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1. 发明申请

WO1995024054A1 IMPROVED COMPOSITIONS AND METHODS FOR POLISHING 审中-公开
标题翻译：改进的组合物和抛光方法
公开(公告)号：WO1995024054A1
公开(公告)日：1995-09-08
申请号：PCT/US1995002793
申请日：1995-02-28
申请人： RODEL, INC.
发明人： RODEL, INC. , BRANCALEONI, Gregory , WANG, Jiun-Fang
IPC分类号： H01L21/306
CPC分类号： C09G1/02
摘要： A composition is provided for polishing dielectric/metal composites, semiconductors and integrated circuits which contains an iodate compound. The iodate oxidizer may be used along with a compound or compounds which suppress the removal of the dielectric silica in the composite to provide an excellent selectivity of metal versus silica removal.
摘要翻译：提供了用于抛光含有碘酸盐化合物的介电/金属复合材料，半导体和集成电路的组合物。碘酸盐氧化剂可以与抑制复合材料中电介质二氧化硅去除的化合物或化合物一起使用，以提供金属与二氧化硅去除的优异选择性。

2. 发明申请

WO1997047430A1 COMPOSITIONS AND METHODS FOR POLISHING SILICA, SILICATES, AND SILICON NITRIDE 审中-公开
标题翻译：用于抛光二氧化硅，硅酸盐和氮化硅的组合物和方法
公开(公告)号：WO1997047430A1
公开(公告)日：1997-12-18
申请号：PCT/US1997002725
申请日：1997-02-26
申请人： RODEL, INC.
发明人： RODEL, INC. , COSSABOON, David , WANG, Jiun-Fang , COOK, Lee, Melbourne
IPC分类号： B24B01/00
CPC分类号： C09G1/02
摘要： A composition is provided, which is suitable for polishing SiO2, silicates, and silicon nitride, comprising an aqueous slurry of submicron SiO2 particles and a soluble inorganic salt or combination of soluble inorganic salts of total solution concentration below the critical coagulation concentration for the slurry, wherein the slurry pH is adjusted to within the range of about 9 to 10 by addition of a soluble amine or mixture of soluble amines. Optionally, the compositions of this invention may also comprise a polyhydric alcohol.
摘要翻译：提供了一种组合物，其适用于抛光SiO 2，硅酸盐和氮化硅，其包含亚微米SiO 2颗粒的水性浆料和总溶液浓度的可溶性无机盐或可溶性无机盐的混合物低于浆料的临界凝结浓度，其中通过加入可溶性胺或可溶性胺的混合物将浆液pH调节至约9至10的范围内。任选地，本发明的组合物还可以包含多元醇。

3. 发明申请

WO1997013889A1 IMPROVED POLISHING SLURRIES AND METHODS FOR THEIR USE 审中-公开
标题翻译：改进的抛光流程及其使用方法
公开(公告)号：WO1997013889A1
公开(公告)日：1997-04-17
申请号：PCT/US1996016425
申请日：1996-10-04
申请人： RODEL, INC.
发明人： RODEL, INC. , WANG, Jiun-Fang , SETHURAMAN, Anantha , WANG, Huey-Ming , COOK, Lee, Melbourne
IPC分类号： C23F01/00
CPC分类号： C09K3/1463 , C09G1/02 , C09K3/1409 , C23F3/00
摘要： An aqueous slurry is provided for polishing or planarizing a workpiece which contains a metal, the solids portion of said slurry being comprised of about 1 to about 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from one or more of the group consisting of aluminum hydrates, aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.
摘要翻译：提供含水浆料用于抛光或平面化包含金属的工件，所述浆料的固体部分由约1-约50重量％的亚微米α-氧化铝组成，其余的固体物质基本上较少的磨料选自一种或多种由水合铝，氢氧化铝，γ-氧化铝，δ-氧化铝，无定形氧化铝和无定形二氧化硅组成的组合物。还提供了一种用于抛光含有金属的工件的表面的方法，其中所述水性浆料在化学机械抛光期间用作抛光组合物。

4. 发明申请

WO1996038262A1 COMPOSITIONS FOR POLISHING SILICON WAFERS AND METHODS 审中-公开
标题翻译：用于抛光硅波的组合物和方法
公开(公告)号：WO1996038262A1
公开(公告)日：1996-12-05
申请号：PCT/US1996007973
申请日：1996-05-30
申请人： RODEL, INC.
发明人： RODEL, INC. , LONCKI, Scott, B. , COOK, Lee, Melbourne , SHEN, James , PIERCE, Keith, G.
IPC分类号： B24B01/00
CPC分类号： B24B37/044 , Y10S977/775 , Y10S977/888
摘要： An improved slurry composition and methods of using it are provided for final polishing of silicon wafers. The composition comprises water, submicron silica particles between 0.2 and 0.5 percent by weight of this composition, a salt at a concentration of about 100 to about 1000 ppm, an amine compound at a concentration sufficient to effect a composition pH of about 8 to about 11, and a polyelectrolyte dispersion agent at a concentration of about 20 to about 500 ppm, wherein the composition has a total sodium and potassium content below about 1 ppm, and an iron, nickel, and copper content each below about 0.1 ppm, all ppm being parts per million by weight of the composition.
摘要翻译：提供改进的浆料组合物和使用它的方法用于硅晶片的最终抛光。该组合物包含水，亚微米二氧化硅颗粒占该组合物重量的0.2％至0.5％，浓度为约100至约1000ppm的盐，浓度足以使组合物pH为约8至约11的胺化合物以及浓度为约20至约500ppm的聚电解质分散剂，其中所述组合物的总钠和钾含量低于约1ppm，铁，镍和铜含量低于约0.1ppm，全部ppm为组分的重量百万分数。

