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1. 发明申请

WO2022069534A1 VORRICHTUNG UND VERFAHREN ZUM BESCHICHTEN EINER OBERFLÄCHE 审中-公开
公开(公告)号：WO2022069534A1
公开(公告)日：2022-04-07
申请号：PCT/EP2021/076778
申请日：2021-09-29
申请人： HOMAG GMBH
发明人： BETTERMANN, Thomas
IPC分类号： B24B7/00 , B24B7/06 , B24B7/16 , B24B7/19 , B24B7/28 , B05D3/12 , B05D5/02 , B05D7/00 , B24B21/00 , B24B21/04 , B24B21/20
摘要： Die Erfindung betrifft eine Vorrichtung (100) und Verfahren zum Beschichten einer Oberfläche, insbesondere einer Oberfläche eines plattenförmigen Werkstücks (W). Die Vorrichtung und Verfahren können beispielsweise im Bereich der Möbel- und Bauelementeindustrie zum Einsatz kommen.

2. 发明申请

WO2007126815A3 METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBTRATE 审中-公开
标题翻译：用于抛光边缘边缘的方法和装置
公开(公告)号：WO2007126815A3
公开(公告)日：2008-08-21
申请号：PCT/US2007007568
申请日：2007-03-29
申请人： APPLIED MATERIALS INC
发明人： SHIN HO SEON , ETTINGER GARY C , OLGADO DONALD J K , WASINGER ERIK C , KO SEN-HOU , DODDS CHARLES I , CHEN YUFEI , HSU WEI-YUNG
IPC分类号： B24B1/00 , B24B7/19 , B24B41/06 , B24B51/00 , H01L21/311
CPC分类号： B24B9/065 , B24B21/002 , B24B41/067 , B24B49/16 , B24B57/02
摘要： Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate (100) against a polishing film (204) so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.
摘要翻译：提供了抛光衬底边缘的方法和系统。本发明包括将衬底（100）旋转抵靠抛光膜（204），以便从衬底的边缘去除材料; 并且检测在将衬底旋转抛光膜时施加的能量和扭矩中的一个的量。本发明还可以包括基于检测到的能量或扭矩来确定从基板的边缘去除的材料的量; 确定确定的去除材料量与预设抛光水平之间的差异; 以及基于所确定的所移除的材料量与所述预设的抛光水平之间的差来确定在旋转所述基板时施加的能量或扭矩的量，所述能量或扭矩适于实现预设的抛光水平。提供了许多其他方面。

3. 发明申请

WO2005072338A3 MULTI-STEP PAD CONDITIONINGH SYSTEM AND METHOD FOR CHEMICAL PLANARIZATION 审中-公开
标题翻译：多阶梯面调节系统及其化学方法
公开(公告)号：WO2005072338A3
公开(公告)日：2006-06-01
申请号：PCT/US2005002340
申请日：2005-01-25
申请人： TBW IND INC , BENNER STEPHEN J
发明人： BENNER STEPHEN J
IPC分类号： B24B1/00 , B08B3/14 , B08B7/00 , B24B5/00 , B24B7/00 , B24B7/19 , B24B9/00 , B24B21/18 , B24B29/00 , B24B33/00 , B24B37/04 , B24B53/007 , B24B57/02 , B24C5/00 , C03C23/00 , C23G1/02 , H01L21/302 , H01L21/321 , H01L21/46
CPC分类号： H01L21/3212 , B24B53/017 , B24B57/02
摘要： An arrangement for performing a multi-step polishing process on a single stage chemical mechanical planarization (CMP) apparatus utilizes an in-situ conditioning operation to continuously clean and evacuate debris and spent polishing slurry from the surface of the polishing pad. By presenting a clean, virtually "new" polishing pad surface at the beginning of each planarization cycle, polishing agents of different chemistries, morphologies, temperatures, etc. may be used without the need to remove the wafer to change the polishing source or transfer the wafer to another CMP polishing station. A multi-positional valve may be used to control the introduction of various process fluids, including a variety of different polishing slurries and conditioning/flushing agents. The use of different conditioning materials allows for the surface of the polishing pad to be altered for different process conditions (e.g., neutralizing prior polishing chemicals, modifying the surface temperature of the pad to control polishing rate, use of surfactants to dislodge particles that become attracted to the pad surface, etc.).
摘要翻译：用于在单级化学机械平面化（CMP）装置上进行多步抛光工艺的装置利用原位调节操作，从抛光垫的表面连续地清洁和排出碎屑和废抛光浆料。通过在每个平坦化循环开始时提供干净的，实际上“新的”抛光垫表面，可以使用不同化学，形态，温度等的抛光剂，而不需要去除晶片来改变抛光源或转移晶圆到另一个CMP抛光台。多位置阀可用于控制各种工艺流体的引入，包括各种不同的抛光浆料和调理/冲洗剂。使用不同的调理材料允许在不同的工艺条件下改变抛光垫的表面（例如，中和以前的抛光化学品，改变焊盘的表面温度以控制抛光速率，使用表面活性剂去除被吸引的颗粒到垫表面等）。

