDENAO , IDE KUNIHITO , NOMURA KAZUFUMI
IPC分类号： C25D7/12 , C25D17/00 , C25D21/00 , C25D21/08 , C25D21/10 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide a plating method capable of securely burying platings into a recessed part, a method of producing a semiconductor device hardly causing disconnection, and a plating device capable of washing a substrate uniformly.
SOLUTION: A wafer W is rotated by the rotation of a wafer holder 25. Further, water is fed onto the wafer W from a water feeding nozzle 40, and the wafer W is washed. The washing of the wafer W is performed while moving the water feeding nozzle 40 and changing the rotational frequency or the like of the wafer holder 25. After the washing, in a state wherein the wafer W is rotated, the feed of the water from the water feeding nozzle 40 is stopped, and the dewatering of the wafer W is performed. After the dewatering, voltage is applied to the space between an anode electrode 31 and a cathode electrode 28. Also, a plating liquid is fed from the water feeding nozzle 40 onto the wafer W, thereby plating the surface of the wafer W.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够将电镀牢固地埋入凹部中的电镀方法，几乎不会断开的半导体装置的制造方法以及能够均匀地洗涤基板的电镀装置。解决方案：通过晶片保持器25的旋转使晶片W旋转。此外，水从供水喷嘴40供给到晶片W上，并且晶片W被洗涤。在移动给水嘴40并改变晶片保持器25的旋转频率等的同时进行晶片W的洗涤。在清洗之后，在晶片W旋转的状态下，从供水喷嘴40停止，并且执行晶片W的脱水。脱水后，向阳极电极31和阴极电极28之间的空间施加电压。此外，电镀液体从供水喷嘴40供给到晶片W，由此电镀晶片W的表面。
版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005133160A Substrate treatment device and method 审中-公开
标题翻译：基板处理装置和方法
公开(公告)号：JP2005133160A
公开(公告)日：2005-05-26
申请号：JP2003371319
申请日：2003-10-30
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： SUZUKI HIDENAO , MISHIMA KOJI , KANDA HIROYUKI , NOMURA KAZUFUMI , IDE KUNIHITO , YAHIRO KAZUYUKI , TOYODA HIROSHI , MATSUDA TETSURO
IPC分类号： C25D7/12 , C25D17/00 , C25D17/06 , C25D21/10 , H01L21/288 , H01L21/3205 , H01L21/68 , H01L21/683
CPC分类号： H01L21/2885 , C25D7/123 , C25D17/001 , C25D17/06
摘要： PROBLEM TO BE SOLVED: To prevent the generation of defects caused by microbubbles, particles or the like slightly present in an electrolytic solution such as a plating liquid, and to improve the yield. SOLUTION: The substrate treatment device comprises: a substrate holding part 14 holding a substrate W; a first electrode 20 contacted with the substrate W and energizing the face to be treated in the substrate W; a second electrode 42 arranged at the position confronted with the face to be treated in the substrate held by the substrate holding part 14; and an electrolytic solution injection means 44 injecting an electrolytic solution 26 inside a region held between the face to be treated in the substrate held by the substrate holding part 14 and the second electrode 42. The substrate holding part 14 rotates the substrate W while repeating acceleration or deceleration and/or normal rotation or reverse rotation under electrolytic treatment. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了防止微电解产生的缺陷，微电解液等电解液中存在的微粒等，提高产率。基板处理装置包括：保持基板W的基板保持部14; 第一电极20与基板W接触并对基板W中待处理的面进行激励; 第二电极42，其布置在与由待保护的基板保持部分14保持的基板中的被处理面相对的位置; 以及电解液注入装置44，其在保持在由基板保持部分14保持的基板中的被处理面之间的区域内注入电解液26和第二电极42.基板保持部14在重复加速的同时旋转基板W 或在电解处理下减速和/或正常旋转或反向旋转。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004035926A Plating apparatus and plating method 有权
公开(公告)号：JP2004035926A
公开(公告)日：2004-02-05
申请号：JP2002192535
申请日：2002-07-01
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： MISHIMA KOJI , IDE KUNIHITO , CHIKAMORI YUSUKE , NOMURA KAZUFUMI , KATSUOKA SEIJI , KUNISAWA JUNJI , MUKOYAMA YOSHITAKA , MAKINO NATSUKI , MATSUDA TETSURO , KANEKO HISAFUMI
IPC分类号： C25D7/12 , C25D5/08 , C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus which does not require to monitor a liquid composition and accessory equipment therefor, and reduces the cost, and to provide a plating method.
