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1. 发明专利

JP2004035926A Plating apparatus and plating method 有权
公开(公告)号：JP2004035926A
公开(公告)日：2004-02-05
申请号：JP2002192535
申请日：2002-07-01
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： MISHIMA KOJI , IDE KUNIHITO , CHIKAMORI YUSUKE , NOMURA KAZUFUMI , KATSUOKA SEIJI , KUNISAWA JUNJI , MUKOYAMA YOSHITAKA , MAKINO NATSUKI , MATSUDA TETSURO , KANEKO HISAFUMI
IPC分类号： C25D7/12 , C25D5/08 , C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus which does not require to monitor a liquid composition and accessory equipment therefor, and reduces the cost, and to provide a plating method.
SOLUTION: The electrolytic plating apparatus 10 has a substrate treatment region 20 for contacting the surface to be plated of a substrate with a plating solution, and plating it therein. The substrate treatment region 20 is provided with an inflow part 100 for receiving a plating liquid to be used for plating therethrough, and an outflow part 120 for draining the plating liquid used for the plating process therethrough. The apparatus has such a structure as not to return the plating liquid drained from the outflow part 100 to the substrate treatment region 20. Then, the apparatus does not require to monitor the liquid composition, because of having such a structure so as not to use a plating liquid once used at all.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2007138304A Plating apparatus and method 有权
标题翻译：电镀设备和方法
公开(公告)号：JP2007138304A
公开(公告)日：2007-06-07
申请号：JP2007025747
申请日：2007-02-05
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YOSHIOKA JUNICHIRO , SAITO NOBUTOSHI , MUKOYAMA YOSHITAKA , TOKUOKA TAKESHI
IPC分类号： C25D19/00 , C25D5/02 , C25D7/12 , C25D17/00 , C25D17/06 , C25D17/08 , C25D17/12 , C25D21/04 , C25D21/10 , C25D21/14 , H01L21/288 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus which employs the dipping method in which air bubbles can escape relatively easily, and is capable of automatically forming a plated metal film suitable for protruding electrodes such as bumps, and which does not occupy a large space. SOLUTION: The plating apparatus for forming protruding electrodes on a substrate having wiring formed thereon comprises a cassette table 12 for loading a substrate cassette, a pre-wetting tank 26 for applying a pre-wetting treatment to the substrate to increase wettability thereof, a plating tank 34 for plating the substrate applied with the pre-wetting treatment in the pre-wetting tank, a cleaning unit 30b for cleaning the plated substrate, a drying unit 32 for drying the cleaned substrate, a plating liquid regulating unit for analyzing the components of a plating liquid and adding components to the plating liquid based on the results of the analysis, and a substrate transferring device 40 for transferring the substrate. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种使用气泡可以相对容易地逸出的浸渍方法的电镀装置，并且能够自动形成适合于诸如凸块的突出电极的电镀金属膜，并且不占用一个很大的空间。解决方案：用于在其上形成有布线的基板上形成突起电极的电镀装置包括用于装载基板盒的盒台12，用于对基板进行预润湿处理以增加其润湿性的预湿槽26 用于对在预润湿槽中进行预润湿处理的基板进行电镀的电镀槽34，清洗电镀基板的清洗部30b，干燥被清洗基板的干燥部32，分析用电解液电镀液的成分，并根据分析结果向电镀液中添加成分，以及用于转印基板的基板转印装置40。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2015018894A めっき装置审中-公开
标题翻译：电镀设备
公开(公告)号：JP2015018894A
公开(公告)日：2015-01-29
申请号：JP2013144239
申请日：2013-07-10
申请人：株式会社荏原製作所 , Ebara Corp
发明人： NAKAGAWA YOICHI , MUKOYAMA YOSHITAKA , YAMAKAWA SUMIYASU
IPC分类号： H01L21/677 , C23C18/31
摘要：【課題】めっき装置のスループットを保ちながら、作業員がめっき装置の構成要素に容易にアクセスすることができ、めっき装置のメンテナンスを容易に行うことを可能とするめっき装置を提供する。【解決手段】めっき装置は、基板Wを保持する基板ホルダ42と、並列に配置された複数のめっき処理部31とを備え、複数のめっき処理部31は、それぞれ、基板Wのめっきに使用される複数の処理槽29と、複数の処理槽29間で基板Wを保持した基板ホルダ42を搬送する基板ホルダ搬送機30とを備えており、複数のめっき処理部31の間にはメンテナンススペース100が設けられている。【選択図】図1
摘要翻译：要解决的问题：提供一种电镀装置，其能够使工人能够在保持电镀装置的生产量的同时保持电镀装置的构成要素，并且还能够容易地维护电镀装置。电镀装置包括：基板保持基板W的支架42; 以及彼此平行配置的多个板处理部31。多个板处理部31中的每一个包括：用于电镀基板W的多个处理槽29; 以及在多个处理槽29之间传送保持基板W的基板保持件42的基板保持器转印装置30.在多个板处理部31之间设置有维护空间100。

