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    • 4. 发明申请
    • METHOD AND DEVICE FOR THERMALLY TREATING OBJECTS
    • 用于物体热处理的方法和装置
    • WO02003160A1
    • 2002-01-10
    • PCT/EP2001/007435
    • 2001-06-29
    • H01L21/26G05D23/19G05D23/27
    • G05D23/1904G05D23/1917
    • The invention relates to a method and to a device for thermally treating objects. The aim of the invention is to facilitate a better control of the temperature profile of an object to be thermally treated. To this end, the invention provides a method and a device for thermally treating an object in a heating system, especially for treating semiconductor wafers (2) in a rapid heating system (1). The objects are thermally treated at a predetermined temperature progression and the temperature of the object is controlled via a PID control and a feedforward control that are based on a simulation model of the heating system and the object. Said model consists of individual models of components of the heating system and/or the object. The parameters of at least one of the individual models are monitored during the thermal treatment and the model is adapted to the monitored parameters.
    • 为了能够更好地调节热处理中要处理的物体的温度分布,本发明提供了一种用于热处理加热系统中的物体,特别是快速加热系统(1)中的半导体晶片(2)的设备和方法, 其中所述物体用预定温度分布进行热处理,并且所述物体的温度由基于加热器 - 物体模拟模型的PID控制和前馈控制来控制,所述模型由加热器组件的单独模型和/或 监测热处理期间对象和至少一个单独模型的参数,并将模型与监测参数相匹配。
    • 5. 发明申请
    • SENSOR MODULE WITH INTEGRATED SIGNAL PROCESSING
    • 带集成信号处理传感器模块
    • WO00050862A1
    • 2000-08-31
    • PCT/EP1999/001170
    • 1999-02-23
    • G01J5/04G05D23/27H05B6/68H05B6/80
    • H05B6/6447G01J5/02G01J5/0215G01J5/04G01J5/045G01J5/08G01J5/0815G01J2005/068G05D23/27
    • The invention relates to a sensor module with a radiation-sensitive sensor element (12), a sensor signal processing circuit (13, 41a, 44a) which receives the output signal of the sensor element (12) and converts it to a radiation-dependent first electric signal, a temperature-sensitive reference unit (14, 15, 41b, 43, 44b) which produces a temperature-dependent second electric signal, and a signal linking unit (16) for linking the two electric signals. The sensor signal processing circuit (13, 41a, 44a), the reference unit (14, 15, 41b, 43, 44b) and the linking unit (16) are configured on a single chip (20, 21). Said chip (20, 21) and the sensor element (12) are accommodated in a common housing (22, 62, 64).
    • 传感器模块具有一个辐射敏感的传感器元件(12),传感器信号调理电路(13,41A,44A),其接收所述传感器元件(12)的输出信号并把它提供一个依赖辐射第一电信号,一个温度敏感参考装置(14,15,41B,43, 44B),它提供依赖于温度的第二电信号,以及用于组合所述两个电信号的信号组合装置(16)。 传感器信号处理电路(13,41A,44A),所述参考装置(14,15,41B,43,44B)和所述连接装置(16)是形成在单个芯片(20,21)和所述芯片(20,21)和所述上 传感器元件(12)是在一个共同的壳体(22,62,64)被容纳。