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1. 发明申请

WO1996011083A1 LATERAL EVENING PROCESS AND DEVICE 审中-公开
标题翻译：方法和装置横向平面
公开(公告)号：WO1996011083A1
公开(公告)日：1996-04-18
申请号：PCT/EP1995004005
申请日：1995-10-11
申请人： KELLER GMBH , DERHAKE, Thomas , KONERT, Karl-Heinz , UNGRUHE, Reinhold , WIELIGMANN, Friedrich , WIESCHER, Ulrich
发明人： KELLER GMBH
IPC分类号： B24B07/22
CPC分类号： B24B9/06 , B24B7/22 , B24B47/22 , B24B49/12 , B28D1/18 , B28D7/04
摘要： A process and device are disclosed for evening one or two sides of dried green and/or baked bricks centred and conveyed through a processing machine provided with revolving evening tools (such as grinding wheels or cutters) with working surfaces substantially associated to the front face. The invention has the following characteristics: (a) the (green) bricks (Z) are continuously and automatically brought into the machining position (centring), are vertically clamped in said position between conveyor and pressing means (2, 3) and are thus conveyed through at least one evening station (4, 4'); (b) during machining (evening and/or gauging), the positions of the front face (5a) at the free end of the evening tools (5) are contactlessly monitored by an optical measurement device (6, 6') in a continuous process or at preselected wear-dependent intervals. The real position is compared to the set position and the result is converted into control pulses used to shift (adjust) the evening tool by coupling the measurement device (6/6') to the corresponding evening tool drive; (c) if required, i.e. when the face (5a) of the evening tools (5) opposite the (green) bricks (Z) to be machined deviates from the set position, the evening tools (5) are automatically shifted/adjusted to their set position without interrupting the machining (grinding or cutting) process.
摘要翻译：本发明涉及一种方法和用于由处理机器具有旋转Planierwerkzeugen调整单面或双面侧调平的装置（如砂轮或研磨工具）中，用基本上与相关联的功能性表面的前侧，输送干燥砖模制品和/或烘烤的砖块。本发明必不可少的特征是：a）所述砖（成形体）（Z）被自动放置在连续过程中在一个用于处理位置（居中需要），在该位置由高度过度夹紧输送和加压装置（2之间，固定的3）等由至少一个Planierstation（4，4“）输送，b）将自由端面的位置（傍晚工具（5）5A）（由连续的光学测量装置或在处理过程中verschleissabhänging预选时间间隔（分级和/或校准） 6，6“）监测无接触，其中，与所述一组位置和结果相比较的实际位置被转换成控制脉冲在控制技术联接相应的测量设备（6/6”）到相关联的刨位移驱动刨移（跟踪）被使用，和c）晚上工具（5）是在需求下降，即（5a）的自动设置所希望的位置，同时保持在目标位置/在其偏差跟踪的加工过程（研磨或碾磨）加工（成型产品）（Z）端面向所述砖块。

2. 发明申请

WO1995030514A1 POLISHING APPARATUS 审中-公开
标题翻译：抛光装置
公开(公告)号：WO1995030514A1
公开(公告)日：1995-11-16
申请号：PCT/US1995005594
申请日：1995-05-04
申请人： GILL, Gerald, L.
IPC分类号： B24B07/22
CPC分类号： B24B37/107 , B24B27/0023 , B24B37/345
摘要： Apparatus for polishing a side of a thin, flat wafer of a semiconductor material includes first (11) and second (31) polishing heads which each hold a wafer against a wetted polishing surface and which each rotate and oscillate its respective wafer over the polishing surface. When the first polishing head is moved away from the polishing surface to clean, eject and replace its wafer, the second polishing head occupies the space over the polishing surface normally occupied by the first polishing head so that the polishing surface is used substantially continuously, not intermittently.
摘要翻译：用于抛光半导体材料的薄的平坦晶片的侧面的设备包括第一（11）和第二（31）个抛光头，每个抛光头将晶片保持在润湿的抛光表面上，并且每个抛光头在抛光表面上旋转并振荡其相应的晶片。当第一抛光头移动离开抛光表面以清洁，排出和更换其晶片时，第二抛光头占据由第一抛光头通常占据的抛光表面上的空间，使得抛光表面基本连续地使用，而不是间歇。