5. 发明申请

WO1994017957A1 APPARATUS AND METHOD FOR POLISHING 审中-公开
标题翻译：装置和抛光方法
公开(公告)号：WO1994017957A1
公开(公告)日：1994-08-18
申请号：PCT/US1994001574
申请日：1994-02-08
申请人： RODEL, INC.
发明人： RODEL, INC. , JENSEN, Elmer, William
IPC分类号： B24B07/22
CPC分类号： B24B37/08 , B24B37/107 , B24B37/20
摘要： An apparatus for polishing semiconductor wafers (4) in which the polishing pads (1) are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross section along this linear dimension. In addition, the wafer holder (2) travels in a straight line parallel to the long linear dimension of the polishing pads (1).
摘要翻译：研磨抛光垫（1）为直线状的半导体晶片（4）的抛光装置，即抛光垫相对于它们的宽度具有长的线性尺寸，沿该直线尺寸具有均匀的横截面。此外，晶片保持器（2）以与抛光垫（1）的长线性尺寸平行的直线行进。

6. 发明申请

WO1997006921A1 POLISHING PADS 审中-公开
标题翻译：抛光垫
公开(公告)号：WO1997006921A1
公开(公告)日：1997-02-27
申请号：PCT/US1996013443
申请日：1996-08-20
申请人： RODEL, INC.
发明人： RODEL, INC. , ROBERTS, John, V., H.
IPC分类号： B24B01/00
CPC分类号： B24B37/205 , B24B37/26 , Y10T428/31
摘要： A pad is provided for use on a machine for the polishing of silicon wafers which allows the use of optical detection of the wafer surface condition as the wafer is being polished. This is accomplished by constructing the entire pad or a portion thereof out of a solid uniform polymer sheet with no intrinsic ability to absorb or transport slurry particles and which is transparent to the light beam being used to detect the wafer surface condition by optical methods. Polymers which are transparent to light having a wavelength within the range of 190 to 3500 nanometers are suitable for the construction of these pads.
摘要翻译：提供了一种在机器上用于抛光硅晶片的焊盘，其允许当晶片被抛光时使用晶片表面状态的光学检测。这是通过将固体均匀的聚合物片材的整个衬垫或其一部分构成的，不具有吸收或输送浆料颗粒的固有能力并且通过光学方法用于检测晶片表面状态的光束是透明的。对波长在190〜3500纳米范围内的光透明的聚合物适用于这些焊盘的构造。

7. 发明申请

WO1996015887A1 POLISHING PADS AND METHODS FOR THEIR MANUFACTURE 审中-公开
标题翻译：抛光垫及其制造方法
公开(公告)号：WO1996015887A1
公开(公告)日：1996-05-30
申请号：PCT/US1995015009
申请日：1995-11-22
申请人： RODEL, INC.
发明人： RODEL, INC. , COOK, Lee, Melbourne , JAMES, David, B. , JENKINS, Charles, William , REINHARDT, Heinz, F. , ROBERTS, John, V., H. , PILLAI, Raj, Raghav
IPC分类号： B27N03/08
CPC分类号： B24B37/26 , B24B37/042 , B24D3/28 , B24D18/0009 , B29C43/006 , B29C43/203
摘要： Polymer-based pads useful for polishing objects, particularly integrated circuits, having interconnected porosity which is uniform in all directions, and where the solid portion of the pad (9) consists of a uniform continuously interconnected polymer material of greater than 50 % of the gross volume of the article, are produced directly to final shape and dimension by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer and at a pressure in excess of 100 psi in a mold having the desired final pad dimensions. In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower melting point than the other. When pressure sintered at a temperature not to exceed the melting point of the lower melting powder, the increased stiffness afforded by incorporation of the higher melting polymer component gives improved mechanical strength to the sintered product.
摘要翻译：用于抛光物体，特别是集成电路的聚合物基垫，具有在所有方向上均匀的相互连接的孔隙度，并且垫（9）的固体部分由均匀连续相互连接的聚合物材料组成，其大于总毛重的50％制品的体积通过在高于玻璃化转变温度但不超过聚合物的熔点并且在超过100psi的压力下在模具中的压力烧结热塑性聚合物的粉末压块直接制成最终形状和尺寸具有所需的最终垫尺寸。在优选的方案中，使用两种聚合物粉末的混合物，其中一种聚合物的熔点比另一种低。当在不超过下熔融粉末的熔点的温度下进行压力烧结时，通过引入较高熔点的聚合物组分提供的增加的刚性使烧结产品具有改善的机械强度。