SOLUTION: The electrolytic plating apparatus 10 has a substrate treatment region 20 for contacting the surface to be plated of a substrate with a plating solution, and plating it therein. The substrate treatment region 20 is provided with an inflow part 100 for receiving a plating liquid to be used for plating therethrough, and an outflow part 120 for draining the plating liquid used for the plating process therethrough. The apparatus has such a structure as not to return the plating liquid drained from the outflow part 100 to the substrate treatment region 20. Then, the apparatus does not require to monitor the liquid composition, because of having such a structure so as not to use a plating liquid once used at all.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2005082843A Electrolytic solution control method and control device 审中-公开
标题翻译：电解液控制方法及控制装置
公开(公告)号：JP2005082843A
公开(公告)日：2005-03-31
申请号：JP2003314755
申请日：2003-09-05
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MISHIMA KOJI , HOUDAI MASAO , KANDA HIROYUKI , IDE KUNIHITO , YAMAMOTO AKIRA , KATSUOKA SEIJI , KANEHARA MASAAKI , AKAHORI SHOJI , NAKAGAWA SOUTA
IPC分类号： C25D21/16 , C25D21/12 , C25D21/18 , C25D21/22
CPC分类号： C25D21/12 , C25D21/22
摘要： PROBLEM TO BE SOLVED: To efficiently and precisely control the composition of an electrolytic solution, and to remove the partially decomposed matter of organic components in the electrolytic solution. SOLUTION: At the time when an electrolytic solution comprising organic components and inorganic components is stored in an electrolytic solution storage tank 12, and its composition is maintained to the prescribed one so as to be controlled, an electrolysis exhaust solution used for electrolytic treatment in an electrolytic treatment device 14 is returned to the electrolytic solution storage tank 12 in such a manner that the inorganic components in the electrolysis exhaust solution are controlled, or at least a part of the organic components in the electrolysis exhaust solution is removed. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了有效和精确地控制电解质溶液的组成，并除去电解液中有机组分的部分分解物质。解决方案：当将包含有机组分和无机组分的电解溶液储存在电解液储存罐12中并将其组成保持在规定的时间以便进行控制时，用于电解的电解排气溶液将电解处理装置14中的处理以电解排气溶液中的无机成分进行控制或电解排气溶液中的有机成分的至少一部分被除去的方式返回到电解液储存罐12。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004353061A Electrolysis method and apparatus 审中-公开
公开(公告)号：JP2004353061A
公开(公告)日：2004-12-16
申请号：JP2003154809
申请日：2003-05-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MISHIMA KOJI , IDE KUNIHITO , SUZUKI HIDENAO , NOMURA KAZUFUMI , KANDA HIROYUKI
IPC分类号： C25D7/12 , C25C7/00 , C25D5/00 , C25D17/00 , C25D21/04 , C25D21/12 , C25D21/14 , H01L21/288 , H01L21/445
CPC分类号： C25D17/002 , C25D17/001 , C25D21/04 , H01L21/2885
摘要： PROBLEM TO BE SOLVED: To form a plated film having a high uniformity within the surface of a substrate and uniformly etch the film, even when the substrate has a thinned electric power-supplying layer.
SOLUTION: The electrolysis method comprises arranging a substrate W and a counter electrode plate 20 so as to face each other, filling a space between the substrate W and the counter electrode plate 20 with an electrolytic solution, supplying an electric power between them and electrolyzing the solution. The method further includes arranging a diaphragm 22 between the substrate W and the counter electrode plate 20, and supplying the electrolytic solutions Q
1 and Q
2 having different resistivities respectively to a substrate side region and a counter electrode side region, which are divided by the diaphragm 22.
COPYRIGHT: (C)2005,JPO&NCIPI

6. 发明专利

JP2008150631A Plating apparatus and plating method 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：JP2008150631A
公开(公告)日：2008-07-03
申请号：JP2006336481
申请日：2006-12-14
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KANDA HIROYUKI , KUNISAWA JUNJI , IDE KUNIHITO
IPC分类号： C25D17/00 , C25D7/12 , C25D17/06 , C25D17/10 , C25D21/14
摘要： PROBLEM TO BE SOLVED: To form a more uniformly plated film over the whole surface of even a substrate having higher sheet resistance on the surface.
