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    • 2. 发明申请
    • VORRICHTUNG ZUR ISOLIERUNG UND ABDICHTUNG VON ELEKTRODENHALTERUNGEN IN CVD REAKTOREN
    • CVD反应器中绝缘和密封电极支架的装置
    • WO2017064011A1
    • 2017-04-20
    • PCT/EP2016/074230
    • 2016-10-10
    • WACKER CHEMIE AG
    • RENNSCHMID, DominikKRAUS, HeinzKUTZA, Christian
    • C23C16/24C01B33/035C23C16/44F16J15/10
    • C23C16/24C01B33/035C23C16/4409C23C16/4418
    • Die vorliegende Erfindung betrifft eine Vorrichtung zur Isolierung und Abdichtung von Elektrodenhalterungen in CVD Reaktoren, umfassend eine zur Aufnahme eines Filamentstabs geeignete Elektrode auf einer Elektrodenhalterung aus einem elektrisch leitfähigen Material, die in einer Aussparung einer Bodenplatte angebracht ist, wobei zwischen Elektrodenhalterung und Bodenplatte ein elektrisch isolierender Ring aus einem Werkstoff mit einer spezifischen Wärmeleitfähigkeit bei Raumtemperatur von 0,2 - 50 W/mK, einer Mindestbiegefestigkeit von größer als 120 MPa und einem spezifischen elektrischen Widerstand bei Raumtemperatur von größer als 10 9 Ωcm vorgesehen ist, wobei mindestens zwei ringförmige Dichtelemente zur Abdichtung zwischen Elektrodenhalterung und Bodenplatte vorhanden sind, wobei der elektrisch isolierende Ring oder die Elektrodenhalterung oder die Bodenplatte wenigstens eine Nut umfasst, in denen ein erstes Dichtelement fixiert ist, wobei wenigstens ein zweites nicht in einer Nut fixiertes Dichtelement zwischen elektrisch isolierendem Ring und Bodenplatte oder zwischen elektrisch isolierendem Ring und Elektrodenhalterung vorhanden ist..
    • 本发明涉及一种用于绝缘和密封CVD反应器中的电极支架的装置,该装置包括适合于在由导电材料制成并安装在底板的凹部中的电极支架上接收细丝棒的电极 ,其中,所述电极保持器和的材料形成基板之间的电绝缘环的特定WÄ rmeleitf在室温下承受能力为0.2〜50W / mK的,GR&ouml的最小弯曲强度;道路他大于120兆帕和电阻率 他9 欧姆 - 厘米为大于10,所述至少两个环形&oUML ;;以更大&oUML的室温;提供用于所述电极保持器和顶板,其中所述电绝缘环或电极支架或底板至少之间的密封ROAD形密封元件 包括其中具有第一密封件的凹槽 是固定的,其中在电绝缘环与底板之间或电绝缘环与电极夹持器之间存在至少第二非固定在槽密封元件中。
    • 4. 发明申请
    • APPARATUS FOR DEPOSITION INCLUDING A SOCKET
    • 用于沉积的装置,包括插座
    • WO2014011617A1
    • 2014-01-16
    • PCT/US2013/049690
    • 2013-07-09
    • HEMLOCK SEMICONDUCTOR CORPORATION
    • DEEG, MatthewHILGER, GrantHILLABRAND, David
    • C23C16/44
    • C23C16/4409C23C16/4418
    • A manufacturing apparatus (10) deposits material on a carrier body (14). The manufacturing apparatus includes a housing (16) defining a chamber. The housing defines an inlet (32) for introducing a deposition composition, which comprises the material or a precursor thereof, into the chamber. The housing also defines an outlet (34) through the housing for exhausting the deposition composition from the chamber. An electrode (46) is disposed through the housing with the electrode at least partially disposed within the chamber. A socket (52) has an exterior surface with a surface roughness RA value of less than or equal to 100 microns is connected to the electrode within the chamber for receiving the carrier body. A polishing the exterior surface of the socket is disposed on the exterior surface of the socket for promoting release of the material deposited on the carrier body from the socket to harvest the material from the socket.
    • 制造装置(10)将材料沉积在载体(14)上。 制造装置包括限定腔室的壳体(16)。 壳体限定用于将包含材料或其前体的沉积组合物引入腔室的入口(32)。 壳体还限定了通过壳体的出口(34),用于从腔室排出沉积组合物。 电极(46)穿过壳体设置,电极至少部分地设置在腔室内。 具有小于或等于100微米的表面粗糙度RA值的外表面的插座(52)连接到用于容纳载体的腔室内的电极。 抛光插座的外表面设置在插座的外表面上,以促进从插座上沉积在载体主体上的材料以从插座收获材料。
    • 7. 发明申请
    • SYSTEM AND METHOD FOR POLYCRYSTALLINE SILICON DEPOSITION
    • 多晶硅沉积系统与方法
    • WO2011116273A2
    • 2011-09-22
    • PCT/US2011028972
    • 2011-03-18
    • GT SOLAR INCQIN WENJUN
    • QIN WENJUN
    • C01B33/035B01J19/26C23C16/24C30B29/06
    • C23C16/45506C01B33/035C23C16/24C23C16/4418C23C16/45563C23C16/52
    • A method for making polycrystalline silicon from a gas comprising at least one silicon precursor compound is disclosed. The method can be effected from a gas comprising a polycrystalline silicon precursor compound in a chemical vapor deposition system by establishing a first flow pattern of the gas in a chemical vapor deposition reaction chamber, promoting reaction of at least a portion of the at least one precursor compound from the gas having the first flow pattern into polycrystalline silicon, establishing a second flow pattern of the gas in the reaction chamber, and promoting reaction of at least a portion of the at least one precursor compound from the gas having the second flow pattern into polycrystalline silicon. The chemical vapor deposition system can comprise a gas source comprising a gas with at least one precursor compound; a reaction chamber at least partially defined by a base plate and a bell jar; a first nozzle group disposed in one of the base plate and the bell jar, the first nozzle group fluidly connected to the gas source through a first manifold and a first flow regulator; a second nozzle group including a plurality of nozzles disposed in one of the base plate and the bell jar, the plurality of nozzles fluidly connected to the gas source through a second manifold and a second flow regulator.
