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1. 发明申请

WO2008032179A1 HOT TESTING OF SEMICONDUCTOR DEVICES 审中-公开
标题翻译：半导体器件的热测试
公开(公告)号：WO2008032179A1
公开(公告)日：2008-03-20
申请号：PCT/IB2007/002607
申请日：2007-09-11
申请人： XPEQT NV , ESCH VAN, Eddy
发明人： ESCH VAN, Eddy
IPC分类号： G01R31/28
CPC分类号： G01R31/2868 , G01R31/2862
摘要： A testing apparatus for testing of integrated circuit devices at elevated temperatures comprises hot belt 111 is operable to transport integrated circuits from a main production line into a hot chamber 121 and thence onto a test area 122 within the hot chamber 121 and a cold belt 112 operable to receive integrated circuits from the test area 122 and transport them back to the main production line. Both the hot and cold belts 111, 112 are indexed stepwise, the indexing distance being equal to the separation of the pockets provided for receiving integrated circuits. In the test area 122 are four vacuum chucks 131a-131d each operable to pick an integrated circuit from adjacent pockets on the hot belt 111 and place it on corresponding test heads 133a-133d (via a corresponding repositioning means 132a-132d ) for diagnostic testing at an elevated temperature. After testing, the vacuum chucks 131a-131d are operable to pick the integrated circuits from the corresponding test heads 133 a- 133d and place them in adjacent pockets on the cold belt 112.
摘要翻译：用于在升高的温度下测试集成电路器件的测试装置包括热带111可操作以将集成电路从主生产线输送到热室121中，然后到达热室121内的测试区域122和可操作的冷带112 从测试区域122接收集成电路并将其传送回主生产线。热带和冷带111,112均逐级地分度，分度距离等于为接收集成电路提供的口袋的分离。在测试区域122中有四个真空卡盘131a-131d，每个真空卡盘131a-131d可操作以从热带111上的相邻袋拾取集成电路，并将其放置在相应的测试头133a-133d上（经由相应的重新定位装置132a-132d）进行诊断测试在高温下。在测试之后，真空卡盘131a-131d可操作以从相应的测试头133a-133d拾取集成电路，并将它们放置在冷带112上的相邻凹穴中。

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