4. 发明专利

JP2005008911A Stirring method of plating solution and plating apparatus 有权
标题翻译：涂层溶液和镀层装置的搅拌方法
公开(公告)号：JP2005008911A
公开(公告)日：2005-01-13
申请号：JP2003171177
申请日：2003-06-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKEMURA TAKASHI , MUKOYAMA YOSHITAKA , KIMURA MASAAKI , SAITO NOBUTOSHI , KURIYAMA FUMIO
IPC分类号： C25D5/08 , C25D7/12 , C25D21/10
摘要： PROBLEM TO BE SOLVED: To provide a stirring method of a plating solution whereby a plating solution or a chemical solution is effectively stirred, even without increasing reciprocation speed of a paddle, the ruffle or scatter of the plating solution or the drug solution is inhibited and the treatment speed can be increased, and a plating apparatus.
SOLUTION: The paddle 34 which reciprocates parallel with a surface W1 to be plated of a substrate W and stirs the plating solution 12 is installed. A fin 41 made of an elastic body which bends along with the reciprocation of the paddle 34 is attached to the paddle 34. The flow of the plating solution 12 along the bent fin 41 enables the plating solution 12 to smoothly flow toward the surface W1 to be plated and vigorously stirs the plating solution 12 near the surface W1 to be plated. The flow of the plating solution 12 loses its direction at the entire surface W1 to be plated, and a plating film with a uniform thickness can be formed on the entire surface W1 to be plated.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供电镀液的搅拌方法，由此即使不增加桨的往复运动速度，电镀液或化学溶液也被有效地搅拌，镀液或药液的褶皱或散射并且可以提高处理速度，以及电镀装置。
解决方案：安装与待镀覆基板W的表面W1平行移动并搅拌电镀液12的桨板34。由桨形体34的往复运动而与弹性体一起弯曲的翅片41被安装在桨叶34上。电镀液12沿着弯曲翼片41的流动使得电镀液12顺利地流向表面W1〜电镀并剧烈搅拌电镀液12附近的待镀层表面W1。电镀液12的流动在整个待镀层的表面W1上失去其方向，并且可以在要镀覆的整个表面W1上形成具有均匀厚度的镀膜。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004346345A Tool for measuring clearance between substrate and anode head, method for regulating clearance, and plating device 审中-公开
公开(公告)号：JP2004346345A
公开(公告)日：2004-12-09
申请号：JP2003141978
申请日：2003-05-20
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KATSUOKA SEIJI , MUKOYAMA YOSHITAKA , MIYAZAKI MITSURU
IPC分类号： C25D7/12 , C25D13/22
摘要： PROBLEM TO BE SOLVED: To provide a clearance measuring tool which measures the clearance between an anode head and a substrate easily and quantitatively, to provide a clearance regulating method, and to provide a plating device.
SOLUTION: The plating device is provided with: a substrate holding part 36 for fixing the circumferential part of a substrate whose face to be plated is turned upward; a sealing member 90 for sealing the circumferential part of the face to be plated in the substrate in a watertight way; and an anode head 28 arranged above the face to be plated in the substrate so as to be confronted with the face to be plated in the substrate. A plating liquid is injected into the space between the face to be plated in the substrate fixed to the substrate holding part 36 and the anode head 28, so that the face to be plated is plated. A measuring tool 200 is freely attachably and detachably mounted on the substrate holding part 36 instead of the substrate, and the clearance from the probe 250 to the lower face of the anode head 28 (the lower face of a plating liquid-impregnated material 110) is measured with the probe 250 fitted to the measuring tool 200.
COPYRIGHT: (C)2005,JPO&NCIPI