8. 发明申请

WO1995003252A1 OXIDE PARTICLES AND METHOD FOR PRODUCING THEM 审中-公开
标题翻译：氧化物颗粒及其生产方法
公开(公告)号：WO1995003252A1
公开(公告)日：1995-02-02
申请号：PCT/US1994008162
申请日：1994-07-20
申请人： RODEL, INC.
发明人： RODEL, INC. , WANG, Jiun-Fang
IPC分类号： C01F17/00
CPC分类号： B82Y30/00 , C01F17/0043 , C01P2002/60 , C01P2004/62 , C01P2004/64 , C01P2006/60 , C09K3/1409
摘要： The invention is a process for preparing chemically active solid oxide particles useful for polishing, composed primarily of CeO2, or CeO2 together with other oxides, comprising: (a) forming an aqueous solution comprised of a water soluble trivalent cerium salt and an oxidizing agent, and (b) aging said mixture in the liquid state for a time not less than 4 hours.
摘要翻译：本发明是一种制备用于抛光的化学活性固体氧化物颗粒的方法，主要由CeO 2或CeO 2与其它氧化物一起组成，其包括：（a）形成由水溶性三价铈盐和氧化剂组成的水溶液，和（b）将液体状态下的所述混合物老化不少于4小时。

9. 发明申请

WO1994004599A1 POLYMERIC SUBSTRATE WITH POLYMERIC MICROELEMENTS 审中-公开
标题翻译：包含中空聚合物的聚合物抛光垫
公开(公告)号：WO1994004599A1
公开(公告)日：1994-03-03
申请号：PCT/US1993007256
申请日：1993-08-02
申请人： RODEL, INC.
发明人： RODEL, INC. , REINHARDT, Heinz, F. , ROBERTS, John, V., H. , McCLAIN, Harry, George , JENSEN, Elmer, William , BUDINGER, William, D.
IPC分类号： C08J05/14
CPC分类号： B29C70/66 , B24B37/26 , B24B53/00 , B24B53/017 , B24D3/28 , B24D3/32 , B29C70/58 , B29L2031/736 , Y10S438/959 , Y10T428/24355 , Y10T428/24372 , Y10T428/24405 , Y10T428/24446 , Y10T428/24479 , Y10T428/24537 , Y10T428/2457 , Y10T428/24579 , Y10T428/249924 , Y10T428/249954 , Y10T428/249972 , Y10T428/25 , Y10T428/254 , Y10T428/26 , Y10T428/268 , Y10T428/2982 , Y10T428/31551 , Y10T428/31591
摘要： The present invention relates to an article of manufacture or polishing pad (10) for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix (14) impregnated with a plurality of polymeric microelements (16), each polymeric microelement having a void space (22) therein. The article has a work surface (18) and a subsurface proximate to the work surface. When the article is in contact with a working environment, polymeric microelements (16) at the work surface of the article are less rigid than polymeric elements embedded in the surface. As the work surface of the article is abraded during use, the work surface of the pad may be continuously regenerated. In alternative preferred embodiments, the work surface may further include a minitexture and/or a macrotexture.
摘要翻译：本发明涉及一种用于改变工件表面的制造制品或抛光垫（10），例如抛光或平面化半导体器件。该制品包括浸渍有多个聚合物微量元件（16）的聚合物基质（14），每个聚合微量元素在其中具有空隙空间（22）。该制品具有工作表面（18）和靠近工作表面的地下。当制品与工作环境接触时，制品的工作表面处的聚合物微元件（16）刚性低于嵌入在表面中的聚合物元件。由于在使用期间制品的工作表面被磨损，所以垫的工作表面可以被连续再生。在替代的优选实施例中，工作表面还可以包括微小的和/或宏观的纹理。

10. 发明申请

WO1998013218A1 COMPOSITION AND METHOD FOR POLISHING A COMPOSITE 审中-公开
标题翻译：用于抛光复合材料的组合物和方法
公开(公告)号：WO1998013218A1
公开(公告)日：1998-04-02
申请号：PCT/US1997017503
申请日：1997-09-26
申请人： RODEL, INC.
发明人： RODEL, INC. , HOSALI, Sharath, D. , SETHURAMAN, Anantha, R. , WANG, Jiun-Fang , COOK, Lee, Melboure
IPC分类号： B44C01/22
CPC分类号： C09K3/1463 , C03C19/00 , H01L21/31055
摘要： A composition is provided for polishing a composite comprised of silica and silicon nitride comprising: an aqueous medium, abrasive particles, a surfactant, and a compound which complexes with the silica and silicon nitride wherein the complexing agent has two or more functional groups each having a dissociable proton, the functional groups being the same or different.
摘要翻译：提供了一种用于抛光由二氧化硅和氮化硅组成的复合材料的组合物，包括：水性介质，磨料颗粒，表面活性剂和与二氧化硅和氮化硅复合的化合物，其中络合剂具有两个或更多个各自具有可离解质子，官能团相同或不同。

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