4. 发明申请

WO2017106186A1 AQUEOUS POLISHING SLURRY 审中-公开
标题翻译：水性抛光浆料
公开(公告)号：WO2017106186A1
公开(公告)日：2017-06-22
申请号：PCT/US2016/066373
申请日：2016-12-13
申请人： TURTLE WAX, INC.
发明人： SCHULTZ, Michael A.
IPC分类号： B24B7/19 , B24D3/02 , B24B1/00
CPC分类号： C09G1/02
摘要： An aqueous polishing slurry having enhanced wettability comprises a detergent blend which includes an anionic alkyl sulfate-based detergent and an alkylbenzene sulfonate detergent together with particulate polishing abrasive.
摘要翻译：具有增强润湿性的含水抛光浆料包括含有阴离子烷基硫酸盐基清净剂和烷基苯磺酸盐清净剂以及粒状抛光磨料的清净剂混合物。

5. 发明申请

WO2005031276A3 METHOD AND APPARATUS FOR MEASURING FLOW RATE THROUGH AND POLISHING A WORKPIECE ORIFICE 审中-公开
标题翻译：用于测量流量和抛光工作条件的方法和装置
公开(公告)号：WO2005031276A3
公开(公告)日：2005-06-02
申请号：PCT/US2004031113
申请日：2004-09-23
申请人： EXTRUDE HONE CORP , GREENSLET JOHN M , RHOADES LAWRENCE J
发明人： GREENSLET JOHN M , RHOADES LAWRENCE J
IPC分类号： B24B1/00 , B24B7/19 , B24B7/30 , B24B15/00 , B24B19/00 , G01F20060101 , G01F7/00
CPC分类号： B24B31/116
摘要： A method and apparatus for comparing the flow rate through an orifice within a master part with the orifice within a workpiece by subjecting each orifice to an identical fluid at an identical temperature, under an identical pressure, and comparing the downstream pressures of the fluid exiting these orifices when the upstream pressure is constant or comparing the upstream pressure when the downstream pressure is constant. For purely measurement purposes, the fluid may be a non-abrasive media, however, in the event the workpiece orifice must be machined, it is possible to introduce a flowable abrasive media, and pass this media through the orifices until the desired pressure difference is achieved. With additional flow characteristics of the master part, it is also possible to calculate the flow rate through the workpiece orifice using only the pressure differential at the exits of the workpiece and the master part.
摘要翻译：一种方法和装置，用于在相同的压力下，通过在相同的温度下对每个孔口进行相同的流体比较在主部件内的孔口与工件中的孔口之间的流速，并且比较离开这些管道的流体的下游压力当上游压力恒定时或当下游压力恒定时比较上游压力时的孔。对于纯粹的测量目的，流体可以是非研磨介质，然而，在工件孔口必须加工的情况下，可以引入可流动的研磨介质，并使该介质通过孔口，直到所需的压力差为实现。通过主部件的附加流动特性，也可以仅使用工件出口处的压差和主部件计算通过工件孔口的流量。

