基本信息:
- 专利标题： POLISHING SYSTEM WITH UNDERWATER BERNOULLI PICKUP
- 专利标题（中）：抛光系统与水下BERNOULLI PICKUP
- 申请号：PCT/US1986001724 申请日：1986-08-25
- 公开(公告)号：WO1987002608A1 公开(公告)日：1987-05-07
- 发明人： MOTOROLA, INC. , CRONKHITE, Paul, W. , BOSLEY, Bruce, C. , JONES, James, H. , PATEL, Asit, G.
- 申请人： MOTOROLA, INC.
- 专利权人： MOTOROLA, INC.
- 当前专利权人： MOTOROLA, INC.
- 优先权： US793,818 19851101
- 主分类号： B24B07/22
- IPC分类号： B24B07/22
摘要：
An automatic polishing system (10) for polishing semiconductor material. A robot (20) and Bernoulli pickup (30) are used to retrieve polished wafers from an underwater unload station (62) which is located on a wafer polisher (60). The polished wafer is then deposited into a cassette which is located underwater.