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    • 2. 发明申请
    • Content-addressable memory having phase change material devices
    • 具有相变材料装置的内容寻址存储器
    • US20070097740A1
    • 2007-05-03
    • US11267781
    • 2005-11-03
    • Narbeh DerhacobianColin Murphy
    • Narbeh DerhacobianColin Murphy
    • G11C11/00
    • G11C11/5678G11C13/0004G11C15/046
    • Content-addressable memory (CAM) cells comprised of phase change material devices (PCMDs), including PCMD-based binary CAM cells (PCMD-based BCAM cells), PCMD-based ternary CAM cells (PCMD-based TCAM cells), and PCMD-based universal CAM cells (PCMD-based UCAM cells). The PCMDs of the various PCMD-based CAM cells are configured and programmed in a manner that allows a logic “0” or a logic “1” to be stored by the CAM cell. The logic value stored by a given PCMD-based CAM cell depends on the program states of the PCMDs. A program state of a PCMD is determined by whether the phase change material of the PCMD has been allowed to solidify to a crystalline, low-resistance state during a programming operation, or whether the phase change material of the PCMD is forced to solidify to an amorphous, high-resistance state during the programming operation.
    • 由包括基于PCMD的二进制CAM单元(基于PCMD的BCAM单元),基于PCMD的三元CAM单元(基于PCMD的TCAM单元)和PCMD-based三元CAM单元组成的包括相变材料装置(PCMD)的内容寻址存储器(CAM) 基于通用的CAM单元(基于PCMD的UCAM单元)。 各种基于PCMD的CAM单元的PCMD以允许CAM单元存储逻辑“0”或逻辑“1”的方式进行配置和编程。 由给定基于PCMD的CAM单元存储的逻辑值取决于PCMD的程序状态。 PCMD的编程状态由PCMD的相变材料是否已被允许在编程操作期间凝固成晶体,低电阻状态,或PCMD的相变材料是否被迫固化为 非线性,高电阻状态。
    • 3. 发明授权
    • Circuits having programmable impedance elements
    • 具有可编程阻抗元件的电路
    • US08687403B1
    • 2014-04-01
    • US13157713
    • 2011-06-10
    • Narbeh DerhacobianShane Charles HollmerIshai Naveh
    • Narbeh DerhacobianShane Charles HollmerIshai Naveh
    • G11C11/00
    • H01L45/085G11C11/005G11C13/0007G11C13/0011G11C14/0045G11C14/009
    • An integrated circuit (IC) device may include a first portion having a plurality of volatile memory cells; and a second portion coupled by a data transfer path to the first portion, the second portion including a plurality of nonvolatile memory cells, each nonvolatile memory cell including at least one resistive element programmable more than once between different resistance values. A memory device may also include variable impedance elements accessible by access bipolar junction transistors (BJTs) having at least a portion formed by a semiconductor layer formed over a substrate. A memory device may also include a plurality of memory elements that each includes a dielectric layer formed between a first and second electrode, the dielectric layer including a solid electrolyte with a soluble metal having a mobility less than that of silver in a germanium disulfide.
