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    • 2. 发明授权
    • Using a negative gate erase voltage applied in steps of decreasing amounts to reduce erase time for a non-volatile memory cell with an oxide-nitride-oxide (ONO) structure
    • 使用以减少量的步骤施加的负栅极擦除电压以减少具有氧化物 - 氧化物 - 氧化物(ONO)结构的非易失性存储单元的擦除时间
    • US06549466B1
    • 2003-04-15
    • US09657143
    • 2000-09-07
    • Narbeh DerhacobianMichael Van BuskirkChi ChangDaniel Sobek
    • Narbeh DerhacobianMichael Van BuskirkChi ChangDaniel Sobek
    • G11C1604
    • G11C16/14
    • An erase operation is performed on a non-volatile memory cell with an oxide-nitride-oxide structure by using a negative gate erase voltage during an erase procedure to improve the speed and performance of the non-volatile memory cell after many program-erase cycles. During the erase procedure, an erase cycle is applied followed by a read cycle until the cell has a threshold erased below a desired value. For the initial erase cycle in the procedure, an initial negative gate voltage is applied. In subsequent erase cycles, a sequentially decreasing negative gate voltage is applied until the threshold is reduced below the desired value. In one embodiment, after erase is complete, the last negative gate voltage value applied is stored in a separate memory. After a subsequent programming when the erase procedure is again applied, the initial negative gate voltage applied is the negative gate voltage value for the cell stored in memory.
    • 在擦除过程中通过使用负栅极擦除电压在具有氧化物 - 氮化物 - 氧化物结构的非易失性存储单元上执行擦除操作,以在许多编程擦除周期之后提高非易失性存储单元的速度和性能 。 在擦除过程期间,应用擦除周期,随后读取周期,直到单元具有低于期望值的阈值。 对于程序中的初始擦除周期,施加初始负栅极电压。 在随后的擦除周期中,施加顺序减小的负栅极电压,直到阈值降低到期望值以下。 在一个实施例中,在擦除完成之后,施加的最后一个负栅极电压值被存储在单独的存储器中。 在再次施加擦除过程之后的后续编程之后,施加的初始负栅极电压是存储在存储器中的单元的负栅极电压值。
    • 9. 发明授权
    • Nonvolatile memory cell with a nitridated oxide layer
    • 具有氮化氧化物层的非挥发性存储单元
    • US06750157B1
    • 2004-06-15
    • US10199793
    • 2002-07-19
    • Richard M. FastowChi ChangNarbeh Derhacobian
    • Richard M. FastowChi ChangNarbeh Derhacobian
    • H01L2131
    • H01L21/28185H01L21/28202H01L21/28282H01L21/3144H01L27/115H01L27/11568H01L29/513H01L29/518
    • One aspect of the present invention relates to a system and method for improving memory retention in flash memory devices. Retention characteristics may be enhanced by nitridating the bottom silicon dioxide layer of the ONO dielectric. To further mitigate charge leakage within the memory cell, the charge retention layer, or silicon nitride layer of the ONO dielectric, may be passivated via a hydrogen anneal process in order to reduce the number of charge traps, and thus, the amount of charge loss. The present invention also provides a monitoring and feedback-relay system to automatically control ONO formation such that a desired ONO dielectric stack is obtained. The present invention may be accomplished in part by employing a measurement system to measure properties and characteristics of the ONO stack during the critical formation steps of the bottom silicon dioxide layer and a silicon nitride layer.
    • 本发明的一个方面涉及用于改善闪存设备中的存储器保持的系统和方法。 可以通过对ONO电介质的底部二氧化硅层进行氮化来增强保留特性。 为了进一步减轻存储单元内的电荷泄漏,ONO电介质的电荷保持层或氮化硅层可以通过氢退火工艺被钝化,以减少电荷陷阱的数量,从而减少电荷损失量 。 本发明还提供了一种监测和反馈中继系统,用于自动控制ONO形成,从而获得所需的ONO电介质叠层。 本发明可以部分地通过使用测量系统在底部二氧化硅层和氮化硅层的临界形成步骤期间测量ONO堆叠的性质和特性来实现。