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    • 1. 发明申请
    • OPTICAL ASSEMBLY WITH PASSIVE ALIGNMENT
    • 具有被动对准的光学组件
    • WO2016098030A1
    • 2016-06-23
    • PCT/IB2015/059700
    • 2015-12-16
    • TE CONNECTIVITY NEDERLAND B.V.
    • DORRESTEIN, AlexanderDUIS, JeroenTUIN, Jacobus
    • G02B6/42
    • G02B6/423G02B6/42G02B6/4231G02B6/4243G02B6/4245
    • An optical assembly (100) having x, y and z axes and comprising: (a) a first substrate (101) having a planar surface (106), a first wall (116) adjacent and substantially perpendicular to the planar surface, a first register surface (103) adjacent the first wall, at least one foundation (104) to receive an optical element (301) having a first optical axis at least partially along the z axis; (b) an opto-electrical device (110) having a top surface (111), an active area on the top surface having a second optical axis (112) normal to the top surface, and a first alignment element (114) defined on the top surface, the opto-electronic device mounted to the first wall (116) such that the first alignment element (114) contacts the first register surface (103) to position the opto-electronic device (110) on the first substrate (101) along at least one of the x or y axes with the second optical axis (112) parallel to the planar surface.
    • 一种具有x,y和z轴的光学组件(100),包括:(a)具有平坦表面(106)的第一基底(101),与平坦表面相邻且基本垂直的第一壁(116),第一 邻近第一壁的对准表面(103),至少一个基座(104),用于接收至少部分沿着z轴的具有第一光轴的光学元件(301) (b)具有顶表面(111)的光电器件(110),顶表面上的有源区域具有垂直于顶表面的第二光轴(112),以及第一对准元件(114),其定义在 所述顶表面,所述光电装置安装到所述第一壁(116),使得所述第一对准元件(114)接触所述第一对准表面(103)以将所述光电装置(110)定位在所述第一基板(101) )沿着所述x或y轴中的至少一个,所述第二光轴(112)平行于所述平面。
    • 5. 发明申请
    • FIBER OPTIC JACK WITH HIGH INTERFACE MICMATCH TOLERANCE
    • 具有高接口麦克风宽度的光纤插座
    • WO2011152981A1
    • 2011-12-08
    • PCT/US2011/036563
    • 2011-05-14
    • APPLIED MICRO CIRCUITS CORPORATIONZHOVNIROVSKY, IgorROY, Subhash
    • ZHOVNIROVSKY, IgorROY, Subhash
    • G02B6/42
    • G02B6/32G02B6/4206G02B6/4243G02B6/4244G02B6/4245G02B6/4249G02B6/4255G02B6/428G02B6/4281G02B6/4283G02B6/4284
    • A fiber optic connector jack is provided with a backcap processing module. The jack includes a lens housing having a lensed lid. A connector flange extends from the lensed lid top surface, shaped to selectively engage a plug connector housing. A microlens having a first surface is formed in the lensed lid bottom surface. A convex surface is formed in the lensed lid top surface to transceive light in a collimated beam with a plug optical interface. A backcap enclosure wall extends from the lensed lid bottom surface. The jack also includes a backcap processing module with a circuit substrate and an optical element. The optical element (e.g., a laser diode or photodiode) has an optical interface formed in a focal plane of the microlens to transceive light with the microlens first surface. An electrical connector and electrical cable selectively engages a printed circuit board with the circuit substrate.
