专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2004083747A2 THERMAL STRATIFICATION TEST APPARATUS AND METHOD PROVIDING CYCLICAL AND STEADY-STATE STRATIFIED ENVIRONMENTS 审中-公开
标题翻译：热分析测试装置和提供循环和稳态分析环境的方法
公开(公告)号：WO2004083747A2
公开(公告)日：2004-09-30
申请号：PCT/US2004006049
申请日：2004-02-26
申请人： INTEL CORP
发明人： FENK C WALTER
IPC分类号： G01R31/28 , F25D
CPC分类号： G01R31/2862 , G01R31/2817 , G01R31/2874
摘要： A method and apparatus for a thermal stratification test providing cyclical and steady-state stratified environments. In order to test an electronic device, for example one having one or more levels of ball-grid-array interconnections, e.g., connecting a chip to a flip-chip substrate and connecting the flip-chip substrate to a printed circuit board of a device, an apparatus and method are provided to heat one side of the device while cooling the second side. In some embodiments, the process is then reversed to cool the first side and heat the second. Some embodiments repeat the cycle of heat-cool-heat-cool several times, and then perform functional tests of the electronic circuitry. In some embodiments, the functional tests are performed in one or more thermal-stratification configurations after cycling at more extreme thermal stratification setups. In some embodiments, a test that emphasizes solder creep is employed.
摘要翻译：提供循环和稳态分层环境的热分层测试的方法和装置。为了测试电子设备，例如具有一个或多个级别的球栅阵列互连的电子设备，例如将芯片连接到倒装芯片衬底并将倒装芯片衬底连接到器件的印刷电路板提供了一种在冷却第二侧的同时加热设备的一侧的装置和方法。在一些实施例中，然后反转该过程以冷却第一侧并加热第二侧。一些实施例重复热 - 冷却 - 冷却多次循环，然后执行电子电路的功能测试。在一些实施例中，在更极端的热分层设置循环之后，功能测试在一个或多个热分层结构中进行。在一些实施例中，采用强调焊料蠕变的测试。

IPRDB

热门服务

关于我们

友情链接

联系方式