3. 发明申请

WO1996011084A1 MACHINE FOR TRIMMING THE SIDES OF BUILDING BLOCKS OR THE LIKE 审中-公开
标题翻译：机侧编辑块等。
公开(公告)号：WO1996011084A1
公开(公告)日：1996-04-18
申请号：PCT/EP1995004006
申请日：1995-10-11
申请人： KELLER GMBH , DERHAKE, Thomas , KONERT, Karl-Heinz , UNGRUHE, Reinhold , WIELIGMANN, Friedrich , WIESCHER, Ulrich
发明人： KELLER GMBH
IPC分类号： B24B07/22
CPC分类号： B24B7/22 , B24B9/06 , B28D7/04
摘要： A machine is disclosed for trimming the sides of building blocks or the like, in particular dried green bricks (Z) or baked bricks (Z) that are centred, vertically clamped and thus conveyed through at least one trimming station with laterally arranged tools. The invention is characterised by a transport device with two endless belts under compression load made of flexible material and designed as conveyor and compression belts (2, 3). The conveyor and compression belts (2, 3) are forcibly guided in the lateral position by at least one groove and spring connection (7a, 8), in particular a keyway and V-rib connection, and run on a rail- or plate-shaped flat support (9) at least in the area of the trimming tools (5).
摘要翻译：本发明涉及一种机器构造块的横向机械加工等。，特别是干燥的砖坯件（Z）或烘烤砖（Z）时，调整和高度方面是通过用横向工具装置的至少一个处理台被夹紧，并且其特征在于传送装置与 2作为传输和压力带（2，3）形成的压力加载的柔性材料的环带，其中至少一个定心榫舌和凹槽（图7a，8）借助于横向位置 - 尤其键槽肋连接 - 被迫和至少在该区域 /由（5）通过轨道或板状平面邻接领先的工具（S）的处理的运行（9）。

4. 发明申请

WO1996002355A1 WAFER POLISHING METHOD AND APPARATUS 审中-公开
标题翻译：波浪抛光方法和装置
公开(公告)号：WO1996002355A1
公开(公告)日：1996-02-01
申请号：PCT/US1995001694
申请日：1995-02-08
申请人： SPEEDFAM CORPORATION
发明人： SPEEDFAM CORPORATION , KARLSRUD, Chris, E. , VAN WOERKOM, Anthony, G. , ODAGIRI, Shigeru , NAGAHASHI, Isao , PRFSTON, Spencer
IPC分类号： B24B07/22
CPC分类号： B24B37/08 , B24B37/345 , B24B49/16 , B24B51/00 , G05B19/41825 , G05B2219/37399 , G05B2219/45199 , G05B2219/45232 , G05B2219/49356 , G05B2219/49361 , G05B2219/50007 , G05B2219/50362 , G05B2219/50371 , G05B2219/50381 , G05B2219/50388 , H01L21/67745 , H01L21/67751 , H01L21/6838 , Y02P90/087
摘要： A wafer polishing apparatus (100) includes a wafer polishing assembly (132) having a plurality of wafer carriers (139-143) for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface (134). A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers (139-143) by wafer holding apparatus of an index table (117). Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers (139-143) into wafer holding apparatus of the index table (117). The wafer carriers (139-143) are individually computer (103) controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
摘要翻译：晶片抛光装置（100）包括具有多个晶片载体（139-143）的晶片抛光组件（132），用于基本上同时抛光多个晶片抵靠旋转抛光表面（134）。通过分度台（117）的晶片保持装置将待研磨的多个晶片基本上同时装载到多个晶片载体（139-143）中。类似地，多个抛光晶片从多个晶片载体（139-143）基本上同时卸载到索引台（117）的晶片保持装置中。晶片载体（139-143）是单独的计算机（103），用于精确抛光，并且可以通过不同的晶片载体同时满足不同的抛光要求。

5. 发明申请

WO1994017957A1 APPARATUS AND METHOD FOR POLISHING 审中-公开
标题翻译：装置和抛光方法
公开(公告)号：WO1994017957A1
公开(公告)日：1994-08-18
申请号：PCT/US1994001574
申请日：1994-02-08
申请人： RODEL, INC.
发明人： RODEL, INC. , JENSEN, Elmer, William
IPC分类号： B24B07/22
CPC分类号： B24B37/08 , B24B37/107 , B24B37/20
摘要： An apparatus for polishing semiconductor wafers (4) in which the polishing pads (1) are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross section along this linear dimension. In addition, the wafer holder (2) travels in a straight line parallel to the long linear dimension of the polishing pads (1).
摘要翻译：研磨抛光垫（1）为直线状的半导体晶片（4）的抛光装置，即抛光垫相对于它们的宽度具有长的线性尺寸，沿该直线尺寸具有均匀的横截面。此外，晶片保持器（2）以与抛光垫（1）的长线性尺寸平行的直线行进。

6. 发明申请

WO1987002608A1 POLISHING SYSTEM WITH UNDERWATER BERNOULLI PICKUP 审中-公开
标题翻译：抛光系统与水下BERNOULLI PICKUP
公开(公告)号：WO1987002608A1
公开(公告)日：1987-05-07
申请号：PCT/US1986001724
申请日：1986-08-25
申请人： MOTOROLA, INC.
发明人： MOTOROLA, INC. , CRONKHITE, Paul, W. , BOSLEY, Bruce, C. , JONES, James, H. , PATEL, Asit, G.
IPC分类号： B24B07/22
CPC分类号： B24B37/345
摘要： An automatic polishing system (10) for polishing semiconductor material. A robot (20) and Bernoulli pickup (30) are used to retrieve polished wafers from an underwater unload station (62) which is located on a wafer polisher (60). The polished wafer is then deposited into a cassette which is located underwater.

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