    • 公开了一种从包含至少一种硅前体化合物的气体制造多晶硅的方法。 该方法可以通过在化学气相沉积反应室中形成气体的第一流动模式,在化学气相沉积系统中由包括多晶硅前体化合物的气体进行,促进至少一部分前体的反应 从具有第一流动模式的气体到多晶硅的化合物,在反应室中建立气体的第二流动模式,并促进至少一部分来自具有第二流动模式的气体的至少一部分前体化合物与第二流动模式的反应 多晶硅。 化学气相沉积系统可以包括气体源,其包含具有至少一种前体化合物的气体; 至少部分地由基板和钟罩限定的反应室; 设置在基板和钟罩之一中的第一喷嘴组,通过第一歧管和第一流量调节器流体连接到气体源的第一喷嘴组; 第二喷嘴组,包括设置在基板和钟罩之一中的多个喷嘴,多个喷嘴通过第二歧管和第二流量调节器流体地连接到气体源。
    • 9. 发明申请
    • MANUFACTURING APPARATUS FOR DEPOSITING A MATERIAL AND AN ELECTRODE FOR USE THEREIN
    • 用于沉积材料和电极的制造设备
    • WO2011044457A1
    • 2011-04-14
    • PCT/US2010/051970
    • 2010-10-08
    • HEMLOCK SEMICONDUCTOR CORPORATIONHILLABRAND, DavidMCCOY, Keith
    • HILLABRAND, DavidMCCOY, Keith
    • C23C16/44
    • C23C16/4404C01B33/035C23C16/4418
    • A manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus are provided. The manufacturing apparatus includes a housing that defines a chamber. The housing also defines an inlet for introducing a gas into the chamber and an outlet for exhausting the gas from the chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber. The electrode has an exterior surface. The exterior surface has a contact region that is adapted to contact a socket. A contact region coating is disposed on the contact region of the electrode for maintaining electrical conductivity between the electrode and the socket. The contact region coating has an electrical conductivity of at least 7x10 6 Siemens/meter at room temperature and a greater wear resistance than nickel as measured in mm 3 /N*m.
    • 提供了一种用于在载体上沉积材料的制造装置和用于制造装置的电极。 制造装置包括限定腔室的壳体。 壳体还限定用于将气体引入腔室的入口和用于从腔室排出气体的出口。 至少一个电极通过壳体设置,电极至少部分地设置在腔室内。 电极具有外表面。 外表面具有适于接触插座的接触区域。 接触区域涂层设置在电极的接触区域上,以保持电极和插座之间的导电性。 接触区域涂层在室温下的电导率至少为7×10 6西门子/米,并且具有比以mm 3 / N * m测量的镍更大的耐磨性。
    • 10. 发明申请
    • CVD APPARATUS WITH ELECTRODE
    • CVD装置与电极
    • WO2011044441A1
    • 2011-04-14
    • PCT/US2010/051945
    • 2010-10-08
    • HEMLOCK SEMICONDUCTOR CORPORATIONHILLABRAND, DavidMCCOY, Keith
    • HILLABRAND, DavidMCCOY, Keith
    • C23C16/44C01B33/035
    • C23C16/4418C01B33/035C23C16/4404
    • A manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus are provided. The manufacturing apparatus includes a housing that defines a chamber. The housing also defines an inlet for introducing a gas into the chamber and an outlet for exhausting the gas from the chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber. The electrode has an exterior surface. A first exterior coating having an electrical conductivity of at least 7x10 6 Siemens/meter at room temperature is disposed on the exterior surface of the electrode. A second exterior coating different from the first exterior coating is disposed on the first exterior coating. A power supply device is coupled to the electrode.
    • 提供了一种用于在载体上沉积材料的制造装置和用于制造装置的电极。 制造装置包括限定腔室的壳体。 壳体还限定用于将气体引入腔室的入口和用于从腔室排出气体的出口。 至少一个电极通过壳体设置,电极至少部分地设置在腔室内。 电极具有外表面。 在电极的外表面上设置有室温下至少为7×10 6西门子/米的电导率的第一外涂层。 与第一外部涂层不同的第二外部涂层设置在第一外部涂层上。 电源装置耦合到电极。