    • 光纤连接器插座设有后盖处理模块。 千斤顶包括具有透镜盖的透镜壳体。 连接器凸缘从透镜盖顶表面延伸,成形为选择性地接合插头连接器壳体。 具有第一表面的微透镜形成在透镜盖底表面中。 在透镜盖顶表面中形成凸表面,以便在具有插头光学界面的准直光束中收发光。 后盖外壳壁从透镜盖底部表面延伸。 千斤顶还包括具有电路基板和光学元件的后盖处理模块。 光学元件(例如,激光二极管或光电二极管)具有形成在微透镜的焦平面中的光学界面,以便与微透镜第一表面收发光。 电连接器和电缆选择性地将印刷电路板与电路基板接合。
    • 6. 发明申请
    • FIBER-COUPLED OPTICAL DEVICE MOUNTED ON A CIRCUIT BOARD
    • 光纤耦合光学器件安装在电路板上
    • WO2007103836B1
    • 2008-08-28
    • PCT/US2007063245
    • 2007-03-03
    • XPONENT PHOTONICS INC
    • BLAUVELT HENRY ABENZONI ALBERT MBYRD GERALD C
    • G02B6/38
    • G02B6/4201G02B6/4239G02B6/424G02B6/4243G02B6/428H01L2224/48091H01L2924/00014
    • An optical apparatus comprises: an optical fiber, an optical device on a substrate, a circuit board, and an electrical connection therebetween. The substrate has a groove for positioning the fiber for optical coupling with the optical device. A proximal segment of the fiber is secured to the substrate in the groove. The substrate is mounted on the circuit board, and a second segment of the fiber is secured to the circuit board. A method comprises: mounting on the circuit board the substrate with the optical device; establishing the electrical connection; securing the proximal fiber segment to the substrate in the groove; and securing the second fiber segment to the circuit board. Multiple substrates can be secured to a single piece of circuit board material, which can be divided into individual circuit boards after establishing electrical connections and securing optical fibers to the corresponding substrates and to the circuit board material.
    • 一种光学装置,包括:光纤,基板上的光学器件,电路板以及它们之间的电连接。 基板具有用于定位光纤以与光学装置光学耦合的凹槽。 纤维的近端部分固定在凹槽中的基底上。 衬底安装在电路板上,并且光纤的第二段固定在电路板上。 一种方法包括:将具有光学装置的基板安装在电路板上; 建立电气连接; 将近端光纤段固定在槽中的基板上; 并将第二光纤段固定到电路板上。 多个基板可以固定到单块电路板材料上,在建立电连接并将光纤固定到相应的基板和电路板材料之后,可以将其分成单独的电路板。
    • 7. 发明申请
    • OPTICAL MODULE
    • 光学模块
    • WO2007023713A1
    • 2007-03-01
    • PCT/JP2006/316066
    • 2006-08-09
    • NEC ELECTRONICS CORPORATIONTAKETOMI, KowashiHATAKEYAMA, ItirouSASAKI, Junichi
    • TAKETOMI, KowashiHATAKEYAMA, ItirouSASAKI, Junichi
    • G02B6/42G02B6/00
    • G02B6/4201G02B6/4243G02B6/4269G02B6/4279
    • The present invention enables the reduction in module manufacturing cost and size and the significant increase in reliability and mass productivity. The optical module 200 of the present invention includes the peripheral IC 214 to be electrically connected to the substrate 106, the photoelectric device 212 having the circuit surfaces 212d1 and 212e1 that serve as at least one of a light receiving portion for receiving an optical signal and a light emitting portion for emitting an optical signal, and the optical fiber 202 that extends substantially parallel to the substrate 106 and is optically connected to the photoelectric device 212. The photoelectric device 212 is placed in such a way that the circuit surfaces 212d1 and 212e1 are substantially perpendicular to the extending direction of the optical fiber 202. The body of the photoelectric device 212 is covered with the film having the line 212b for electrically connecting the circuit surfaces 212d1 and 212e1 with the optical module terminal 210 over the area from the circuit surfaces 212d1 and 212e1 to the peripheral IC 214.
    • 本发明能够降低模块制造成本和尺寸,并且显着提高可靠性和批量生产率。 本发明的光学模块200包括电连接到基板106的外围IC 214,具有用作接收光信号的光接收部分中的至少一个的电路面212d1和212e1的光电装置212以及 用于发射光信号的发光部分和基本上平行于基板106延伸并与光电装置212光学连接的光纤202.光电装置212以这样的方式放置,使得电路面212d1和212e1 基本上垂直于光纤202的延伸方向。光电器件212的主体被具有线212b的膜覆盖,用于将电路表面212d1和212e1与光学模块端子210电连接在电路的区域上 表面212d1和212e1连接到外围IC 214。
    • 8. 发明申请
    • OPTOELECTRONIC FLIP-CHIP PACKAGE WITH OPTICAL WAVEGUIDE ACCOMODATED IN UPPER LAYERS OF SUBSTRATE BOARD
    • 带光电波片的光电芯片包装在底板上层
    • WO2006012195A1
    • 2006-02-02
    • PCT/US2005/022225
    • 2005-06-21
    • INTEL CORPORATIONGEORGE, Anna, M.