6. 发明申请

WO00033984A1 IMPROVED GUIDEWIRE 审中-公开
标题翻译：改进指南
公开(公告)号：WO00033984A1
公开(公告)日：2000-06-15
申请号：PCT/US1999/029329
申请日：1999-12-09
IPC分类号： A61M25/01 , B21F99/00 , B24B5/18 , B21B1/46 , B21B13/22 , B22D11/126 , B22D11/128 , B23P17/00 , B23P25/00 , B24B1/00 , B24B5/00 , B24B7/00 , B24B7/19 , B24B7/30 , B24B9/00
CPC分类号： B21F99/00 , A61M25/09 , B24B5/18
摘要： In the manufacture of a guidewire for medical applications, a mandrel (14) is formed using a wound wire having a first diameter (D1). The wound wire is straightened and cut to appropriate size. Subsequently, the wire is ground down, using center-less grinding, to one or more sections all having diameters (D2, D3) which are less than the first diameter (D1). Optionally, the mandrel (14) thus formed is coated with a hydrophilic coating, and a radiopaque marker affixed thereto.
摘要翻译：在用于医疗应用的导丝的制造中，使用具有第一直径（D1）的缠绕线形成心轴（14）。缠绕线被拉直并切割成适当的尺寸。随后，使用无中心研磨将导线接地到具有小于第一直径（D1）的直径（D2，D3）的一个或多个部分。任选地，如此形成的心轴（14）涂覆有亲水涂层，并且固定在其上的不透射线标记。

7. 发明申请

WO2022192344A1 POLISHING APPARATUS FOR SMOOTHING DIAMONDS 审中-公开
公开(公告)号：WO2022192344A1
公开(公告)日：2022-09-15
申请号：PCT/US2022/019476
申请日：2022-03-09
申请人： BOARD OF TRUSTEES OF MICHIGAN STATE UNIVERSITY , FRAUNHOFER USA
发明人： HARDY, Aaron , GROTJOHN, Timothy A. , DROWN, Edward K. , BECKER, Michael
IPC分类号： B24B41/04 , B24B7/19 , B24B19/00 , B24B23/04 , B24B37/26 , B24B53/017
摘要： A polishing apparatus (31; 301) is provided. Another aspect pertains to a self-leveling polishing apparatus for smoothing diamonds (33). Yet another aspect of the present system uses a ball and swivel joint (107; 109) in a diamond polishing machine. A further aspect employs a polishing apparatus including a diamond-holder (47), an elongated arm (45; 317) using gravity to apply downward polishing pressure of the diamond workpiece against a polishing wheel (41; 303), and a sweeping transmission (51) to cause the holder to radially move across the rotating polishing wheel.

8. 发明申请

WO2018118562A1 FOUR-STONE SEAMLESS RADIANT CUT DIAMOND AND METHOD FOR MAKING THE SAME 审中-公开
公开(公告)号：WO2018118562A1
公开(公告)日：2018-06-28
申请号：PCT/US2017/066025
申请日：2017-12-13
申请人： SHAH, Saneal
发明人： SHAH, Saneal
IPC分类号： A44C17/00 , A44C9/00 , B24B7/19 , B24B9/16 , B28D5/00
CPC分类号： A44C17/001 , B28D5/00
摘要： Presented is a diamond comprising a table, a crown, a girdle, a pavilion, and a culet. The table is rectangular, having a length and a width. The table comprises a first side, adjacent to a second side, adjacent to a third side, and adjacent to a fourth side. The first side of the table is directly connected with a first facet of the girdle. The second side of the table is directly connected with a second facet of the girdle. The crown comprises a plurality of facets connecting the third side and the fourth side of the table to the girdle. The girdle comprises five facets, the five facets comprising the first facet and the second facet, a third face, a fourth facet, and a radiant facet. The first facet, second facet, third facet, and fourth facet form three substantially 90 degree angles. The radiant facet connects the third facet and the fourth facet. The pavilion is connected to the girdle. The culet is positioned directly below a point having a 1% deviation from the center of the girdle.