    • 集成电路(IC)装置可以包括具有多个易失性存储器单元的第一部分; 以及第二部分,其通过数据传输路径耦合到所述第一部分,所述第二部分包括多个非易失性存储器单元,每个非易失性存储单元包括在不同电阻值之间不止一次可编程的至少一个电阻元件。 存储器件还可以包括可由存取双极结型晶体管(BJT)访问的可变阻抗元件,其中至少一部分由形成在衬底上的半导体层形成。 存储器件还可以包括多个存储器元件,每个存储器元件包括形成在第一和第二电极之间的电介质层,该电介质层包括具有小于二硫化锗中银的迁移率的可溶性金属的固体电解质。
    • 4. 发明授权
    • Charge injection
    • 电荷注入
    • US06567303B1
    • 2003-05-20
    • US10050483
    • 2002-01-16
    • Darlene G. HamiltonJanet S. Y. WangNarbeh DerhacobianTim ThurgateMichael K. Han
    • Darlene G. HamiltonJanet S. Y. WangNarbeh DerhacobianTim ThurgateMichael K. Han
    • G11C1604
    • G11C16/3409G11C11/5671G11C16/0475G11C16/10G11C16/3404G11C16/3436G11C16/3445
    • A system and methodology is provided for programming first and second bits of a memory array of dual bit memory cells at a substantially high delta VT. The substantially higher VT assures that the memory array will maintain programmed data and erase data consistently after higher temperature stresses and/or customer operation over substantial periods of time. At a substantially higher delta VT, programming of the first bit of the memory cell causes the second bit to program harder and faster due to the shorter channel length. Therefore, the present invention employs selected gate and drain voltages and programming pulse widths during programming of the first and second bit that assures a controlled first bit VT and slows down programming of the second bit. Furthermore, the selected programming parameters keep the programming times short without degrading charge loss.
    • 提供了一种用于以基本上高的delta VT对双位存储器单元的存储器阵列的第一和第二位进行编程的系统和方法。 基本上更高的VT确保存储器阵列将维持编程数据并且在相当长的一段时间内在较高的温度应力和/或客户操作之后一致地擦除数据。 在基本上较高的增量VT下,存储器单元的第一位的编程使得第二位由于较短的通道长度而更硬更快地编程。 因此,本发明在第一和第二位的编程期间采用选择的栅极和漏极电压以及编程脉冲宽度,以确保受控的第一位VT并减慢第二位的编程。 此外,所选择的编程参数保持编程时间短而不降低电荷损耗。
    • 5. 发明授权
    • Using a negative gate erase voltage applied in steps of decreasing amounts to reduce erase time for a non-volatile memory cell with an oxide-nitride-oxide (ONO) structure
    • 使用以减少量的步骤施加的负栅极擦除电压以减少具有氧化物 - 氧化物 - 氧化物(ONO)结构的非易失性存储单元的擦除时间
    • US06549466B1
    • 2003-04-15
    • US09657143
    • 2000-09-07
    • Narbeh DerhacobianMichael Van BuskirkChi ChangDaniel Sobek
    • Narbeh DerhacobianMichael Van BuskirkChi ChangDaniel Sobek
    • G11C1604
    • G11C16/14
    • An erase operation is performed on a non-volatile memory cell with an oxide-nitride-oxide structure by using a negative gate erase voltage during an erase procedure to improve the speed and performance of the non-volatile memory cell after many program-erase cycles. During the erase procedure, an erase cycle is applied followed by a read cycle until the cell has a threshold erased below a desired value. For the initial erase cycle in the procedure, an initial negative gate voltage is applied. In subsequent erase cycles, a sequentially decreasing negative gate voltage is applied until the threshold is reduced below the desired value. In one embodiment, after erase is complete, the last negative gate voltage value applied is stored in a separate memory. After a subsequent programming when the erase procedure is again applied, the initial negative gate voltage applied is the negative gate voltage value for the cell stored in memory.
    • 在擦除过程中通过使用负栅极擦除电压在具有氧化物 - 氮化物 - 氧化物结构的非易失性存储单元上执行擦除操作,以在许多编程擦除周期之后提高非易失性存储单元的速度和性能 。 在擦除过程期间,应用擦除周期,随后读取周期,直到单元具有低于期望值的阈值。 对于程序中的初始擦除周期,施加初始负栅极电压。 在随后的擦除周期中,施加顺序减小的负栅极电压,直到阈值降低到期望值以下。 在一个实施例中,在擦除完成之后,施加的最后一个负栅极电压值被存储在单独的存储器中。 在再次施加擦除过程之后的后续编程之后,施加的初始负栅极电压是存储在存储器中的单元的负栅极电压值。