6. 发明专利

JP2009270167A Plating apparatus and plating method 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：JP2009270167A
公开(公告)日：2009-11-19
申请号：JP2008122527
申请日：2008-05-08
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KAWASHIMA KIYOTAKA , MUKOYAMA YOSHITAKA , HORIE TAKUO
IPC分类号： C25D21/12 , C23C18/31 , C25D19/00
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus which can form a metal film with a uniform film thickness by a series of operations on the surface of a substrate such as a rectangular flat-shaped glass substrate having a large surface area while preventing the substrate from being damaged, can be placed in a narrow space and shows high throughput, and to provide a plating method. SOLUTION: The plating apparatus has a substrate-transporting unit 14c which transports the substrate W in a horizontal state of directing its face to be plated upward, and a plating unit 26a which is arranged adjacent to the substrate-transporting unit 14c. The plating unit 26a includes: a plating tank 40 for storing a plating solution Q therein; a vertically-movable holding base 42 which is arranged above the plating tank 40, holds the substrate W horizontally in a state of directing its face to be plated upward, and is immersed in the plating solution Q in the plating tank 40 together with the substrate W; a substrate transfer mechanism 50 which receives the substrate W from the substrate-transporting unit 14c and transfers the substrate to the predetermined location on the holding base 42; and fluid-film forming parts 42b and 64 which supply the fluid onto the surface of the holding base 42 when transferring the substrate and form the fluid film thereon. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种能够通过一系列操作形成具有均匀膜厚度的金属膜的电镀装置，所述电镀装置在诸如具有大表面积的矩形平板玻璃基板的表面上的表面上，同时防止基板受损，可以放置在狭窄的空间中，并且显示出高通量，并提供电镀方法。解决方案：电镀装置具有基板输送单元14c，该基板输送单元14c将水平状态的基板W输送到要镀覆的面上方，以及布置在基板输送单元14c附近的电镀单元26a。电镀单元26a包括：用于在其中存储电镀液Q的电镀槽40; 布置在镀槽40上方的可垂直移动的保持基座42将基板W水平地保持在其面向上方的状态下，并与基板一起浸入电镀槽40中的电镀液Q中 W; 从衬底传送单元14c接收衬底W并将衬底传送到保持基座42上的预定位置的衬底传送机构50; 流体膜形成部42b，64，在转印基板时，将流体供给到保持基体42的表面，并在其上形成流体膜。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2008115457A Plating device and plating method 审中-公开
标题翻译：镀层装置和镀层方法
公开(公告)号：JP2008115457A
公开(公告)日：2008-05-22
申请号：JP2007167171
申请日：2007-06-26
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KAWASHIMA KIYOTAKA , MUKOYAMA YOSHITAKA , KATSUOKA SEIJI , HONBO MITSUAKI , NAGAI MIZUKI
IPC分类号： C23C18/31 , C23C18/18
摘要： PROBLEM TO BE SOLVED: To form a metal film with a uniform film thickness on the surface of a glass substrate with rectangular, planar shape having a wide surface area by a series of operations. SOLUTION: The plating device comprises: a substrate holder 16 for holding a glass substrate carried into a load stage 14, while held between the edge faces of the glass substrate; a transporter 58 for carrying the substrate holder 16 holding the glass substrate while it is held; a plating tank 32 where the glass substrate is dipped into a plating liquid while held by the substrate holder 16, and the surface of the glass substrate is plated; post-cleaning tanks 34, 38 where the surface of the glass substrate after the plating held by the substrate holder 16 is cleaned while being held by the substrate holder; and a drying stage 54 where the glass substrate after the cleaning is taken out from the substrate holder 16 and is dried while being run to one direction, and the glass substrate after the drying is delivered to an unload stage 56. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过一系列操作在具有宽表面积的矩形平面形状的玻璃基板的表面上形成具有均匀膜厚度的金属膜。电镀装置包括：基板保持件16，用于将保持在玻璃基板的边缘面之间的玻璃基板保持在载置台14中; 用于在保持玻璃基板的同时承载保持玻璃基板的基板保持件16的运送器58; 电镀槽32，其中玻璃基板在由基板保持件16保持的同时浸入电镀液中，并且玻璃基板的表面被镀覆; 后清洗槽34,38，其中由衬底保持器16保持的镀覆后的玻璃基板的表面在被基板保持器保持的同时被清洁; 以及干燥台54，其中清洁后的玻璃基板从基板保持件16取出并沿一个方向进行干燥，干燥后的玻璃基板被输送到卸载台56.版权所有：（C）2008，JPO＆INPIT