SOLUTION: A plating apparatus comprises: a substrate-holding part for holding a substrate (W); a cathode part 38 provided with a cathode contact 88 which comes into contact with the substrate (W) held by the substrate-holding part and energizes the substrate (W); and an anode 98 which is arranged so as to face the surface of the substrate (W) held by the substrate-holding part and has a plurality of insoluble anode plates 112a and 112b of a mesh shape or having pores in the whole face stacked so as to be separated from each other at a predetermined interval. A plating method includes filling a space between the substrate (W) held by the substrate-holding part and the anode 98 with a plating solution, and then plating the surface of the substrate (W).
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：在表面上具有较高薄层电阻的基板的整个表面上形成更均匀的镀膜。电镀装置包括：用于保持基板（W）的基板保持部分; 阴极部38设置有与基板保持部保持的基板（W）接触并使基板（W）通电的阴极接触件88。以及阳极98，其被布置成面对由基板保持部保持的基板（W）的表面，并且具有多个不饱和的阳极板112a和112b，其具有网状或整个面上的孔堆叠成以预定间隔彼此分离。电镀方法包括将由基板保持部保持的基板（W）与阳极98之间的电镀液填充到电镀液中，然后对基板（W）的表面进行电镀。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2005146398A Plating method and plating apparatus 审中-公开
标题翻译：电镀方法和镀膜装置
公开(公告)号：JP2005146398A
公开(公告)日：2005-06-09
申请号：JP2003389702
申请日：2003-11-19
申请人： Ebara Corp , 株式会社荏原製作所
发明人： IDE KUNIHITO , MISHIMA KOJI , KANDA HIROYUKI , SUZUKI HIDENAO , NOMURA KAZUFUMI
IPC分类号： C25D3/38 , C25D7/12 , H01L21/288 , H01L21/44 , H01L21/768
CPC分类号： C25D17/001 , C25D3/38 , C25D7/123 , H01L21/2885
摘要： PROBLEM TO BE SOLVED: To form a plating film having superior in-plane uniformity on a thinned seed layer, and besides, having superior properties of plugging a refined damascene structure.
SOLUTION: This plating method comprises placing an electric resistor 534 between an electric conductor layer formed on at least one part of the surface of a substrate and an anode 536; introducing a plating liquid 550 containing 25 to 75 g/L copper ions and 0.4 mol/L or more organic or inorganic acid, into a space of the conductor layer side in between the electric conductor layer and the anode 536, and an anolyte 538 having the same composition as the plating liquid 550 or containing 0 to 75 g/L copper ions and 0.6 mol/L or less organic or inorganic acid to a space of the anode 536 side, to fill a space in between the electric conductor layer and the anode 536 with a plating liquid 550 and an anolyte 538; and applying voltage between the conductor layer and the anode 536 to plate the surface of the conductor layer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：在薄型种子层上形成具有优异的面内均匀性的镀膜，此外，具有优异的堵塞精制镶嵌结构的性能。解决方案：该电镀方法包括将电阻器534放置在形成在基板表面的至少一部分上的导电体层和阳极536之间; 将含有25〜75g / L的铜离子和0.4mol / L以上的有机或无机酸的电镀液550引入到导电体层和阳极536之间的导体层侧的空间中，并且阳极电解液538具有与电镀液550相同的组成或含有0〜75g / L的铜离子和0.6mol / L以下的有机或无机酸添加到阳极536侧的空间，填充导体层和具有电镀液体550和阳极电解液538的阳极536; 并且在导体层和阳极536之间施加电压以对导体层的表面进行平板化。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2005213610A Plating equipment and method 有权
标题翻译：涂装设备及方法
公开(公告)号：JP2005213610A
公开(公告)日：2005-08-11
申请号：JP2004023256
申请日：2004-01-30
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KANDA HIROYUKI , MISHIMA KOJI , MORISAWA SHINYA , KUNISAWA JUNJI , IDE KUNIHITO , SUZUKI HIDENAO
IPC分类号： C25D7/12 , C25D17/00 , C25D17/06 , C25D17/12 , C25D21/00 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To make it possible to surely embed plating metal into micro-recessed parts without the occurrence of a void by forming a plating film of a more uniform film thickness over the entire surface of a surface to be plated of a substrate even if the substrate has higher sheet resistance. SOLUTION: The plating equipment has a substrate holder 36, a cathode section 38 provided with a sealing material 90 for water-tightly sealing the peripheral edge of a substrate W held by the substrate holder 36 by abutting on the peripheral edge thereof and a cathode electrode 88 for energizing the substrate by coming into contact with the substrate, an anode 98 arranged in the position facing the substrate W, a plating solution impregnant 10 consisting of a water retaining material arranged between the anode 98 and the substrate W and a driving mechanism for relatively driving the plating solution impregnant 10 and the substrate W. The equipment is so constituted as to provide the anode 98 with a potential gradient. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了通过在待镀表面的整个表面上形成更均匀膜厚的镀膜，可以将电镀金属确实地嵌入到微凹部中，而不会发生空隙基板，即使基板具有较高的薄层电阻。解决方案：电镀设备具有衬底保持件36，阴极部分38，阴极部分38设置有密封材料90，用于通过邻接衬底保持器36的周缘水平地密封由衬底保持器36保持的衬底W的周边边缘，用于通过与基板接触而使基板通电的阴极88，布置在面向基板W的位置的阳极98，由布置在阳极98和基板W之间的保水材料构成的电镀液浸渍剂10和用于相对驱动电镀溶液浸渍剂10和基底W的驱动机构。该设备被构造成为阳极98提供潜在的梯度。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2004346376A Equipment for supplying and recovering electrolyte and apparatus for replenishing liquid component 审中-公开
公开(公告)号：JP2004346376A
公开(公告)日：2004-12-09
申请号：JP2003145017
申请日：2003-05-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MISHIMA KOJI , SUZUKI HIDENAO , NOMURA KAZUFUMI , IDE KUNIHITO , KATSUOKA SEIJI , MUKOYAMA YOSHITAKA , MIYAZAKI MITSURU , KANEHARA MASAAKI
IPC分类号： C25D17/00 , C25B15/00 , C25D13/22 , C25D21/14
CPC分类号： C25D21/14
摘要： PROBLEM TO BE SOLVED: To efficiently supply and recover an electrolyte while realizing cost reduction by improving the production efficiency in response to an increased output.
SOLUTION: Equipment 40 for supplying and recovering the electrolyte supplies the electrolyte to an electrolytic treatment device 12 and recovers the electrolyte from the device 12. The equipment is equipped with a new liquid-supplying part 42 and a drainage-recovering part 44. The new-liquid-supplying part 42 pools a new electrolyte, which has been stored inside a carry-in vessel 32 carried in from outside and transferred from the carry-in vessel 32, and supplies it to the electrolytic treatment device 12. The drainage-recovery part 44 pools the electrolyte recovered from the electrolytic treatment device 12 and transfers it to a carry-out vessel 34 which is subsequently carried out.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2004250785A Electrolytic treatment apparatus and substrate treatment apparatus 审中-公开
公开(公告)号：JP2004250785A
公开(公告)日：2004-09-09
申请号：JP2004016318
申请日：2004-01-23
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SUZUKI HIDENAO , NOMURA KAZUFUMI , IDE KUNIHITO , KANDA HIROYUKI , MISHIMA KOJI , MIHARA NAOTERU , MAKINO NATSUKI , KATSUOKA SEIJI
IPC分类号： C25D5/08 , C25D7/12 , C25D21/04 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To make the intra-surface uniformity of the film thickness of a plating film with, for example, an electrolytic plating equipment by making it possible to make the electric field over the entire surface of a surface to be treated of a substrate more uniform even in the case of the substrate of particularly a large area and to more uniformly control the flow velocity over the entire surface of the surface to be treated of the substrate of a plating liquid flowing along the surface to be treated of the substrate. SOLUTION: The electrolytic treatment apparatus has a substrate holding section 36 which holds the substrate, a first electrode 88 which energies the surface to be treated of the substrate by coming into contact with the substrate, a second electrode 98 which is arranged nearly parallel to the surface to be treated in the position facing the surface to be treated of the substrate held by the section 36, a high-resistance structure 110 which is arranged between the substrate W held by the section 36 and the second electrode 98, an electrolyte injection section 104 which injects the electrolyte from the lateral of the structure 110 within a region where the substrate W held by the section 36 and the structure 110 face each other, and a power source 114 which impresses a voltage between the first electrode 88 and the second electrode 98. COPYRIGHT: (C)2004,JPO&NCIPI

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