    • G02B6/42
    • G02B6/4203G02B6/4201G02B6/4214G02B6/4232G02B6/4243G02B6/4274G02B6/43H01L2224/16225H05K1/0274H05K3/28
    • An apparatus comprising a substrate comprising a base substrate, a conductive layer on the base substrate, and a solder resist layer on the conductive layer, a die including an optical area, the die being flip-chip bonded to the substrate, and an optical inter-connector optically coupled to the optical area and at least partially positioned between the die and the base substrate, the optical inter-connector positioned in a trench formed in the solder resist layer and the conductive layer. A process comprising providing a substrate comprising a base substrate, a conductive layer on the base substrate, and a solder resist layer on the conductive layer, forming a trench in the conductive layer and the solder resist layer, positioning a waveguide in the trench, and flip-chip bonding a die to the substrate, the die including an optical area, such that the optical area is optically coupled to the waveguide
    • 一种包括基底的装置,包括基底基底,基底基底上的导电层和导电层上的阻焊层,包括光学区域的管芯,将晶片倒装芯片接合到基片上, 连接器,光学耦合到光学区域并且至少部分地位于管芯和基底基板之间,光学连接器位于形成在阻焊层和导电层中的沟槽中。 一种方法,包括提供包括基底基板,基底基板上的导电层和导电层上的阻焊层的基板,在导电层和阻焊层中形成沟槽,将波导定位在沟槽中,以及 将裸片倒装芯片结合到基板,芯片包括光学区域,使得光学区域光学耦合到波导
    • 10. 发明申请
    • 光デバイス
    • 光学装置
    • WO2003096095A1
    • 2003-11-20
    • PCT/JP2003/005853
    • 2003-05-09
    • 住友電気工業株式会社
    • 小宮 健雄佐々木 隆藤村 康原口 章池知 麻紀
    • G02B6/42
    • G02B6/4246G02B6/3636G02B6/4212G02B6/4214G02B6/4243G02B6/4249G02B6/4251G02B6/4265G02B6/4286
    • 光デバイス1は基板2を有し、この基板2の上面部には、光ファイバテープ心線3の中間部分の被覆4を除去して露出された裸ファイバ5が固定されている。基板2には、横断溝8が裸ファイバのコア部5aを横断するように裸ファイバ5の軸線に対して斜めに形成されている。横断溝8内には、裸ファイバ5を伝送する信号光の一部を反射させる光学部材9が挿入されている。裸ファイバ5の上部には支持部材10が設けられ、この支持部材10の支持面10aには、光学部材9で反射した光を検出する光検出器11が設けられている。支持部材10の支持面10aは、基板2の上面に対して傾斜しており、これにより、各光検出器11の光入射面13は、基板2の上面に対して所定の角度で傾斜した構成となる。このような構成によれば、光検出器の受光偏波依存性を低減することができる光デバイスが実現される。
    • 一种光学装置(1),包括具有通过在光纤带芯(3)的中间部分去除涂层(4)而露出的裸露光纤(5)固定的上表面部分的基板(2)。 在基板(2)中,与裸光纤(5)的轴线倾斜地形成横槽(8),使得槽(8)横穿裸光纤的芯部(5a)。 用于反射在裸光纤(5)上透射的信号光的一部分的光学部件(9)插入到横向槽(8)中。 在裸光纤(5)的上方设有支撑部件(10),在支撑部件(10)的支撑面(10a)上设置用于检测从光学部件(9)反射的光的光检测器(11)。 支撑构件(10)的支撑面(10a)相对于基板(2)的上表面倾斜,从而每个光电检测器(11)的光入射面(13)相对于 基板(2)。 从而可以实现对光接收器的光偏振的依赖性降低的光学装置。