8. 发明专利

JP2007169792A Plating fixture for semiconductor wafer, apparatus for mounting fixture and apparatus for plating semiconductor wafer 有权
标题翻译：半导体晶片用绝缘材料，半导体晶体管安装装置及装置
公开(公告)号：JP2007169792A
公开(公告)日：2007-07-05
申请号：JP2007025540
申请日：2007-02-05
申请人： Ebara Corp , 株式会社荏原製作所
发明人： YOSHIOKA JUNICHIRO , MUKOYAMA YOSHITAKA
IPC分类号： C25D17/06 , C25D7/12 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide a plating fixture for a semiconductor wafer, which enables easy clamping of a seal packing and is capable of applying a uniform clamping force to the periphery of the seal packing.
SOLUTION: The plating fixture 110 for the semiconductor wafer is equipped with a first holding member 111, a second holding member 112 and a fixing ring 114 having a locking part 114b. The semiconductor wafer 116 can be removably held between the first and second holding members 111 and 112. A locked part 120 that can be removably latched together with the locking part 114b on the fixing ring 114 is formed on either the first or the second holding member 111 or 112. When the fixing ring 114 is at a fixing position, the locked part 120 is removably latched together with the locking part 114b on the fixing ring 114 to fix the first and second holding members 111 and 112.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于半导体晶片的电镀夹具，其能够容易地夹紧密封垫圈并且能够对密封垫圈的周边施加均匀的夹紧力。解决方案：用于半导体晶片的电镀夹具110配备有第一保持构件111，第二保持构件112和具有锁定部114b的固定环114。半导体晶片116可以可拆卸地保持在第一和第二保持构件111和112之间。可以在固定环114上可拆卸地与锁定部分114b锁定的锁定部分120形成在第一或第二保持构件当固定环114处于固定位置时，锁定部分120与固定环114上的锁定部分114b可拆卸地锁定，以固定第一和第二保持部件111和112。版权所有：（C）2007，JPO＆INPIT

9. 发明专利

JP2004346376A Equipment for supplying and recovering electrolyte and apparatus for replenishing liquid component 审中-公开
公开(公告)号：JP2004346376A
公开(公告)日：2004-12-09
申请号：JP2003145017
申请日：2003-05-22
申请人： Ebara Corp , 株式会社荏原製作所
发明人： MISHIMA KOJI , SUZUKI HIDENAO , NOMURA KAZUFUMI , IDE KUNIHITO , KATSUOKA SEIJI , MUKOYAMA YOSHITAKA , MIYAZAKI MITSURU , KANEHARA MASAAKI
IPC分类号： C25D17/00 , C25B15/00 , C25D13/22 , C25D21/14
CPC分类号： C25D21/14
摘要： PROBLEM TO BE SOLVED: To efficiently supply and recover an electrolyte while realizing cost reduction by improving the production efficiency in response to an increased output.
SOLUTION: Equipment 40 for supplying and recovering the electrolyte supplies the electrolyte to an electrolytic treatment device 12 and recovers the electrolyte from the device 12. The equipment is equipped with a new liquid-supplying part 42 and a drainage-recovering part 44. The new-liquid-supplying part 42 pools a new electrolyte, which has been stored inside a carry-in vessel 32 carried in from outside and transferred from the carry-in vessel 32, and supplies it to the electrolytic treatment device 12. The drainage-recovery part 44 pools the electrolyte recovered from the electrolytic treatment device 12 and transfers it to a carry-out vessel 34 which is subsequently carried out.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JPH11209898A PLATING ANODE 失效
公开(公告)号：JPH11209898A
公开(公告)日：1999-08-03
申请号：JP2639798
申请日：1998-01-23
申请人： EBARA CORP
发明人： YOSHIOKA JUNICHIRO , INOUE HIROAKI , MUKOYAMA YOSHITAKA
IPC分类号： C25D17/12 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a plating anode by which a normal electric field is formed at all times even if the anode is dissolved, and the frequency of regulating and replacing an electroplating soln. is decreased. SOLUTION: An object to be plated and an anode 30 opposed to the object at a specified distance from the object are dipped in an electroplating soln. A current is applied between the object and anode 30 to plate the object surface. The anode 30 is composed of the sheet-shaped soluble anode 31 and insoluble anode 33 placed on each other, and the exposed face of the soluble anode 31 is opposed to the object.

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