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1. 发明申请

WO2014106152A1 SYSTEMS AND METHODS FOR HANDLING SUBSTRATES AT BELOW DEW POINT TEMPERATURES 审中-公开
标题翻译：用于在下面的点温度处理基板的系统和方法
公开(公告)号：WO2014106152A1
公开(公告)日：2014-07-03
申请号：PCT/US2013/078218
申请日：2013-12-30
申请人： CASCADE MICROTECH, INC.
发明人： HIRSCHFELD, Botho , BECKER, Axel
IPC分类号： G01K13/12
CPC分类号： G01N25/66 , G01R31/00 , G01R31/2862
摘要： Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measurement chamber door configured to selectively isolate the internal volume of the measurement chamber. When a DUT, that is or is included on a substrate, is tested at a low temperature, systems and methods are selected to heat the substrate in a dry environment, at least partially isolated from the measurement chamber, to at least a temperature above the dew point and/or the frost point of the ambient environment.
摘要翻译：选择用于使用探针系统测试被测设备（DUT）的公开的系统和方法，以在低于探针系统周围环境环境露点的温度下测试DUT。探测系统包括被配置为隔离冷却干燥测试环境的测量室和被配置为选择性地隔离测量室的内部体积的测量室门。当在低温下测试被包括在基底上的DUT时，选择系统和方法以将至少部分与测量室隔离的干燥环境中的衬底加热至至少高于露点和/或周围环境的霜点。

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