9. 发明申请

WO2009113072A1 RAZOR BLADE SHARPENER AND METHOD OF SHARPENING 审中-公开
标题翻译： RAZOR BLADE SHARPENER和SHARPENING方法
公开(公告)号：WO2009113072A1
公开(公告)日：2009-09-17
申请号：PCT/IL2009/000282
申请日：2009-03-12
申请人： YADID, Menachem , ZAYDI, Sahar
发明人： YADID, Menachem , ZAYDI, Sahar
IPC分类号： B24B7/19
CPC分类号： B24D15/10
摘要： Device for sharpening razor-blades, comprising, housing having upper casing and lower casing defining an interior space, upper casing having an opening for inserting razor-blade, and lid to cover the opening, reciprocating carriage in the opening for receiving razor-blade, abrasive material coated sharpening-wheel fixedly disposed in the opening beneath the reciprocating carriage, carriage-reciprocating mechanism, sharpening-wheel rotating mechanism, power supply to operate the reciprocating and rotating mechanisms, switch to activate the device, such that when a razor-blade is inserted through the opening into the carriage and the power is turned on, sharpening-wheel rotates and carriage holding razor-blade reciprocates traversing the sharpening-wheel in one direction contacting the abrasive material and evenly sharpening one edge of the razor-blade with the abrasive material, and when the carriage reciprocates in opposite direction, the abrasive material re-contacts the razor-blade to clean of shaving residue.
摘要翻译：用于磨刀刀片的装置，包括具有限定内部空间的上壳体和下壳体的壳体，具有用于插入剃刀刀片的开口和用于覆盖开口的盖的上壳体，用于接收剃刀刀片的开口中的往复运动滑架，研磨材料涂覆的磨刀轮固定地设置在往复运动滑架下面的开口中，滑架往复机构，磨刀轮旋转机构，用于操作往复和旋转机构的电源，切换以激活装置，使得当剃刀刀片通过开口插入托架中，并且电源被接通，磨刀轮旋转并且托架保持剃刀刀片在与研磨材料接触的一个方向上往复运动的磨刀轮并且均匀地磨削剃刀刀片的一个边缘研磨材料，并且当托架沿相反方向往复运动时，研磨材料重新接触剃刀刀片t o清洁剃须残渣。

10. 发明申请

WO2007121177A3 PLANARIZATION OF SUBSTRATES AT A HIGH POLISHING RATE USING ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：使用电化学机械抛光在高抛光速率下对基板进行平面化
公开(公告)号：WO2007121177A3
公开(公告)日：2007-12-21
申请号：PCT/US2007066329
申请日：2007-04-10
申请人： APPLIED MATERIALS INC , DUBOUST ALAIN , HSU WEI-YUNG , LIU FENG Q , WANG YAN , WANG ZHIHONG , ECONOMIKOS LAERTIS
发明人： DUBOUST ALAIN , HSU WEI-YUNG , LIU FENG Q , WANG YAN , WANG ZHIHONG , ECONOMIKOS LAERTIS
IPC分类号： B24B1/00 , B24B7/19
CPC分类号： B23H5/08 , B24B37/042 , C25D11/34 , C25F1/04 , H01L21/32125
摘要： A method and apparatus for removing conductive material from a substrate surface are provided. In one embodiment, a method is provided for electrochemical mechanical polishing of a substrate. A substrate comprising dielectric feature definitions, a barrier material disposed on the feature definitions, and a bulk conductive material in an amount sufficient to fill the feature definitions is provided. The substrate is exposed to an electrolyte solution. A passivation layer is formed on the conductive material. The passivation strength of the passivation layer is increased by polishing the substrate with a first voltage for a first time period. The substrate is polished with a second voltage higher than the first voltage for a second time period. Conductive material is removed from at least a portion of the substrate surface by anodic dissolution.
摘要翻译：提供了用于从基板表面去除导电材料的方法和装置。在一个实施例中，提供了一种用于衬底的电化学机械抛光的方法。提供了包括介电特征定义的基板，设置在特征定义上的阻挡材料以及足以填充特征定义的量的体导电材料。将基底暴露于电解质溶液。在导电材料上形成钝化层。通过用第一时间段的第一电压抛光衬底来增加钝化层的钝化强度。在第二时间段内以比第一电压高的第二电压来抛光衬底。通过阳极溶解从导电材料的至少一部分去除导电材料。

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